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    • 8. 发明授权
    • High-voltage NMOS-transistor and associated production method
    • 高压NMOS晶体管及相关生产方法
    • US07898030B2
    • 2011-03-01
    • US11659512
    • 2005-08-05
    • Martin KnaippJong Mun Park
    • Martin KnaippJong Mun Park
    • H01L29/66
    • H01L29/66681H01L29/0634H01L29/0878H01L29/1095H01L29/42368H01L29/7816
    • An n-conductively doped source region (2) in a deep p-conducting well (DP), a channel region (13), a drift region (14) formed by a counterdoping region (12), preferably below a gate field plate (6) insulated by a gate field oxide (8), and an n-conductively doped drain region (3) arranged in a deep n-conducting well (DN) are arranged in this order at a top side of a substrate (1). A lateral junction (11) between the deep p-conducting well (DP) and the deep n-conducting well (DN) is present in the drift path (14) in the vicinity of the drain region (3) so as to avoid a high voltage drop in the channel region (13) during the operation of the transistor and to achieve a high threshold voltage and also a high breakdown voltage between source and drain.
    • 深导电阱(DP)中的n导电掺杂源区(2),沟道区(13),由反掺杂区(12)形成的漂移区(14),优选地在栅极场板 6),栅极氧化物(8)绝缘,并且布置在深导电阱(DN)中的n导电掺杂漏极区域(3)依次布置在衬底(1)的顶侧。 深沟道阱(DP)和深导通阱(DN)之间的横向结(11)存在于漏极区域(3)附近的漂移路径(14)中,以避免 在晶体管工作期间,沟道区域(13)中的高电压降,以及在源极和漏极之间实现高阈值电压以及高的击穿电压。