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    • 8. 发明申请
    • METHODS FOR DEFECT TESTING OF EXTERNALLY ACCESSIBLE INTEGRATED CIRCUIT INTERCONNECTS
    • 外部可访问集成电路互连的缺陷测试方法
    • US20110273185A1
    • 2011-11-10
    • US13183931
    • 2011-07-15
    • Yoshinori FujiwaraMasayoshi Nomura
    • Yoshinori FujiwaraMasayoshi Nomura
    • G01R31/04
    • G01R31/31715G01R31/3004G01R31/31717G11C29/02G11C29/022G11C29/1201G11C29/56G11C2029/5006
    • Apparatus and methods provide built-in testing enhancements in integrated circuits. These testing enhancements permit, for example, continuity testing to pads and/or leakage current testing for more than one pad. The disclosed techniques may permit more thorough testing of integrated circuits at the die level, thereby reducing the number of defective devices that are further processed, saving both time and money. In one embodiment, a test signal is routed in real time through a built-in path that includes an input buffer for a pad under test. This permits testing of continuity between the pad and the input buffer. An output buffer can also be tested as applicable. In another embodiment, two or more pads of a die are electronically coupled together such that leakage current testing applied by a probe connected to one pad can be used to test another pad.
    • 装置和方法在集成电路中提供内置的测试增强功能。 这些测试增强允许例如对多于一个焊盘的焊盘和/或泄漏电流测试的连续性测试。 所公开的技术可以允许在芯片级别对集成电路进行更彻底的测试,从而减少进一步处理的缺陷设备的数量,从而节省时间和金钱。 在一个实施例中,测试信号通过内置路径实时路由,该内置路径包括用于待测焊盘的输入缓冲器。 这允许测试焊盘和输入缓冲器之间的连续性。 输出缓冲区也可以根据需要进行测试。 在另一个实施例中,管芯的两个或更多个焊盘电子耦合在一起,使得由连接到一个焊盘的探头施加的泄漏电流测试可用于测试另一焊盘。
    • 10. 发明授权
    • Systems and methods for defect testing of externally accessible integrated circuit interconnects
    • 外部可访问的集成电路互连的缺陷测试系统和方法
    • US07990163B2
    • 2011-08-02
    • US12570138
    • 2009-09-30
    • Yoshinori FujiwaraMasayoshi Nomura
    • Yoshinori FujiwaraMasayoshi Nomura
    • G01R31/02
    • G01R31/31715G01R31/3004G01R31/31717G11C29/02G11C29/022G11C29/1201G11C29/56G11C2029/5006
    • Apparatus and methods provide built-in testing enhancements in integrated circuits. These testing enhancements permit, for example, continuity testing to pads and/or leakage current testing for more than one pad. The disclosed techniques may permit more thorough testing of integrated circuits at the die level, thereby reducing the number of defective devices that are further processed, saving both time and money. In one embodiment, a test signal is routed in real time through a built-in path that includes an input buffer for a pad under test. This permits testing of continuity between the pad and the input buffer. An output buffer can also be tested as applicable. In another embodiment, two or more pads of a die are electronically coupled together such that leakage current testing applied by a probe connected to one pad can be used to test another pad.
    • 装置和方法在集成电路中提供内置的测试增强功能。 这些测试增强允许例如对多于一个焊盘的焊盘和/或泄漏电流测试的连续性测试。 所公开的技术可以允许在芯片级别对集成电路进行更彻底的测试,从而减少进一步处理的缺陷设备的数量,从而节省时间和金钱。 在一个实施例中,测试信号通过内置路径实时路由,该内置路径包括用于待测焊盘的输入缓冲器。 这允许测试焊盘和输入缓冲器之间的连续性。 输出缓冲区也可以根据需要进行测试。 在另一个实施例中,管芯的两个或更多焊盘电耦合在一起,使得由连接到一个焊盘的探头施加的泄漏电流测试可用于测试另一焊盘。