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    • 1. 发明申请
    • HEATSINK MOUNTING SYSTEM
    • 散热器安装系统
    • US20100157539A1
    • 2010-06-24
    • US12342273
    • 2008-12-23
    • Fang WangThierry Sin Yan TooJim MooreMong Hu
    • Fang WangThierry Sin Yan TooJim MooreMong Hu
    • H05K7/20
    • H01L23/4093H01L2924/0002H01L2924/00
    • A heatsink system (10) is provided for containing and engaging a heatsink (16) against a heat generating component, typically an IC chip (18). The system (10) includes a rectangular integrally formed resilient frame (12) defining a cavity (26) in which the heatsink (16) is contained. The frame (12) includes a pair of opposed lateral sides (30) and a pair of opposing gripping sides (28) with L-shaped corner blocks (32) depending from the intersections thereof. The gripping sides (28) include centrally positioned grip handles (38) extending upward and grip blocks (34) depending therefrom, each grip block (34) having a grip tongue (36) at the lower extent thereof extending inward into the cavity (26). Inward pressure on the grip handles (38) forces the grip tongues (36) outward to release objects captured thereby.
    • 提供散热系统(10),用于将散热器(16)容纳和接合到发热部件(通常为IC芯片)上。 系统(10)包括限定空腔(26)的矩形整体形成的弹性框架(12),其中容纳散热器(16)。 框架(12)包括一对相对的侧面(30)和一对相对的夹持侧面(28),其具有从其相交处悬垂的L形角块(32)。 抓握侧面(28)包括向上延伸的中心定位的把手(38)和从其悬挂的夹持块(34),每个抓握块(34)在其下部延伸的向下延伸到空腔(26) )。 握柄(38)上的向内压力迫使把手舌片(36)向外释放由此捕获的物体。
    • 3. 发明申请
    • HEATSINK MOUNTING SYSTEM
    • 散热器安装系统
    • US20100321894A1
    • 2010-12-23
    • US12870605
    • 2010-08-27
    • Fang WangThierry Sin Yan TooJim MooreMong Hu
    • Fang WangThierry Sin Yan TooJim MooreMong Hu
    • H05K7/20F16B2/22
    • H01L23/4093H01L2924/0002H01L2924/00
    • A heatsink mounting system (10) is provided for containing and engaging a heatsink (16) against a heat generating component, typically an IC chip (18). The system (10) is includes a rectangular integrally formed resilient frame (12) defining a cavity (26) in which the heatsink (16) is contained. The frame (12) includes a pair of opposed lateral sides (30) and a pair of opposing gripping sides (28) with L-shaped corner blocks (32) depending from the intersections thereof. The gripping sides (28) include centrally positioned grip handles (38) with curved handle posts (39) extending upward and grip blocks (34) depending therefrom, each grip block (34) having a grip tongue (36) at the lower extent thereof extending inward into the cavity (26). Inward pressure on the grip handles (38) forces the grip tongues (36) outward to release objects captured thereby.
    • 提供散热器安装系统(10),用于容纳和接合散热器(16)抵靠发热部件,通常为IC芯片(18)。 系统(10)包括限定空腔(26)的矩形整体形成的弹性框架(12),其中容纳散热器(16)。 框架(12)包括一对相对的侧面(30)和一对相对的夹持侧面(28),其具有从其相交处悬垂的L形角块(32)。 抓握侧面(28)包括居中定位的把手(38),其具有向上延伸的弯曲的手柄柱(39)和从其悬挂的夹持块(34),每个夹紧块(34)在其下部的一个处有一个把手舌片(36) 向内延伸到空腔(26)内。 握柄(38)上的向内压力迫使把手舌片(36)向外释放由此捕获的物体。
    • 4. 发明授权
    • Heatsink mounting system
    • 散热片安装系统
    • US07848107B2
    • 2010-12-07
    • US12342273
    • 2008-12-23
    • Fang WangThierry Sin Yan TooJim MooreMong Hu
    • Fang WangThierry Sin Yan TooJim MooreMong Hu
    • H05K7/20
    • H01L23/4093H01L2924/0002H01L2924/00
    • A heatsink system (10) is provided for containing and engaging a heatsink (16) against a heat generating component, typically an IC chip (18). The system (10) includes a rectangular integrally formed resilient frame (12) defining a cavity (26) in which the heatsink (16) is contained. The frame (12) includes a pair of opposed lateral sides (30) and a pair of opposing gripping sides (28) with L-shaped corner blocks (32) depending from the intersections thereof. The gripping sides (28) include centrally positioned grip handles (38) extending upward and grip blocks (34) depending therefrom, each grip block (34) having a grip tongue (36) at the lower extent thereof extending inward into the cavity (26). Inward pressure on the grip handles (38) forces the grip tongues (36) outward to release objects captured thereby.
    • 提供散热系统(10),用于将散热器(16)容纳和接合到发热部件(通常为IC芯片)上。 系统(10)包括限定空腔(26)的矩形整体形成的弹性框架(12),其中容纳散热器(16)。 框架(12)包括一对相对的侧面(30)和一对相对的夹持侧面(28),其具有从其相交处悬垂的L形角块(32)。 抓握侧面(28)包括向上延伸的中心定位的把手(38)和从其悬挂的夹持块(34),每个抓握块(34)在其下部延伸的向下延伸到空腔(26) )。 握柄(38)上的向内压力迫使把手舌片(36)向外释放由此捕获的物体。
    • 6. 发明授权
    • Heatsink mounting system
    • 散热片安装系统
    • US08274793B2
    • 2012-09-25
    • US12870605
    • 2010-08-27
    • Fang WangThierry Sin Yan TooJim MooreMong Hu
    • Fang WangThierry Sin Yan TooJim MooreMong Hu
    • H05K7/20
    • H01L23/4093H01L2924/0002H01L2924/00
    • A heatsink mounting system (10) is provided for containing and engaging a heatsink (16) against a heat generating component, typically an IC chip (18). The system (10) is includes a rectangular integrally formed resilient frame (12) defining a cavity (26) in which the heatsink (16) is contained. The frame (12) includes a pair of opposed lateral sides (30) and a pair of opposing gripping sides (28) with L-shaped corner blocks (32) depending from the intersections thereof. The gripping sides (28) include centrally positioned grip handles (38) with curved handle posts (39) extending upward and grip blocks (34) depending therefrom, each grip block (34) having a grip tongue (36) at the lower extent thereof extending inward into the cavity (26). Inward pressure on the grip handles (38) forces the grip tongues (36) outward to release objects captured thereby.
    • 提供散热器安装系统(10),用于容纳和接合散热器(16)抵靠发热部件,通常为IC芯片(18)。 系统(10)包括限定空腔(26)的矩形整体形成的弹性框架(12),其中容纳散热器(16)。 框架(12)包括一对相对的侧面(30)和一对相对的夹持侧面(28),其具有从其相交处悬垂的L形角块(32)。 抓握侧面(28)包括居中定位的把手(38),其具有向上延伸的弯曲的手柄柱(39)和从其悬挂的夹持块(34),每个夹紧块(34)在其较低的范围具有夹紧舌片(36) 向内延伸到空腔(26)内。 握柄(38)上的向内压力迫使把手舌片(36)向外释放由此捕获的物体。