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    • 3. 发明申请
    • BIPOLAR TRANSISTOR AND METHOD FOR MANUFACTURING THE SAME
    • 双极晶体管及其制造方法
    • US20130092939A1
    • 2013-04-18
    • US13543161
    • 2012-07-06
    • Nam Joo KIM
    • Nam Joo KIM
    • H01L29/737H01L21/331H01L29/73
    • H01L29/66272H01L29/0821H01L29/732
    • Disclosed are example bipolar transistors capable of reducing the area of a collector, reducing the distance between a base and a collector, and/or reducing the number of ion implantation processes. A bipolar transistor may includes a trench formed by etching a portion of a semiconductor substrate. A first collector may be formed on the inner wall of the trench. A second collector may be formed inside the semiconductor substrate in the inner wall of the trench. A first isolation film may be formed on the sidewall of the first collector. An intrinsic base may be connected to the third collector. An extrinsic base may be formed on the intrinsic base and inside the first isolation film. A second isolation film may be formed on the inner wall of the extrinsic base. An emitter may be formed by burying a conductive material inside the second isolation film.
    • 公开了能够减小集电极的面积,减小基极和集电极之间的距离和/或减少离子注入过程的数量的示例双极晶体管。 双极晶体管可以包括通过蚀刻半导体衬底的一部分而形成的沟槽。 可以在沟槽的内壁上形成第一集电器。 可以在沟槽的内壁中的半导体衬底的内部形成第二集电体。 可以在第一收集器的侧壁上形成第一隔离膜。 内部基座可以连接到第三收集器。 可以在本征基底和第一隔离膜内部形成非本征碱。 可以在外基的内壁上形成第二隔离膜。 可以通过在第二隔离膜内部埋入导电材料来形成发射极。
    • 7. 发明申请
    • CAPACITOR AND METHOD OF MANUFACTURING THE SAME
    • 电容器及其制造方法
    • US20090166698A1
    • 2009-07-02
    • US12344490
    • 2008-12-27
    • Nam-Joo Kim
    • Nam-Joo Kim
    • H01L21/02H01L29/92
    • H01L27/0805H01L28/40H01L29/94
    • A capacitor with a mixed structure of a Metal Oxide Semiconductor (MOS) capacitor and a Poly-silicon Insulator Poly-silicon (PIP) capacitor includes a substrate and a diffusion junction region formed over the substrate. A high concentration diffusion junction region may be formed in a portion of the diffusion junction region. An oxide layer may be formed over the substrate, the oxide layer having an opening that exposes a portion of the high concentration diffusion junction region. A first polysilicon plate may be formed over a portion of the oxide layer and spaced from the opening, and a nitride layer may be formed over a portion of the first polysilicon plate. A sidewall may be formed over a side of the first polysilicon layer, over a side of the nitride layer, and over a portion of the oxide layer between the side of the polysilicon layer and the opening. A second polysilicon plate may be formed over the nitride layer, over the sidewall, and over the high concentration diffusion junction region.
    • 具有金属氧化物半导体(MOS)电容器和多晶硅绝缘体多晶硅(PIP)电容器的混合结构的电容器包括衬底和形成在衬底上的扩散结区域。 可以在扩散接合区域的一部分中形成高浓度扩散连接区域。 可以在衬底上形成氧化物层,氧化物层具有暴露高浓度扩散结区的一部分的开口。 可以在氧化物层的一部分上形成第一多晶硅板并与开口间隔开,并且可以在第一多晶硅板的一部分上形成氮化物层。 侧壁可以形成在第一多晶硅层的一侧上,在氮化物层的一侧上,以及在多晶硅层的侧面和开口之间的氧化物层的一部分上方形成。 第二多晶硅板可以形成在氮化物层上方,侧壁上方,以及高浓度扩散结区域上方。