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    • 9. 发明申请
    • METHOD, SYSTEM AND APPARATUS FOR AUTOMATIC GAIN CONTROL IN DIRECT-CONVERSION RECEIVER
    • 用于直接转换接收机自动增益控制的方法,系统和设备
    • US20150349822A1
    • 2015-12-03
    • US14727494
    • 2015-06-01
    • PERASO TECHNOLOGIES INC.
    • Grigori TEMKINECraig FARNSWORTHArash TABIBIAZARAlexander TOMKINSBradley Robert LYNCH
    • H04B1/12
    • H04B1/123H03G1/00H03G3/30H03G3/3052H03G3/3078
    • A wireless receiver automatic gain control system includes: a coarse amplification subsystem that receives and amplifies a carrier-modulated signal; a demodulator that generates a baseband signal from the amplified carrier-modulated signal; a fine amplification subsystem that amplifies the baseband signal; and a controller connected to the amplification subsystems. The controller: obtains a unified gain value for the amplification subsystems; based on the unified gain value, selects (i) one of a plurality of coarse gain values defining a set of coarse gain steps each spanning a plurality of unified gain steps, and (ii) one of a plurality of fine gain values defining a set of fine gain steps each spanning a single unified gain step; and sets (i) the gain of the coarse amplification subsystem to the selected coarse gain value, and (ii) the gain of the fine amplification subsystem to the selected fine gain value.
    • 无线接收机自动增益控制系统包括:粗放大子系统,其接收并放大载波调制信号; 解调器,其从放大的载波调制信号产生基带信号; 一个放大基带信号的精细放大子系统; 以及连接到放大子系统的控制器。 控制器:获得放大子系统的统一增益值; 基于统一增益值,选择(i)定义一组跨越多个统一增益步长的粗增益步长的多个粗增益值中的一个,以及(ii)定义集合的多个细增益值之一 每个跨越单个统一增益步长的精细增益步骤; 并将(i)粗放大子系统的增益设定为所选粗增益值,以及(ii)精细放大子系统对所选精细增益值的增益。
    • 10. 发明申请
    • RF SYSTEM-IN-PACKAGE WITH QUASI-COAXIAL COPLANAR WAVEGUIDE TRANSITION
    • 具有相同共振波导转换的射频系统包装
    • US20150270616A1
    • 2015-09-24
    • US14217682
    • 2014-03-18
    • Peraso Technologies, Inc.
    • Saman JafarlouMohammad Fakharzadeh
    • H01Q13/02H01P5/00H01P11/00H01P3/02
    • H01Q13/02H01P5/107H01Q13/0283Y10T29/49018Y10T29/49165
    • An IC package includes an IC die disposed at a first surface of a substrate, which includes a signal via extending between first and second metal layers. The first metal layer is proximate to the first surface and includes a first coplanar waveguide. The first coplanar waveguide has a first signal line coupling a die bump to the signal via and has a first ground plane co-planar with the first signal line. The second metal layer is proximate to a second surface and includes a second coplanar waveguide that has a second signal line coupling the signal via to a launcher element and has a second ground plane co-planar with the second signal line. The IC package further includes a waveguide channel aperture comprising a region surrounding the launcher element and which is substantially devoid of conductive material and a via fence disposed at a perimeter of the first region.
    • IC封装包括设置在基板的第一表面处的IC管芯,其包括在第一和第二金属层之间延伸的信号通路。 第一金属层靠近第一表面并且包括第一共面波导。 第一共面波导具有将管芯凸起与信号通孔相连的第一信号线,并具有与第一信号线共面的第一接地平面。 第二金属层靠近第二表面并且包括第二共面波导,其具有将信号通孔耦合到发射元件的第二信号线,并具有与第二信号线共面的第二接地平面。 IC封装还包括波导沟道孔,该波导通道孔包括围绕发射器元件的区域,并且其基本上不含导电材料,并且布置在第一区域周边的通孔栅栏。