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1. 发明授权

US08381993B2 Method for realizing a dual interface IC card 有权
标题翻译：实现双接口IC卡的方法
公开(公告)号：US08381993B2
公开(公告)日：2013-02-26
申请号：US12875329
申请日：2010-09-03
申请人： Franco Antonio Tolentino , Paolo Frallicciardi
发明人： Franco Antonio Tolentino , Paolo Frallicciardi
IPC分类号： G06K19/06
CPC分类号： G06K19/07749 , G06K19/077 , G06K19/07745 , G06K19/0775 , G06K19/07769 , H01L2224/48091 , H01L2224/48228 , Y10T29/49124 , H01L2924/00014
摘要： A method for realizing a dual interface IC card includes arranging a plastic support having a hole or a recess for housing a micro module, and housing in the IC card an antenna having at least one first and one second terminal or pad for connection to the micro module arranged in the recess. The method also includes distributing a soldering paste on the at least one first and one second pad, so as to form a first and a second contact conductive bump with electric connection contacts of the micro module, and distributing, along the whole perimeter of the micro module or of the recess, a layer of non conductive glue. The method further includes positioning the micro module in the recess with the contacts axially aligned to the terminal of the antenna, and executing a reflow of the soldering paste to form the first and second conductive bump.
摘要翻译：实现双接口IC卡的方法包括布置具有用于容纳微模块的孔或凹部的塑料支撑件，并且在IC卡中容纳具有至少一个第一和第二端子或垫的天线，用于连接到微型模块布置在凹槽中。该方法还包括在至少一个第一和第二垫上分布焊膏，以便形成具有微模块的电连接触点的第一和第二接触导电凸块，并且沿微小的整个周边分布模块或凹槽，一层非导电胶。该方法还包括将微型模块定位在凹部中，其中触点轴向对准天线的端子，并且执行焊膏的回流以形成第一和第二导电凸块。

2. 发明申请

US20070152072A1 IC CARD WITH IMPROVED PLATED MODULE 审中-公开
标题翻译：具有改进的模块的IC卡
公开(公告)号：US20070152072A1
公开(公告)日：2007-07-05
申请号：US11618413
申请日：2006-12-29
申请人： Paolo Frallicciardi , Edoardo Visconti
发明人： Paolo Frallicciardi , Edoardo Visconti
IPC分类号： G06K19/06
CPC分类号： G06K19/07745 , G06K19/07743 , G06K19/0775 , G06K19/07769 , H01L2224/48091 , H01L2224/48228 , H01L2924/00014
摘要： An IC card includes a plated or protective module including a printed circuit having a plurality of conductive areas, delimited by a network of insulating channels, for covering an integrated circuit chip, a plastic support with a recess intended to host the plated module and the integrated circuit chip, with at least some of the conductive areas connected to corresponding contact points on the integrated circuit chip. A plurality of extended areas are linked to a corresponding conductive areas by one or more bridges. A couple of advanced extended areas form a rounded border of the plated module. Advanced extended areas are linked to conductive areas not connected to contact points. Advanced extended areas wrap around the extended areas and form the opposite rounded sides of the plated module.
摘要翻译：一种IC卡包括一个电镀或保护模块，该电路或保护模块包括具有多个导电区域的印刷电路，该导电区域由绝缘通道网络限定，用于覆盖集成电路芯片，具有用于承载电镀模块的凹槽的塑料支架和集成电路芯片，其中至少一些导电区域连接到集成电路芯片上的相应接触点。多个延伸区域通过一个或多个桥连接到相应的导电区域。几个先进的扩展区域形成镀层模块的圆形边框。先进的扩展区域与未连接到接触点的导电区域相连。先进的扩展区域围绕扩展区域缠绕并形成电镀模块的相对的圆形侧面。

3. 发明申请

US20110084145A1 METHOD FOR REALIZING A DUAL INTERFACE IC CARD 有权
标题翻译：实现双接口IC卡的方法
公开(公告)号：US20110084145A1
公开(公告)日：2011-04-14
申请号：US12875329
申请日：2010-09-03
申请人： Franco Antonio TOLENTINO , Paolo Frallicciardi
发明人： Franco Antonio TOLENTINO , Paolo Frallicciardi
IPC分类号： G06K19/077 , H05K3/00
CPC分类号： G06K19/07749 , G06K19/077 , G06K19/07745 , G06K19/0775 , G06K19/07769 , H01L2224/48091 , H01L2224/48228 , Y10T29/49124 , H01L2924/00014
摘要： A method for realizing a dual interface IC card includes arranging a plastic support having a hole or a recess for housing a micro module, and housing in the IC card an antenna having at least one first and one second terminal or pad for connection to the micro module arranged in the recess. The method also includes distributing a soldering paste on the at least one first and one second pad, so as to form a first and a second contact conductive bump with electric connection contacts of the micro module, and distributing, along the whole perimeter of the micro module or of the recess, a layer of non conductive glue. The method further includes positioning the micro module in the recess with the contacts axially aligned to the terminal of the antenna, and executing a reflow of the soldering paste to form the first and second conductive bump.
摘要翻译：实现双接口IC卡的方法包括布置具有用于容纳微模块的孔或凹部的塑料支撑件，并且在IC卡中容纳具有至少一个第一和第二端子或垫的天线，用于连接到微型模块布置在凹槽中。该方法还包括在至少一个第一和第二垫上分配焊膏，以形成具有微模块的电连接触点的第一和第二接触导电凸块，并沿着微型模块的整个周边分布模块或凹槽，一层非导电胶。该方法还包括将微型模块定位在凹部中，其中触点轴向对准天线的端子，并且执行焊膏的回流以形成第一和第二导电凸块。

4. 外观设计

USD567244S1 Module for an IC card 有权
标题翻译： IC卡模块
公开(公告)号：USD567244S1
公开(公告)日：2008-04-22
申请号：US29247632
申请日：2006-06-29
申请人： Paolo Frallicciardi , Edoardo Visconti
设计人： Paolo Frallicciardi , Edoardo Visconti

5. 发明授权

US07719846B2 Plated module for an IC card 有权
标题翻译：用于IC卡的电镀模块
公开(公告)号：US07719846B2
公开(公告)日：2010-05-18
申请号：US11618364
申请日：2006-12-29
申请人： Paolo Frallicciardi , Edoardo Visconti
发明人： Paolo Frallicciardi , Edoardo Visconti
IPC分类号： H05K1/14
CPC分类号： G06K19/07743 , G06K19/07728 , G06K19/07747 , H01L2224/48091 , H01L2224/48228 , H01L2924/00014
摘要： A plated module is for an IC card and includes a printed circuit having a plurality of conductive areas, delimited by a network of insulating channels, for covering an integrated circuit chip intended to be hosted in a recess of a plastic support of the IC card. At least some of the conductive areas are connected to a corresponding contact points of the integrated circuit chip. At least some of the conductive areas are linked to corresponding extended areas by one or more bridges. The conductive areas are separated from the extended areas by an insulating channel crossed by the bridges. The insulating channels surround the conductive areas as a protection frame for the contact points. At least a major side of at least one of the conductive areas may be curved. Several of the advanced extended areas form a rounded border of the plated module.
摘要翻译：电镀模块用于IC卡，并且包括印刷电路，该印刷电路具有由绝缘通道网络界定的多个导电区域，用于覆盖旨在托置在IC卡的塑料支撑件的凹部中的集成电路芯片。至少一些导电区域连接到集成电路芯片的相应接触点。至少一些导电区域通过一个或多个桥连接到相应的延伸区域。导电区域通过桥梁穿过的绝缘通道与延伸区域分开。绝缘通道围绕导电区域作为接触点的保护框架。至少一个导电区域的至少主要侧面可以是弯曲的。几个先进的扩展区域形成镀覆模块的圆形边框。

6. 发明申请

US20070153487A1 PLATED MODULE FOR AN IC CARD 有权
标题翻译：用于IC卡的模块
公开(公告)号：US20070153487A1
公开(公告)日：2007-07-05
申请号：US11618364
申请日：2006-12-29
申请人： Paolo FRALLICCIARDI , Edoardo Visconti
发明人： Paolo FRALLICCIARDI , Edoardo Visconti
IPC分类号： H05K1/14
CPC分类号： G06K19/07743 , G06K19/07728 , G06K19/07747 , H01L2224/48091 , H01L2224/48228 , H01L2924/00014
摘要： A plated module is for an IC card and includes a printed circuit having a plurality of conductive areas, delimited by a network of insulating channels, for covering an integrated circuit chip intended to be hosted in a recess of a plastic support of the IC card. At least some of the conductive areas are connected to a corresponding contact points of the integrated circuit chip. At least some of the conductive areas are linked to corresponding extended areas by one or more bridges. The conductive areas are separated from the extended areas by an insulating channel crossed by the bridges. The insulating channels surround the conductive areas as a protection frame for the contact points. At least a major side of at least one of the conductive areas may be curved. Several of the advanced extended areas form a rounded border of the plated module.
摘要翻译：电镀模块用于IC卡，并且包括印刷电路，该印刷电路具有由绝缘通道网络界定的多个导电区域，用于覆盖旨在托置在IC卡的塑料支撑件的凹部中的集成电路芯片。至少一些导电区域连接到集成电路芯片的相应接触点。至少一些导电区域通过一个或多个桥连接到相应的延伸区域。导电区域通过桥梁穿过的绝缘通道与延伸区域分开。绝缘通道围绕导电区域作为接触点的保护框架。至少一个导电区域的至少主要侧面可以是弯曲的。几个先进的扩展区域形成镀覆模块的圆形边框。

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