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    • 2. 发明授权
    • MRAM fabrication method with sidewall cleaning
    • MRAM制造方法与侧壁清洁
    • US08574928B2
    • 2013-11-05
    • US13443818
    • 2012-04-10
    • Kimihiro SatohYiming HuaiYuchen ZhouJing ZhangDong Ha JungEbrahim AbedifardRajiv Yadav RanjanParviz Keshtbod
    • Kimihiro SatohYiming HuaiYuchen ZhouJing ZhangDong Ha JungEbrahim AbedifardRajiv Yadav RanjanParviz Keshtbod
    • H01L21/00
    • H01L27/222H01L43/12
    • Fabrication methods for MRAM are described wherein any re-deposited metal on the sidewalls of the memory element pillars is cleaned before the interconnection process is begun. In embodiments the pillars are first fabricated, then a dielectric material is deposited on the pillars over the re-deposited metal on the sidewalls. The dielectric material substantially covers any exposed metal and therefore reduces sources of re-deposition during subsequent etching. Etching is then performed to remove the dielectric material from the top electrode and the sidewalls of the pillars down to at least the bottom edge of the barrier. The result is that the previously re-deposited metal that could result in an electrical short on the sidewalls of the barrier is removed. Various embodiments of the invention include ways of enhancing or optimizing the process. The bitline interconnection process proceeds after the sidewalls have been etched clean as described.
    • 描述了用于MRAM的制造方法,其中在互连过程开始之前清洁存储元件柱的侧壁上的任何重新沉积的金属。 在实施例中,首先制造柱,然后将介电材料沉积在侧壁上的再沉积金属上的柱上。 电介质材料基本上覆盖任何暴露的金属,因此在随后的蚀刻期间减少再沉积的来源。 然后进行蚀刻以将电介质材料从顶部电极和柱的侧壁向下移动到至少阻挡层的底部边缘。 结果是可能导致在屏障的侧壁上导致电短路的先前重新沉积的金属被去除。 本发明的各种实施方案包括增强或优化方法的方法。 如所描述的那样,在侧壁被蚀刻清洁之后,进行位线互连处理。