会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 4. 发明授权
    • Method for fabricating a self-aligned source line flash memory device
    • 用于制造自对准源极线闪存器件的方法
    • US06596584B1
    • 2003-07-22
    • US09692691
    • 2000-10-19
    • Sarma S. GunturiPaul A. Chintapalli
    • Sarma S. GunturiPaul A. Chintapalli
    • H01L218234
    • H01L27/115G11C16/0416
    • A method for fabricating a flash memory device having a self-aligned source includes providing a semiconductor substrate having a source region separated from a drain region by a channel region. The method also includes forming an isolation structure in the semiconductor substrate that crosses the source, drain, and channel regions of the semiconductor substrate. The method also includes forming a continuous stack structure outwardly from the channel region of the semiconductor substrate and the isolation structure. The method includes depositing a bottom anti-reflective layer over the semiconductor substrate, the isolation structure and the stack structure to substantially uniformly planarize the semiconductor substrate and the isolation structure. The method further includes depositing a photoresist layer over select portions of the bottom anti-reflective layer and the continuous stack structure to form a self-aligned source pattern using a photo mask. The method includes etching the isolation structure and the bottom anti-reflective layer corresponding to the self aligned source pattern using a low selectivity etch process to remove a portion of the isolation structure and etching a remaining portion of the isolation structure using high selectivity etch process.
    • 制造具有自对准源的快闪存储器件的方法包括:提供具有通过沟道区域与漏极区域分离的源极区域的半导体衬底。 该方法还包括在半导体衬底中形成与半导体衬底的源极,漏极和沟道区交叉的隔离结构。 该方法还包括从半导体衬底的沟道区域和隔离结构向外形成连续堆叠结构。 该方法包括在半导体衬底上沉积底部抗反射层,隔离结构和堆叠结构以使半导体衬底和隔离结构基本均匀地平坦化。 该方法还包括在底部抗反射层和连续堆叠结构的选定部分上沉积光致抗蚀剂层,以使用光掩模形成自对准源图案。 该方法包括使用低选择性蚀刻工艺来蚀刻对应于自对准源图案的隔离结构和底部抗反射层,以去除隔离结构的一部分,并使用高选择性蚀刻工艺蚀刻隔离结构的剩余部分。
    • 5. 发明授权
    • Source line fabrication process for flash memory
    • 闪存的源线制造过程
    • US6071779A
    • 2000-06-06
    • US225436
    • 1999-01-05
    • Freidoon MehradSarma S. GunturiCetin KayaKyle A. Picone
    • Freidoon MehradSarma S. GunturiCetin KayaKyle A. Picone
    • H01L21/8247
    • H01L27/11521
    • A method of fabricating a semiconductor device having a memory array (9) that includes a source line (24) is provided. The method of forming the source line (24) may include providing a semiconductor substrate (52) having a source region (60) separated from a drain region (62) by a channel region (64). An isolation structure (70) may be formed in the semiconductor substrate (52). The isolation structure (70) may cross the source region (60), the drain region (62), and the channel region (64) of the semiconductor substrate (52). An isolation dielectric material (78) may be formed within the isolation structure (70). A continuous stack structure (50) may be formed outwardly from the channel region (64) of the semiconductor substrate (52) and the isolation structure (70). A first photomask (100) may be formed outwardly from the continuous stack structure (50) and the semiconductor substrate (52). The first photomask (100) may expose a strip region (102) of the semiconductor substrate (52) and the isolation structure (70). The isolation dielectric material (78) may be removed from the exposed portion the isolation structure (70) to expose the semiconductor substrate (52). A dopant may be implanted into the exposed semiconductor substrate (52) to form the source line (24) in the semiconductor device.
    • 提供一种制造具有包括源极线(24)的存储器阵列(9)的半导体器件的方法。 形成源极线(24)的方法可以包括提供具有通过沟道区(64)与漏极区(62)分离的源极区(60)的半导体衬底(52)。 隔离结构(70)可以形成在半导体衬底(52)中。 隔离结构(70)可以穿过半导体衬底(52)的源极区域(60),漏极区域(62)和沟道区域(64)。 隔离电介质材料(78)可以形成在隔离结构(70)内。 可以从半导体衬底(52)的沟道区(64)和隔离结构(70)向外形成连续堆叠结构(50)。 可以从连续堆叠结构(50)和半导体衬底(52)向外形成第一光掩模(100)。 第一光掩模(100)可以暴露半导体衬底(52)和隔离结构(70)的条带区域(102)。 隔离电介质材料(78)可以从隔离结构(70)的暴露部分去除以暴露半导体衬底(52)。 可以将掺杂剂注入到暴露的半导体衬底(52)中以在半导体器件中形成源极线(24)。
    • 10. 发明授权
    • Process and apparatus for detecting aberrations in production process
operations
    • 用于检测生产过程操作中的像差的过程和设备
    • US4846928A
    • 1989-07-11
    • US224205
    • 1988-07-22
    • Steven B. DolinsAditya SrivastavaBruce E. FlinchbaughSarma S. GunturiThomas W. LassiterRobert L. Love
    • Steven B. DolinsAditya SrivastavaBruce E. FlinchbaughSarma S. GunturiThomas W. LassiterRobert L. Love
    • H01J37/32
    • H01J37/32935
    • An improved apparatus and process for detecting aberrations in production process operations is provided. In one embodiment, operations of a plasma etch reactor (10) are monitored to detect aberrations in etching operations. A reference end-point trace (EPT) is defined (62) for the etch process. Regions are defined in the reference end-point trace (70) and characteristics and tolerances for each region are defined (72-80). The etcher is run and an actual EPT is obtained (82) from the running of the etcher. The actual EPT is analyzed to identify proposed regions of the actual EPT (86), and then the proposed regions of the actual EPT are matched with regions of the reference EPT (96). The system employs a series of heuristic functions in matching proposed regions of the actual EPT with regions of the reference EPT. Characteristics of the matched regions of the actual end-point trace are compared (66) with characteristics of the corresponding regions of the reference end-point trace to determine whether aberrations have occurred during the etch process. The invention provides for an improved matching and improved comparison of actual end-point traces with reference end-point traces.
    • 提供了一种用于检测生产过程操作中的像差的改进的装置和过程。 在一个实施例中,监测等离子体蚀刻反应器(10)的操作以检测蚀刻操作中的像差。 为蚀刻过程定义了参考端点轨迹(EPT)(62)。 区域在参考终点轨迹(70)中定义,每个区域的特征和公差被定义(72-80)。 蚀刻器运行,从蚀刻器的运行获得实际的EPT(82)。 分析实际的EPT以识别实际EPT(86)的建议区域,然后将实际EPT的建议区域与参考EPT(96)的区域匹配。 该系统采用一系列启发式功能,将实际EPT的建议区域与参考EPT的区域进行匹配。 将实际端点迹线的匹配区域的特征与参考端点迹线的相应区域的特性进行比较(66),以确定在蚀刻过程期间是否发生了像差。 本发明提供了改进的匹配和改进的实际端点迹线与参考端点迹线的比较。