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1. 发明申请

US20080308259A1 MULTIPLE TEMPERATURE SENSITIVE DEVICES USING TWO HEAT PIPES 审中-公开
标题翻译：使用两个热管的多个温度敏感的设备
公开(公告)号：US20080308259A1
公开(公告)日：2008-12-18
申请号：US12197925
申请日：2008-08-25
申请人： Scott D. Garner , G. Yale Eastman
发明人： Scott D. Garner , G. Yale Eastman
IPC分类号： F28D15/00
CPC分类号： F28D15/046 , F28D15/0275 , F28D15/06
摘要： A heat pipe assembly comprises a first heat pipe having a condenser and a working fluid. A reservoir communicates with the condenser of the first heat pipe and contains a non-condensable gas which variably permits access of the working fluid to the condenser of the first heat pipe, depending on a pressure of the working fluid. A second heat pipe has an evaporator. At least a portion of the evaporator of the second heat pipe is contained inside of the condenser of the first heat pipe.
摘要翻译：热管组件包括具有冷凝器和工作流体的第一热管。储存器与第一热管的冷凝器连通，并且包含不可冷凝的气体，其根据工作流体的压力可变地允许工作流体进入第一热管的冷凝器。第二热管具有蒸发器。第二热管的蒸发器的至少一部分被容纳在第一热管的冷凝器的内部。

2. 发明授权

US07159649B2 Air-to-air heat exchanger 失效
标题翻译：空对空换热器
公开(公告)号：US07159649B2
公开(公告)日：2007-01-09
申请号：US10893767
申请日：2004-07-16
申请人： Geoffrey P. Thyrum , Scott D. Garner
发明人： Geoffrey P. Thyrum , Scott D. Garner
IPC分类号： F28F3/00
CPC分类号： F28F3/025 , F28D9/0025 , F28F9/001 , F28F2240/00 , Y10S165/399
摘要： An air-to-air heat exchanger, is provided that comprises a folded fin core formed from a continuous sheet of thermally conductive material that has been folded into alternating flat ridges and troughs; an insert overlay having an opening including two sets of uniform fingers, wherein each finger has a portion protruding into and essentially filling each trough on one surface of the folded fin core; an inset region between each finger portion and the end edges of each trough; a sealant within each inset region sealably attaching the insert overlay to the folded fin core; and an air flow divider plate. Heat exchanger components are also provided.
摘要翻译：提供了一种空气 - 空气热交换器，其包括由已经折叠成交替的平坦的脊和槽的连续导热材料片形成的折叠翅片芯; 插入物覆盖物，其具有包括两组均匀指状物的开口，其中每个指状物具有突出到折叠翅片芯的一个表面上并基本上填充每个槽的部分; 每个指状部分和每个槽的端部边缘之间的插入区域; 每个插入区域内的密封剂将插入物覆盖层可密封地连接到折叠的翅片芯; 和气流分隔板。还提供热交换器部件。

3. 发明授权

US06972365B2 Thermal management system and method for electronics system 有权
标题翻译：电子系统热管理系统及方法
公开(公告)号：US06972365B2
公开(公告)日：2005-12-06
申请号：US10658828
申请日：2003-09-09
申请人： Scott D. Garner
发明人： Scott D. Garner
IPC分类号： H05K7/20
CPC分类号： H05K7/20681 , H05K7/20809 , H05K7/20818
摘要： A thermal energy management system is provided having a heat spreading device that is operatively engaged with at least one semiconductor chip and a thermal bus operatively engaged with the heat spreading device so as to transport thermal energy from the heat spreading device to a heat sink. The heat spreading device includes a heat pipe and the thermal bus includes a loop thermosyphon. A second thermal bus may be operatively engaged with the first thermal bus so as to transport thermal energy from the first thermal bus to a heat sink. The second thermal bus may also include a loop thermosyphon. A method of managing thermal energy in an electronic system is also provided that includes spreading thermal energy generated by one or more devices over a surface that is relatively larger than the devices, thermally coupling an evaporator portion of a loop thermosyphon to the surface, and thermally coupling a condensing portion of the loop thermosyphon to a thermal energy sink, e.g., a second loop thermosyphon, convection fin, or cold plate.
摘要翻译：提供了一种热能管理系统，其具有与至少一个半导体芯片可操作地接合的散热装置和与散热装置可操作地接合的热母线，以将热能从散热装置输送到散热器。散热装置包括热管，热量总线包括环形热虹吸管。第二热母线可以与第一热母线可操作地接合，以将热能从第一热母线传输到散热器。第二热量总线还可以包括环路虹吸管。还提供了一种在电子系统中管理热能的方法，其包括将一个或多个装置产生的热能扩散到比装置相对较大的表面上，将环形热虹吸管的蒸发器部分热耦合到表面，以及热将环形热虹吸管的冷凝部分耦合到热能吸收器，例如第二回路热虹吸管，对流翅片或冷板。

4. 发明授权

US06945317B2 Sintered grooved wick with particle web 有权
公开(公告)号：US06945317B2
公开(公告)日：2005-09-20
申请号：US10422878
申请日：2003-04-24
申请人： Scott D. Garner , James E. Lindemuth , Jerome E. Toth , John H. Rosenfeld , Kenneth G. Minnerly
发明人： Scott D. Garner , James E. Lindemuth , Jerome E. Toth , John H. Rosenfeld , Kenneth G. Minnerly
IPC分类号： F28D15/02 , F28D15/00
CPC分类号： F28D15/046 , F28D15/0233 , Y10T29/49353
摘要： A grooved sintered wick for a heat pipe is provided having a plurality of individual particles which together yield an average particle diameter. The grooved sintered wick further includes at least two adjacent lands that are in fluid communication with one another through a particle layer disposed between the lands where the particle layer comprises at least one dimension that is no more than about six average particle diameters. A heat pipe is also provided comprising a grooved wick that includes a plurality of individual particles having an average diameter. The grooved wick includes at least two adjacent lands that are in fluid communication with one another through a particle layer disposed between the lands that comprises less than about six average particle diameters. A method for making a heat pipe wick in accordance with the foregoing structures is also provided.

5. 发明授权

US06830097B2 Combination tower and serpentine fin heat sink device 失效
公开(公告)号：US06830097B2
公开(公告)日：2004-12-14
申请号：US10259311
申请日：2002-09-27
申请人： Jonathan P. Wattelet , Scott D. Garner
发明人： Jonathan P. Wattelet , Scott D. Garner
IPC分类号： F28D1502
CPC分类号： F28F3/025 , F28D15/0275 , F28D2021/0029 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A heat sink (10) is provided for use with a fan (16) for cooling an electronic component (12) wherein the heat sink (10) transfers heat from a heat rejecting surface (14) of the electronic component (12) to a cooling airflow provided by the fan (16). The heat sink (10) includes a heat conducting base member (20) having a substantially planar heat receiving surface (22) for overlaying the heat rejecting surface (14) of the electronic component (12) to receive heat therefrom, a heat conducting tower (24) extending from a side of the base member (20) opposite from the heat receiving surface (22) to receive heat therefrom, and a pair of serpentine fins (30) to transfer heat from the tower (24) to the airflow and the environment surrounding the heat sink (10).

6. 发明授权

US06675887B2 Multiple temperature sensitive devices using two heat pipes 失效
公开(公告)号：US06675887B2
公开(公告)日：2004-01-13
申请号：US10106277
申请日：2002-03-26
申请人： Scott D. Garner , G. Yale Eastman
发明人： Scott D. Garner , G. Yale Eastman
IPC分类号： F28F2700
CPC分类号： F28D15/046 , F28D15/0275 , F28D15/06
摘要： A heat pipe assembly comprises a first heat pipe having a condenser and a working fluid. A reservoir communicates with the condenser of the first heat pipe and contains a non-condensable gas which variably permits access of the working fluid to the condenser of the first heat pipe, depending on a pressure of the working fluid. A second heat pipe has an evaporator. At least a portion of the evaporator of the second heat pipe is contained inside of the condenser of the first heat pipe.

7. 发明授权

US5642776A Electrically insulated envelope heat pipe 失效
标题翻译：电绝缘信封热管
公开(公告)号：US5642776A
公开(公告)日：1997-07-01
申请号：US607897
申请日：1996-02-27
申请人： George A. Meyer, IV , Scott D. Garner
发明人： George A. Meyer, IV , Scott D. Garner
IPC分类号： F28D15/02 , F28D15/04 , H01L23/427 , F28D15/00
CPC分类号： H01L23/427 , F28D15/0233 , F28D15/046 , H01L2924/0002
摘要： The disclosure is for a heat pipe in the form of a simple foil envelope and a method of constructing such a heat pipe. Two plastic coated metal foil sheets are sealed together on all four edges to enclose a semi-rigid channeled sheet of plastic foam, and the envelope is evacuated and loaded with a suitable quantity of liquid to act as a heat pipe. Despite the use of the essentially poor thermally conductive materials such as the plastic coating on the surface of the casing and the foam plastic for the wick, the apparatus operates well as a heat spreader for an integrated circuit chip placed in contact with the envelope surface. The heat is transferred across the thin plastic coating with only a small temperature differential, and the foam plastic wick with channels efficiently transports condensed liquid back to the heat input location for evaporation.
摘要翻译：本发明公开的是一种简单的箔壳形式的热管和一种构造这种热管的方法。两个塑料涂覆的金属箔片在所有四个边缘上密封在一起，以封闭一个半刚性的塑料泡沫塑料片，并且将该信封抽真空并加载适量的液体作为热管。尽管使用基本上差的导热材料，例如外壳表面上的塑料涂层和用于芯的泡沫塑料，该装置作为用于与封套表面接触的集成电路芯片的散热器运行良好。热量仅通过较小的温差传递到薄的塑料涂层上，并且具有通道的泡沫塑料芯将有效地将冷凝的液体输送回热输入位置进行蒸发。

8. 发明授权

US07071408B2 Thermal management system and method for electronics system 失效
标题翻译：电子系统热管理系统及方法
公开(公告)号：US07071408B2
公开(公告)日：2006-07-04
申请号：US11218747
申请日：2005-09-02
申请人： Scott D. Garner
发明人： Scott D. Garner
IPC分类号： H05K7/20
CPC分类号： H05K7/20681 , H05K7/20809 , H05K7/20818
摘要： A thermal energy management system is provided having a heat spreading device that is operatively engaged with at least one semiconductor chip and a thermal bus operatively engaged with the heat spreading device so as to transport thermal energy from the heat spreading device to a heat sink. The heat spreading device includes a heat pipe and the thermal bus includes a loop thermosyphon. A second thermal bus may be operatively engaged with the first-thermal bus so as to transport thermal energy from the first thermal bus to a heat sink. The second thermal bus may also include a loop thermosyphon. A method of managing thermal energy in an electronic system is also provided that includes spreading thermal energy generated by one or more devices over a surface that is relatively larger than the devices, thermally coupling an evaporator portion of a loop thermosyphon to the surface, and thermally coupling a condensing portion of the loop thermosyphon to a thermal energy sink, e.g., a second loop thermosyphon, convection fin, or cold plate.
摘要翻译：提供了一种热能管理系统，其具有与至少一个半导体芯片可操作地接合的散热装置和与散热装置可操作地接合的热母线，以将热能从散热装置输送到散热器。散热装置包括热管，热量总线包括环形热虹吸管。第二热母线可以与第一热母线可操作地接合，以将热能从第一热母线传输到散热器。第二热量总线还可以包括环路虹吸管。还提供了一种在电子系统中管理热能的方法，其包括将一个或多个装置产生的热能扩散到比装置相对较大的表面上，将环形热虹吸管的蒸发器部分热耦合到表面，以及热将环形热虹吸管的冷凝部分耦合到热能吸收器，例如第二回路热虹吸管，对流翅片或冷板。

9. 发明授权

US06657121B2 Thermal management system and method for electronics system 有权
标题翻译：电子系统热管理系统及方法
公开(公告)号：US06657121B2
公开(公告)日：2003-12-02
申请号：US10180166
申请日：2002-06-26
申请人： Scott D. Garner
发明人： Scott D. Garner
IPC分类号： H05K720
CPC分类号： H05K7/20681 , H05K7/20809 , H05K7/20818
摘要： A thermal energy management system is provided having a heat spreading device that is operatively engaged with at least one semiconductor chip and a thermal bus operatively engaged with the heat spreading device so as to transport thermal energy from the heat spreading device to a heat sink. The heat spreading device includes a heat pipe and the thermal bus includes a loop thermosyphon. A second thermal bus may be operatively engaged with the first thermal bus so as to transport thermal energy from the first thermal bus to a heat sink. The second thermal bus may also include a loop thermosyphon. A method of managing thermal energy in an electronic system is also provided that includes spreading thermal energy generated by one or more devices over a surface that is relatively larger than the devices, thermally coupling an evaporator portion of a loop thermosyphon to the surface, and thermally coupling a condensing portion of the loop thermosyphon to a thermal energy sink, e.g., a second loop thermosyphon, convection fin, or cold plate.
摘要翻译：提供了一种热能管理系统，其具有与至少一个半导体芯片可操作地接合的散热装置和与散热装置可操作地接合的热母线，以将热能从散热装置输送到散热器。散热装置包括热管，热量总线包括环形热虹吸管。第二热母线可以与第一热母线可操作地接合，以将热能从第一热母线传输到散热器。第二热量总线还可以包括环路虹吸管。还提供了一种在电子系统中管理热能的方法，其包括将一个或多个装置产生的热能扩散在相对大于装置的表面上，将环形热虹吸管的蒸发器部分热耦合到表面，以及热将环形热虹吸管的冷凝部分耦合到热能吸收器，例如第二回路热虹吸管，对流翅片或冷板。

10. 发明授权

US06437437B1 Semiconductor package with internal heat spreader 有权
标题翻译：半导体封装带内部散热器
公开(公告)号：US06437437B1
公开(公告)日：2002-08-20
申请号：US09753893
申请日：2001-01-03
申请人： Jon Zuo , Scott D. Garner
发明人： Jon Zuo , Scott D. Garner
IPC分类号： H01L2310
CPC分类号： H01L23/427 , F28D15/0233 , F28D15/046 , H01L2224/16 , H01L2224/73253 , H01L2924/00014 , H01L2924/01322 , H01L2924/16152 , H01L2224/0401
摘要： A semiconductor package is provided that includes a substrate having a top surface, a cover, and at least one semiconductor device attached to the top surface of the substrate. The cover is secured to the substrate so as to create a space between the interior surface and the substrate such that the semiconductor device resides within the space. The cover has an interior surface comprising a plurality of micro-channels. A wick is positioned in confronting relation to the plurality of micro-channels and the semiconductor device, with a two-phase vaporizable liquid disposed within the space.
摘要翻译：提供一种半导体封装，其包括具有顶表面的基板，盖和附接到基板的顶表面的至少一个半导体器件。盖被固定到基板上，以在内表面和基板之间形成空间，使得半导体器件驻留在该空间内。盖具有包括多个微通道的内表面。灯芯与多个微通道和半导体器件面对面地定位，其中两相可汽化液体设置在该空间内。

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