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    • 9. 发明申请
    • SEMICONDUCTOR DEVICE
    • 半导体器件
    • US20100230780A1
    • 2010-09-16
    • US12718593
    • 2010-03-05
    • Shigeki Obayashi
    • Shigeki Obayashi
    • H01L23/525
    • H01L23/5256G11C17/18H01L2924/0002H01L2924/3011H01L2924/00
    • The present invention provides a semiconductor device realizing reliable cutting of a fuse without enlarging layout area of a fuse element and the reduced number of wiring layers of a preventing wall that prevents diffusion of fuse copper atoms. A fuse is formed by using a wire in a metal wiring layer as an upper layer in a plurality of metal wiring layers. Wires are disposed just above and just below a fuse each with a gap of at least two wiring layers. In an upper layer, a power wire that transmits power supply voltage is used as a part covering a preventing wall structure just above the fuse.
    • 本发明提供了一种半导体器件,其实现熔丝的可靠切割,而不会扩大熔丝元件的布局面积,并且减少了阻止熔丝铜原子扩散的防止壁的布线层数。 通过在多个金属布线层中的金属布线层中的导线作为上层形成熔丝。 电线布置在每个具有至少两个布线层的间隙的保险丝的正上方和正下方。 在上层,传输电源电压的电源线被用作覆盖保险丝正上方的预防壁结构的部分。