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1. 发明申请

US20120267151A1 METAL MICROPARTICLE DISPERSION, PROCESS FOR PRODUCTION OF ELECTRICALLY CONDUCTIVE SUBSTRATE, AND ELECTRICALLY CONDUCTIVE SUBSTRATE 有权
标题翻译：金属微孔分散体，电导电基板的生产工艺和电导电基板
公开(公告)号：US20120267151A1
公开(公告)日：2012-10-25
申请号：US13497555
申请日：2010-09-06
申请人： Mikiko Hojo , Shinya Yoneda , Naonobu Yoshi , Takeshi Sato , Kisei Matsumoto
发明人： Mikiko Hojo , Shinya Yoneda , Naonobu Yoshi , Takeshi Sato , Kisei Matsumoto
IPC分类号： H01B1/02 , H05K3/12 , H01B1/04 , H05K1/09
CPC分类号： B22F1/0022 , B22F1/0074 , B22F3/1055 , B22F2003/1054 , B82Y30/00 , C23C16/455 , H05K1/097 , H05K3/125 , Y02P10/295
摘要： Provided are a metal microparticle dispersion which is excellent in a dispersibility, an electrically conductive substrate which is obtained by using the above metal microparticle dispersion and which is excellent in an electrical conductivity and a production process for the same.Provided is a metal microparticle dispersion comprising metal microparticles, a polymeric dispersant and a dispersion medium, wherein an average primary particle diameter of the metal microparticles is 0.001 to 0.5 μm; the polymeric dispersant has a polyester skeleton in at least one of a principal chain and a side chain thereof; the above polyester skeleton has at least one of a constitutional unit derived from valerolactone and a constitutional unit derived from caprolactone, and a sum of the numbers of the above constitutional units is 10 or more in terms of an average value, or the polymeric dispersant has a polyether skeleton in at least one of a principal chain and a side chain thereof; and a content of the above polymeric dispersant is 0.1 to 100 parts by mass based on a content of 100 parts by mass of the metal microparticles. Further, provided is a production process for an electrically conductive substrate, comprising printing a coating solution containing the above metal microparticle dispersion in a pattern-like form to form a printed layer and subjecting the above printed layer to burning treatment to form a pattern-like metal microparticle sintered film, and an electrically conductive substrate produced by the above production process is provided as well.
摘要翻译：提供一种分散性优异的金属微粒分散体，通过使用上述金属微粒分散体而获得的导电性基体，其导电性优异且其制造方法优异。提供一种包含金属微粒，聚合物分散剂和分散介质的金属微粒分散体，其中金属微粒的平均一次粒径为0.001〜0.5μm; 聚合物分散剂在其主链和侧链中的至少一个中具有聚酯骨架; 上述聚酯骨架具有来自戊内酯的结构单元和由己内酯衍生的结构单元中的至少一种，上述结构单元的数量之和为平均值以上10以上，在其主链和侧链中的至少一个中的聚醚骨架; 上述聚合物分散剂的含量相对于100质量份金属微粒的含量为0.1〜100质量份。此外，提供了一种导电性基材的制造方法，其特征在于，将含有上述金属微粒分散液的涂布溶液印刷成图案状，形成印刷层，对上述印刷层进行燃烧处理，形成图案状金属微粒烧结膜，以及通过上述制造方法制造的导电性基材。

2. 发明申请

US20170013711A1 METAL MICROPARTICLE DISPERSION, PROCESS FOR PRODUCTION OF ELECTRICALLY CONDUCTIVE SUBSTRATE, AND ELECTRICALLY CONDUCTIVE SUBSTRATE 审中-公开
标题翻译：金属微孔分散体，电导电基板的生产工艺和电导电基板
公开(公告)号：US20170013711A1
公开(公告)日：2017-01-12
申请号：US15275997
申请日：2016-09-26
申请人： Mikiko HOJO , Shinya YONEDA , Naonobu YOSHI , Takeshi SATO , Kisei MATSUMOTO
发明人： Mikiko HOJO , Shinya YONEDA , Naonobu YOSHI , Takeshi SATO , Kisei MATSUMOTO
IPC分类号： H05K1/09 , C23C16/455 , H05K3/12
CPC分类号： B22F1/0022 , B22F1/0074 , B22F3/1055 , B22F2003/1054 , B82Y30/00 , C23C16/455 , H05K1/097 , H05K3/125 , Y02P10/295
摘要： Provided is a metal microparticle dispersion including metal microparticles, a polymeric dispersant and a dispersion medium, wherein an average primary particle diameter of the metal microparticles is 0.001 to 0.5 μm; the polymeric dispersant has a polyester skeleton in at least one of a principal chain and a side chain thereof; or the polymeric dispersant has a polyether skeleton in at least one of a principal chain and a side chain thereof; and a content of the above polymeric dispersant is 0.1 to 100 parts by mass based on a content of 100 parts by mass of the metal microparticles. Further, provided is a production process for an electrically conductive substrate, and an electrically conductive substrate produced by the above production process is provided.
摘要翻译：提供一种金属微粒分散体，其包含金属微粒，高分子分散剂和分散介质，其中金属微粒的平均一次粒径为0.001〜0.5μm; 聚合物分散剂在其主链和侧链中的至少一个中具有聚酯骨架; 或者聚合物分散剂在其主链和侧链中的至少一个中具有聚醚骨架; 上述聚合物分散剂的含量相对于100质量份金属微粒的含量为0.1〜100质量份。此外，提供了导电基板的制造方法，并且提供了通过上述制造方法制造的导电基板。

3. 发明授权

US09497859B2 Metal microparticle dispersion, process for production of electrically conductive substrate, and electrically conductive substrate 有权
标题翻译：金属微粒分散体，导电性基板的制造方法以及导电性基板
公开(公告)号：US09497859B2
公开(公告)日：2016-11-15
申请号：US13497555
申请日：2010-09-06
申请人： Mikiko Hojo , Shinya Yoneda , Naonobu Yoshi , Takeshi Sato , Kisei Matsumoto
发明人： Mikiko Hojo , Shinya Yoneda , Naonobu Yoshi , Takeshi Sato , Kisei Matsumoto
IPC分类号： H01B1/02 , H01B1/04 , H05K1/09 , H05K3/12 , B22F1/00 , B22F3/105 , B82Y30/00
CPC分类号： B22F1/0022 , B22F1/0074 , B22F3/1055 , B22F2003/1054 , B82Y30/00 , C23C16/455 , H05K1/097 , H05K3/125 , Y02P10/295
摘要： Provided is a metal microparticle dispersion including metal microparticles, a polymeric dispersant and a dispersion medium, wherein an average primary particle diameter of the metal microparticles is 0.001 to 0.5 μm; the polymeric dispersant has a polyester skeleton in at least one of a principal chain and a side chain thereof; or the polymeric dispersant has a polyether skeleton in at least one of a principal chain and a side chain thereof; and a content of the above polymeric dispersant is 0.1 to 100 parts by mass based on a content of 100 parts by mass of the metal microparticles. Further, provided is a production process for an electrically conductive substrate, and an electrically conductive substrate produced by the above production process is provided.
摘要翻译：提供一种金属微粒分散体，其包含金属微粒，高分子分散剂和分散介质，其中金属微粒的平均一次粒径为0.001〜0.5μm; 聚合物分散剂在其主链和侧链中的至少一个中具有聚酯骨架; 或者聚合物分散剂在其主链和侧链中的至少一个中具有聚醚骨架; 上述聚合物分散剂的含量相对于100质量份金属微粒的含量为0.1〜100质量份。此外，提供了导电基板的制造方法，并且提供了通过上述制造方法制造的导电基板。

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