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1. 发明授权

US07501708B2 Microelectronic device connection structure 失效
标题翻译：微电子器件连接结构
公开(公告)号：US07501708B2
公开(公告)日：2009-03-10
申请号：US11461148
申请日：2006-07-31
申请人： Paul Stephen Andry , Steven Lorenz Wright
发明人： Paul Stephen Andry , Steven Lorenz Wright
IPC分类号： H01L23/48 , H01L23/52 , H01L29/40
CPC分类号： H01L24/05 , H01L23/585 , H01L24/12 , H01L24/16 , H01L2224/02122 , H01L2224/0401 , H01L2224/05001 , H01L2224/0554 , H01L2224/05552 , H01L2224/05555 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01019 , H01L2924/01022 , H01L2924/01024 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01044 , H01L2924/01047 , H01L2924/0105 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/01327 , H01L2924/014 , H01L2924/05042 , H01L2924/14 , H01L2924/00014 , H01L2924/00012
摘要： The invention broadly and generally provides a connection structure for connecting a microelectronic device to a substrate, the aforesaid connection structure comprising: (a) a metal layer electrically connected to the aforesaid microelectronic device; (b) an interface element attached to an interface portion of the aforesaid metal layer; (c) a metallic solder element attached to the aforesaid interface element at an interface region of the aforesaid metallic solder element; and (d) a current dispersing structure operable to spatially disperse an electric current, the aforesaid current dispersing structure comprising an electrically insulating material and being disposed within at least one of the aforesaid interface portion, the aforesaid interface element, and the aforesaid interface region.
摘要翻译：本发明广泛地并且通常提供用于将微电子器件连接到衬底的连接结构，上述连接结构包括：（a）与上述微电子器件电连接的金属层; （b）连接到上述金属层的界面部分的界面元件; （c）在上述金属焊料元件的界面区域附着于上述界面元件的金属焊料元件; 和（d）可操作以空间分散电流的电流分散结构，上述电流分散结构包括电绝缘材料，并且设置在上述界面部分，上述界面元件和上述界面区域中的至少一个内。

2. 发明授权

US07492821B2 System and method for selective image capture, transmission and reconstruction 失效
标题翻译：选择性图像捕获，传输和重建的系统和方法
公开(公告)号：US07492821B2
公开(公告)日：2009-02-17
申请号：US11053648
申请日：2005-02-08
申请人： Steven T. Berman , Paul F. Greier , Kenneth C. Ho , Richard I. Kaufman , Alphonso P. Lanzetta , Michael P. Mastro , Steven Edward Millman , Ron Ridgeway , Kai Schleupen , Steven Lorenz Wright
发明人： Steven T. Berman , Paul F. Greier , Kenneth C. Ho , Richard I. Kaufman , Alphonso P. Lanzetta , Michael P. Mastro , Steven Edward Millman , Ron Ridgeway , Kai Schleupen , Steven Lorenz Wright
IPC分类号： H04N7/12 , G06K9/36
CPC分类号： H04N21/6587 , H04N19/17 , H04N19/42 , H04N19/597 , H04N21/4223 , H04N21/4728
摘要： A video processing method and system for generating a foveated video display with sections having different resolutions uses a network channel for communicating video images having video sections of different resolutions, and includes a video transmission system for processing and transmitting the received video images over the network channel. The system assigns a larger portion of the network channel's bandwidth to a video section with higher resolution. Further, the system includes a video receiving system for receiving and seamlessly combining the first and second video sections of different resolutions to form an output video image on a display device, and a control unit for sending one or more video control parameters to the video transmission system to control capturing, transmitting and processing of the video images.
摘要翻译：用于生成具有不同分辨率的部分的移动视频显示的视频处理方法和系统使用用于传送具有不同分辨率的视频部分的视频图像的网络通道，并且包括用于通过网络通道处理和发送所接收的视频图像的视频传输系统。系统将较大部分的网络通道的带宽分配给具有较高分辨率的视频部分。此外，该系统包括用于接收和无缝组合不同分辨率的第一和第二视频部分以在显示装置上形成输出视频图像的视频接收系统，以及用于将一个或多个视频控制参数发送到视频传输的控制单元系统来控制视频图像的捕获，发送和处理。

3. 发明申请

US20080023851A1 MICROELECTRONIC DEVICE CONNECTION STRUCTURE 失效
标题翻译：微电子设备连接结构
公开(公告)号：US20080023851A1
公开(公告)日：2008-01-31
申请号：US11461148
申请日：2006-07-31
申请人： Paul Stephen Andry , Steven Lorenz Wright
发明人： Paul Stephen Andry , Steven Lorenz Wright
IPC分类号： H01L23/48
CPC分类号： H01L24/05 , H01L23/585 , H01L24/12 , H01L24/16 , H01L2224/02122 , H01L2224/0401 , H01L2224/05001 , H01L2224/0554 , H01L2224/05552 , H01L2224/05555 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01019 , H01L2924/01022 , H01L2924/01024 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01044 , H01L2924/01047 , H01L2924/0105 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/01327 , H01L2924/014 , H01L2924/05042 , H01L2924/14 , H01L2924/00014 , H01L2924/00012
摘要： The invention broadly and generally provides a connection structure for connecting a microelectronic device to a substrate, the aforesaid connection structure comprising: (a) a metal layer electrically connected to the aforesaid microelectronic device; (b) an interface element attached to an interface portion of the aforesaid metal layer; (c) a metallic solder element attached to the aforesaid interface element at an interface region of the aforesaid metallic solder element; and (d) a current dispersing structure operable to spatially disperse an electric current, the aforesaid current dispersing structure comprising an electrically insulating material and being disposed within at least one of the aforesaid interface portion, the aforesaid interface element, and the aforesaid interface region.
摘要翻译：本发明广泛地并且通常提供用于将微电子器件连接到衬底的连接结构，上述连接结构包括：（a）与上述微电子器件电连接的金属层; （b）连接到上述金属层的界面部分的界面元件; （c）在上述金属焊料元件的界面区域附着于上述界面元件的金属焊料元件; 和（d）可操作以空间分散电流的电流分散结构，上述电流分散结构包括电绝缘材料，并且设置在上述界面部分，上述界面元件和上述界面区域中的至少一个内。

4. 发明授权

US07282391B1 Method for precision assembly of integrated circuit chip packages 有权
标题翻译：集成电路芯片封装的精密组装方法
公开(公告)号：US07282391B1
公开(公告)日：2007-10-16
申请号：US11385121
申请日：2006-03-21
申请人： Paul Stephen Andry , Leena Paivikki Buchwalter , Raymond R. Horton , John Ulrich Knickerbocker , Cornelia K. Tsang , Steven Lorenz Wright
发明人： Paul Stephen Andry , Leena Paivikki Buchwalter , Raymond R. Horton , John Ulrich Knickerbocker , Cornelia K. Tsang , Steven Lorenz Wright
IPC分类号： H01L21/00 , H01L23/48
CPC分类号： H01L24/81 , H01L23/544 , H01L24/48 , H01L24/97 , H01L25/50 , H01L2223/54426 , H01L2223/54473 , H01L2224/05568 , H01L2224/05573 , H01L2224/05644 , H01L2224/05647 , H01L2224/13144 , H01L2224/13147 , H01L2224/16 , H01L2224/48227 , H01L2224/81001 , H01L2224/81054 , H01L2224/81136 , H01L2224/81203 , H01L2224/8121 , H01L2224/81815 , H01L2224/85444 , H01L2224/85447 , H01L2224/97 , H01L2924/00014 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01018 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01073 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/10253 , H01L2924/14 , H01L2924/15153 , H01L2924/15157 , H01L2924/1517 , H01L2924/15174 , H01L2924/20109 , H01L2224/81 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： An electronic dive and method of fabricating an electronic device. The method including placing a placement guide over a top surface of a module substrate, the placement guide having a guide opening, the guide opening extending from a top surface of the placement guide to a bottom surface of the placement guide; aligning the placement guide to an integrated circuit chip position on the module substrate; fixing the placement guide to the module substrate; placing an integrated circuit chip in the guide opening, sidewalls of the placement guide opening constraining electrically conductive bonding structures on bottom surface of the integrated circuit chip to self-align to an electrically conductive module substrate contact pad on the top surface of the module substrate in the integrated circuit chip position; and bonding the bonding structures to the module substrate contact pads, the bonding structures and the module substrate contact pads in direct physical and electrical contact after the bonding.
摘要翻译：一种电子潜水及其制造方法。所述方法包括将放置引导件放置在模块基板的顶表面上，所述放置引导件具有引导开口，所述引导开口从所述放置引导件的顶表面延伸到所述放置引导件的底表面; 将所述放置引导件对准所述模块基板上的集成电路芯片位置; 将所述放置引导件固定到所述模块基板; 将集成电路芯片放置在引导开口中，放置引导开口的侧壁约束集成电路芯片的底表面上的导电接合结构，以与模块基板的顶表面上的导电模块衬底接触焊盘自对准集成电路芯片位置; 以及在接合之后将结合结构粘合到模块衬底接触焊盘，接合结构和模块衬底接触焊盘，直接物理和电接触。

5. 发明授权

US06690383B1 Color calibration of displays 有权
标题翻译：显示器的颜色校准
公开(公告)号：US06690383B1
公开(公告)日：2004-02-10
申请号：US09490545
申请日：2000-01-24
申请人： Gordon Wesley Braudaway , Albert Nessim Cazes , James Edward Christensen , Michael James Cordes , Donald Michael DeCain , Shui-Chih Alan Lien , Frederick Cole Mintzer , Steven Lorenz Wright
发明人： Gordon Wesley Braudaway , Albert Nessim Cazes , James Edward Christensen , Michael James Cordes , Donald Michael DeCain , Shui-Chih Alan Lien , Frederick Cole Mintzer , Steven Lorenz Wright
IPC分类号： G09G502
CPC分类号： G09G5/006 , G09G5/04 , G09G2320/0693 , H04N17/02 , H04N17/04
摘要： The present invention provides methods and apparatus for the color calibration of displays. These methods are particularly useful for displays having properties different than those associated with cathode ray tubes (CRT). Some displays, for example liquid crystal displays (LCD), have a high luminance black, the chromas of their primaries are not independent of their luminance levels, the intensities of their primaries are not strictly monotonically increasing with respect to their RGB levels, the color additivity of their subpixels is affected by crosstalk or leakage and their color measurements are dependent on the view angle of the observer. Therefore, the usage of CRT methods is deficient for such displays. The methods and apparatus of the present invention overcome several deficiencies generally found in non-CRT display devices by employing techniques associated with the use of restricted ranges for the primaries, subtracting the color black from all color measurements, forming a modified display matrix and/or creating tables which correct errors due to the non-linearities or color leakages of these display devices. These enable images to be processed using algorithms of different complexity and precision.
摘要翻译：本发明提供了用于显示器的颜色校准的方法和装置。这些方法对于具有与阴极射线管（CRT）相关的特性不同的性质的显示器特别有用。一些显示器（例如液晶显示器（LCD））具有高亮度黑色，它们的原色的色度不依赖于它们的亮度级别，其基色的强度相对于它们的RGB等级不是严格单调增加，颜色它们的子像素的加和性受串扰或泄漏的影响，并且它们的颜色测量取决于观察者的视角。因此，CRT方法的使用对于这种显示器是不足的。本发明的方法和装置克服了在非CRT显示装置中通常使用与使用限制范围的原色有关的技术的几个缺陷，从所有颜色测量中减去颜色黑色，形成修改后的显示矩阵和/或创建由于这些显示设备的非线性或颜色泄漏而校正错误的表。这些使得能够使用不同复杂度和精度的算法来处理图像。

6. 发明授权

US08582648B2 System and method for selective image capture, transmission and reconstruction 有权
公开(公告)号：US08582648B2
公开(公告)日：2013-11-12
申请号：US12372458
申请日：2009-02-17
申请人： Steven T. Berman , Paul F. Greier , Kenneth C. Ho , Richard I. Kaufman , Alphonso P. Lanzetta , Michael P. Mastro , Steven Edward Millman , Ron Ridgeway , Kai Schleupen , Steven Lorenz Wright
发明人： Steven T. Berman , Paul F. Greier , Kenneth C. Ho , Richard I. Kaufman , Alphonso P. Lanzetta , Michael P. Mastro , Steven Edward Millman , Ron Ridgeway , Kai Schleupen , Steven Lorenz Wright
IPC分类号： H04N7/12 , G06K9/36
CPC分类号： H04N21/6587 , H04N19/17 , H04N19/42 , H04N19/597 , H04N21/4223 , H04N21/4728
摘要： A video processing method and system for generating a foveated video display with sections having different resolutions uses a network channel for communicating video images having video sections of different resolutions, and includes a video transmission system for processing and transmitting the received video images over the network channel. The system assigns a larger portion of the network channel's bandwidth to a video section with higher resolution. Further, the system includes a video receiving system for receiving and seamlessly combining the first and second video sections of different resolutions to form an output video image on a display device, and a control unit for sending one or more video control parameters to the video transmission system to control capturing, transmitting and processing of the video images.

7. 发明授权

US07615405B2 Method for precision assembly of integrated circuit chip packages 失效
标题翻译：集成电路芯片封装的精密组装方法
公开(公告)号：US07615405B2
公开(公告)日：2009-11-10
申请号：US11872331
申请日：2007-10-15
申请人： Paul Stephen Andry , Leena Paivikki Buchwalter , Raymond R. Horton , John Ulrich Knickerbocker , Cornelia K. Tsang , Steven Lorenz Wright
发明人： Paul Stephen Andry , Leena Paivikki Buchwalter , Raymond R. Horton , John Ulrich Knickerbocker , Cornelia K. Tsang , Steven Lorenz Wright
IPC分类号： H01L21/50 , H01L21/48 , H01L21/44
CPC分类号： H01L24/81 , H01L23/544 , H01L24/48 , H01L24/97 , H01L25/50 , H01L2223/54426 , H01L2223/54473 , H01L2224/05568 , H01L2224/05573 , H01L2224/05644 , H01L2224/05647 , H01L2224/13144 , H01L2224/13147 , H01L2224/16 , H01L2224/48227 , H01L2224/81001 , H01L2224/81054 , H01L2224/81136 , H01L2224/81203 , H01L2224/8121 , H01L2224/81815 , H01L2224/85444 , H01L2224/85447 , H01L2224/97 , H01L2924/00014 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01018 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01073 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/10253 , H01L2924/14 , H01L2924/15153 , H01L2924/15157 , H01L2924/1517 , H01L2924/15174 , H01L2924/20109 , H01L2224/81 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： An electronic dive and method of fabricating an electronic device. The method including placing a placement guide over a top surface of a module substrate, the placement guide having a guide opening, the guide opening extending from a top surface of the placement guide to a bottom surface of the placement guide; aligning the placement guide to an integrated circuit chip position on the module substrate; fixing the placement guide to the module substrate; placing an integrated circuit chip in the guide opening, sidewalls of the placement guide opening constraining electrically conductive bonding structures on bottom surface of the integrated circuit chip to self-align to an electrically conductive module substrate contact pad on the top surface of the module substrate in the integrated circuit chip position; and bonding the bonding structures to the module substrate contact pads, the bonding structures and the module substrate contact pads in direct physical and electrical contact after the bonding.
摘要翻译：一种电子潜水及其制造方法。所述方法包括将放置引导件放置在模块基板的顶表面上，所述放置引导件具有引导开口，所述引导开口从所述放置引导件的顶表面延伸到所述放置引导件的底表面; 将所述放置引导件对准所述模块基板上的集成电路芯片位置; 将所述放置引导件固定到所述模块基板; 将集成电路芯片放置在引导开口中，放置引导开口的侧壁约束集成电路芯片的底表面上的导电接合结构，以与模块基板的顶表面上的导电模块衬底接触焊盘自对准集成电路芯片位置; 以及在接合之后将结合结构粘合到模块衬底接触焊盘，接合结构和模块衬底接触焊盘，直接物理和电接触。

8. 发明申请

US20080182362A1 METHOD FOR PRECISION ASSEMBLY OF INTEGRATED CIRCUIT CHIP PACKAGES 失效
标题翻译：集成电路芯片封装的精密组装方法
公开(公告)号：US20080182362A1
公开(公告)日：2008-07-31
申请号：US11872331
申请日：2007-10-15
申请人： Paul Stephen Andry , Leena Paivikki Buchwalter , Raymond R. Horton , John Ulrich Knickerbocker , Cornelia K. Tsang , Steven Lorenz Wright
发明人： Paul Stephen Andry , Leena Paivikki Buchwalter , Raymond R. Horton , John Ulrich Knickerbocker , Cornelia K. Tsang , Steven Lorenz Wright
IPC分类号： H01L21/00
CPC分类号： H01L24/81 , H01L23/544 , H01L24/48 , H01L24/97 , H01L25/50 , H01L2223/54426 , H01L2223/54473 , H01L2224/05568 , H01L2224/05573 , H01L2224/05644 , H01L2224/05647 , H01L2224/13144 , H01L2224/13147 , H01L2224/16 , H01L2224/48227 , H01L2224/81001 , H01L2224/81054 , H01L2224/81136 , H01L2224/81203 , H01L2224/8121 , H01L2224/81815 , H01L2224/85444 , H01L2224/85447 , H01L2224/97 , H01L2924/00014 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01018 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01073 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/10253 , H01L2924/14 , H01L2924/15153 , H01L2924/15157 , H01L2924/1517 , H01L2924/15174 , H01L2924/20109 , H01L2224/81 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： An electronic dive and method of fabricating an electronic device. The method including placing a placement guide over a top surface of a module substrate, the placement guide having a guide opening, the guide opening extending from a top surface of the placement guide to a bottom surface of the placement guide; aligning the placement guide to an integrated circuit chip position on the module substrate; fixing the placement guide to the module substrate; placing an integrated circuit chip in the guide opening, sidewalls of the placement guide opening constraining electrically conductive bonding structures on bottom surface of the integrated circuit chip to self-align to an electrically conductive module substrate contact pad on the top surface of the module substrate in the integrated circuit chip position; and bonding the bonding structures to the module substrate contact pads, the bonding structures and the module substrate contact pads in direct physical and electrical contact after the bonding.
摘要翻译：一种电子潜水及其制造方法。所述方法包括将放置引导件放置在模块基板的顶表面上，所述放置引导件具有引导开口，所述引导开口从所述放置引导件的顶表面延伸到所述放置引导件的底表面; 将所述放置引导件对准所述模块基板上的集成电路芯片位置; 将所述放置引导件固定到所述模块基板; 将集成电路芯片放置在引导开口中，放置引导开口的侧壁约束集成电路芯片的底表面上的导电接合结构，以与模块基板的顶表面上的导电模块衬底接触焊盘自对准集成电路芯片位置; 以及在接合之后将结合结构粘合到模块衬底接触焊盘，接合结构和模块衬底接触焊盘，直接物理和电接触。

9. 发明授权

US06870643B2 Method and system for error diffusion with a plurality of error measures 失效
标题翻译：用多个误差测量误差扩散的方法和系统
公开(公告)号：US06870643B2
公开(公告)日：2005-03-22
申请号：US09774067
申请日：2001-01-31
申请人： Gerhard Robert Thompson , Steven Lorenz Wright , Chai Wah Wu
发明人： Gerhard Robert Thompson , Steven Lorenz Wright , Chai Wah Wu
IPC分类号： G06K15/02 , H04N1/405 , G09G5/00 , H04N1/52
CPC分类号： H04N1/405 , G06K15/02
摘要： A method (and system) for producing a halftoned image, includes calculating errors corresponding to a plurality of different viewing conditions of a halftone image, and minimizing a function of the errors, such that the halftoned image appears as a different image under different viewing conditions. Alternatively, in another embodiment, the halftoned image appears as the same image under different viewing conditions.
摘要翻译：一种用于产生半色调图像的方法（和系统），包括计算与半色调图像的多个不同观看条件相对应的误差，并且最小化误差的功能，使得半色调图像在不同观看条件下显示为不同图像。或者，在另一个实施例中，半色调图像在不同的观看条件下显示为相同的图像。

10. 发明授权

US06697037B1 TFT LCD active data line repair 失效
标题翻译： TFT LCD有源数据线修复
公开(公告)号：US06697037B1
公开(公告)日：2004-02-24
申请号：US08639583
申请日：1996-04-29
申请人： Paul Matthew Alt , Pedro A. Chalco , Bruce Kenneth Furman , Raymond Robert Horton , Chandrasekhar Narayan , Benal Lee Owens, Jr. , Kevin Wilson Warren , Steven Lorenz Wright
发明人： Paul Matthew Alt , Pedro A. Chalco , Bruce Kenneth Furman , Raymond Robert Horton , Chandrasekhar Narayan , Benal Lee Owens, Jr. , Kevin Wilson Warren , Steven Lorenz Wright
IPC分类号： G09G336
CPC分类号： G02F1/1309 , G02F2001/136272 , G09G3/3611 , G09G3/3685 , G09G2300/0426 , G09G2310/0297 , G09G2330/08 , G11C29/76 , Y10S345/904
摘要： A matrix addressed display system designed so as to enable data line repair by electronic mechanisms which is efficient and low in cost and thus increases yield. Such active data line repair utilizes additional data driver outputs, a defect map memory in the TFT/LCD module and modification of the data stream to the data drivers by additional circuits between the display and the display adapter. A bus configuration on the display substrate is utilized which combines repair flexibility, low parasitic capacitance, and the ability to easily make the necessary interconnections. The number of interconnections is kept to a minimum, the connections are reliable, and the connections may be made with conventional wire bond or laser bond technology, or disk bond technology.
摘要翻译：矩阵寻址显示系统设计，以便通过电子机制进行数据线修复，这是有效率和低成本的，从而提高产量。这种有源数据线修复利用附加数据驱动器输出，TFT / LCD模块中的缺陷图存储器，以及通过显示器和显示适配器之间的附加电路将数据流修改为数据驱动器。使用显示基板上的总线配置，其结合了修复灵活性，低寄生电容和容易进行必要互连的能力。互连的数量保持最小，连接是可靠的，并且可以用传统的引线键合或激光键合技术或磁盘接合技术来进行连接。

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