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1. 发明授权

US07981309B2 Method for detecting polishing end in CMP polishing device, CMP polishing device, and semiconductor device manufacturing method 有权
标题翻译：用于检测CMP抛光装置中的抛光端的方法，CMP抛光装置和半导体器件制造方法
公开(公告)号：US07981309B2
公开(公告)日：2011-07-19
申请号：US11921008
申请日：2006-05-16
申请人： Takehiko Ueda , Hosei Nakahira , Akira Ishikawa
发明人： Takehiko Ueda , Hosei Nakahira , Akira Ishikawa
IPC分类号： C03C25/68 , B24B49/00
CPC分类号： G01N21/55 , B24B37/013 , B24B49/12 , G01N21/9501 , H01L21/3212 , H01L22/26
摘要： The spectral reflectance spectrum of an object of polishing that has reached the polishing endpoint is found ahead of time, the spectral reflectance spectrum of the object of polishing is found during polishing, and the correlation coefficient of these is seen as parameter 1. Meanwhile, the sum of the absolute values of the difference between the first order differentials of these is seen as parameter 2. Then, when parameter 1 is in a range exceeding a specific value, and parameter 2 is at its minimum, it is concluded that the polishing endpoint has been reached. Thus, it is possible to provide a method for detecting the polishing endpoint in a highly reliable CMP polishing apparatus.
摘要翻译：达到抛光终点的抛光对象的光谱反射光谱提前发现，抛光时发现抛光对象的光谱反射光谱，其相关系数被视为参数1。将这些的一阶微分之差的绝对值之和视为参数2.然后，当参数1在超过特定值的范围内且参数2处于最小值时，得出结论：抛光端点已经到达因此，可以提供一种用于在高可靠性CMP抛光装置中检测抛光终点的方法。

2. 发明授权

US06271047B1 Layer-thickness detection methods and apparatus for wafers and the like, and polishing apparatus comprising same 有权
公开(公告)号：US06271047B1
公开(公告)日：2001-08-07
申请号：US09316082
申请日：1999-05-20
申请人： Yoshijiro Ushio , Takehiko Ueda
发明人： Yoshijiro Ushio , Takehiko Ueda
IPC分类号： H01L2100
CPC分类号： B24B37/013 , B24B49/04 , B24B49/12 , G01B11/0683 , H01L22/12 , H01L22/26 , H01L2924/0002 , H01L2924/00
摘要： Methods and apparatus are disclosed for detecting a thickness of a surficial layer (e.g., metal or insulating layer) on a workpiece (e.g., semiconductor wafer) during a process for planarizing the layer, so as to stop the process when a suitable process endpoint is reached. Layer thickness is detected based on a spectral-characteristic signal of reflected or transmitted signal light, obtained by directing a probe light onto the surface of the workpiece. Example spectral characteristics are local maxima and minima of signal-light waveform, differences or quotients of the same, a dispersion of the signal-light waveform, a component of a Fourier transform of the signal waveform, a cross-correlation function of the signal waveform. Alternatively, the zeroth order of signal light is selected for measurement, or a spatial coherence length of the probe light is compared with the degree of fineness of the pattern on the surface illuminated with the probe light. An optical model can be determined based on the comparison, and at least one of the layer thickness and the process endpoint is detected by comparing the measured signal-light intensity with the calculated theoretical signal light intensity.

3. 发明授权

US4476219A Silver halide color photographic material 失效
标题翻译：卤化银彩色照相材料
公开(公告)号：US4476219A
公开(公告)日：1984-10-09
申请号：US474606
申请日：1983-03-11
申请人： Kei Sakanoue , Shigeo Hirano , Takehiko Ueda , Keiichi Adachi
发明人： Kei Sakanoue , Shigeo Hirano , Takehiko Ueda , Keiichi Adachi
IPC分类号： G03C7/26 , G03C7/32 , G03C7/392
CPC分类号： G03C7/39216
摘要： A silver halide color photographic material which is improved in granularity by containing both a gallic acid amide derivative represented by the following general formula (I) and a high speed reaction type coupler: ##STR1## wherein R.sup.1 and R.sup.2 each represents a hydrogen atom, a substituted or an unsubstituted aliphatic group, a substituted or an unsubstituted aromatic group, or a substituted or an unsubstituted heterocyclic group, and they may be the same group provided that they are not simultaneously hydrogen atoms, and, further, they may combine with each other to form a ring.
摘要翻译：通过含有由以下通式（I）表示的没食子酸酰胺衍生物和高速反应型成色剂（I），其中R 1和R 2各自表示氢取代或未取代的芳基，取代或未取代的芳基，或取代或未取代的杂环基，它们可以是相同的基团，条件是它们不同时为氢原子，并且还可以组合彼此形成一个戒指。

4. 发明申请

US20100233937A1 METHOD FOR PREDICTING WORKED SHAPE, METHOD FOR DETERMINING WORKING CONDITIONS, WORKING METHOD, WORKING SYSTEM, SEMICONDUCTOR DEVICE MANUFACTURING METHOD, COMPUTER PROGRAM AND COMPUTER PROGRAM STORAGE MEDIUM 有权
标题翻译：用于预测工作形状的方法，确定工作条件的方法，工作方法，工作系统，半导体器件制造方法，计算机程序和计算机程序存储介质
公开(公告)号：US20100233937A1
公开(公告)日：2010-09-16
申请号：US12749306
申请日：2010-03-29
申请人： Tatsuya SENGA , Akira Ishikawa , Takehiko Ueda
发明人： Tatsuya SENGA , Akira Ishikawa , Takehiko Ueda
IPC分类号： B24B51/00
CPC分类号： H01L22/26 , B24B37/042 , B24B49/00 , B24B49/04 , H01L21/3212
摘要： The relationship between polishing conditions constituting elements and the worked shape (amount of polishing) obtained by means of these polishing conditions is input beforehand into polishing condition determining means along with the type of the object of polishing, and polishing conditions (invariable polishing conditions) that are used in common for the polishing of this object of polishing. The polishing condition determining means determine the polishing conditions on the basis of these conditions. Specifically, the above-mentioned polishing conditions constituting elements are given in a time series, or combinations of the above-mentioned polishing conditions constituting elements are converted into variations in the swinging velocity of the polishing body, and the swinging velocity corresponding to the swinging position is determined. The polishing apparatus control means input the polishing conditions determined by the polishing condition determining means, and control the polishing apparatus so that these polishing conditions are realized. As a result, working conditions for obtaining a specified worked shape in a working apparatus can be simply and accurately determined.
摘要翻译：抛光条件构成要素与通过这些研磨条件获得的加工形状（抛光量）之间的关系与抛光对象的类型以及抛光条件（不变的抛光条件）预先输入到抛光条件确定装置中，被普遍用于抛光抛光的目的。抛光条件确定装置基于这些条件确定抛光条件。具体地说，以时间序列给出上述构成元件的抛光条件，或者将上述抛光条件构成元件的组合转换为抛光体的摆动速度的变化，并且与摆动位置相对应的摆动速度决心，决意，决定。抛光装置控制装置输入由抛光条件确定装置确定的抛光条件，并且控制抛光装置以便实现这些抛光条件。结果，可以简单且准确地确定在工作装置中获得规定加工形状的工作条件。

5. 发明授权

US07686673B2 Working shape prediction method, working requirement determination method, working method, working system, method of manufacturing semiconductor device, computer program, and computer program storage medium 有权
标题翻译：工作形状预测方法，工作要求确定方法，工作方法，工作系统，制造半导体器件的方法，计算机程序和计算机程序存储介质
公开(公告)号：US07686673B2
公开(公告)日：2010-03-30
申请号：US10470537
申请日：2002-01-15
申请人： Tatsuya Senga , Akira Ishikawa , Takehiko Ueda
发明人： Tatsuya Senga , Akira Ishikawa , Takehiko Ueda
IPC分类号： B24B49/00 , B24B51/00
CPC分类号： H01L22/26 , B24B37/042 , B24B49/00 , B24B49/04 , H01L21/3212
摘要： The relationship between polishing conditions constituting elements and the worked shape (amount of polishing) obtained by way of these polishing conditions is input beforehand into polishing condition determining mechanism along with the type of the object of polishing, and polishing conditions (invariable polishing conditions) that are used in common for the polishing of this object of polishing. The polishing condition determining mechanism determines the polishing conditions on the basis of these conditions. Specifically, the above-mentioned polishing conditions constituting elements are given in a time series, or combinations of the above-mentioned polishing conditions constituting elements are converted into variations in the swinging velocity of the polishing body, and the swinging velocity corresponding to the swinging position is determined. The polishing apparatus control mechanism input the polishing conditions determined by the polishing condition determining mechanism, and control the polishing apparatus so that these polishing conditions are realized. As a result, working conditions for obtaining a specified worked shape in a working apparatus can be simply and accurately determined.
摘要翻译：抛光条件构成要素之间的关系和通过这些抛光条件获得的加工形状（抛光量）与抛光对象的类型以及抛光条件（不变的抛光条件）预先输入到抛光条件确定机构中，被普遍用于抛光抛光的目的。抛光条件确定机构基于这些条件确定抛光条件。具体地说，以时间序列给出上述构成元件的抛光条件，或者将上述抛光条件构成元件的组合转换为抛光体的摆动速度的变化，并且与摆动位置相对应的摆动速度决心，决意，决定。抛光装置控制机构输入由抛光条件确定机构确定的抛光条件，并且控制抛光装置以便实现这些抛光条件。结果，可以简单且准确地确定在工作装置中获得规定加工形状的工作条件。

6. 发明申请

US20060258263A1 CHEMICAL MECHANICAL POLISHING END POINT DETECTION APPARATUS AND METHOD 有权
标题翻译：化学机械抛光端点检测装置及方法
公开(公告)号：US20060258263A1
公开(公告)日：2006-11-16
申请号：US11275715
申请日：2006-01-25
申请人： Andrew Barada , Takehiko Ueda
发明人： Andrew Barada , Takehiko Ueda
IPC分类号： B24B51/00 , B24B49/00 , B24B1/00
CPC分类号： B24B37/013 , B24B49/12
摘要： Methods and apparatus for substantially continuously measuring the surface of a wafer during a polishing process are disclosed. According to one aspect of the present invention, an apparatus includes a wafer support table that supports a wafer, a polishing pad that polishes a surface of the wafer, and a polishing pad structure that rotates the polishing pad over the surface of the wafer. The apparatus also includes a measuring device which is capable of continuously measuring the surface of the wafer during polishing of the surface of the wafer.
摘要翻译：公开了在抛光过程中基本上连续地测量晶片表面的方法和装置。根据本发明的一个方面，一种装置包括支撑晶片的晶片支撑台，抛光晶片表面的研磨垫，以及抛光垫结构，该抛光垫结构使抛光垫在晶片的表面上旋转。该装置还包括测量装置，其能够在抛光晶片表面期间连续地测量晶片的表面。

7. 发明授权

US06556179B2 Display device and camera having the display device 失效
标题翻译：具有显示装置的显示装置和相机
公开(公告)号：US06556179B2
公开(公告)日：2003-04-29
申请号：US09024509
申请日：1998-02-17
申请人： Toru Iwane , Toshimi Watanabe , Itaru Homma , Takehiko Ueda
发明人： Toru Iwane , Toshimi Watanabe , Itaru Homma , Takehiko Ueda
IPC分类号： G09G336
CPC分类号： G02F1/1334 , G02F2001/13347
摘要： Disclosed is a display device which comprises a pair of plate-like light transmittable members; a display member located so as to form a predetermined pattern between a pair of light transmittable members, the display member being composed of a material whose light transmittance is electrically changed; and a pair of light transmittable electrodes, at least one of a pair of light transmittable electrodes having a shape corresponding to the pattern, a pair of light transmittable electrodes being formed on a pair of light transmittable members and for electrically controlling the material. The camera having the display device comprises illuminating means for illuminating the display portion. The display portion is illuminated in accordance with a luminance of a subject. The illuminating light can be also used for measuring a distance and for illuminating another display element.
摘要翻译：公开了一种显示装置，其包括一对板状光透射部件; 显示构件，其被定位成在一对可透光构件之间形成预定图案，所述显示构件由透光率改变的材料构成; 以及一对可透光电极，具有对应于图案的形状的一对光透射电极中的至少一个，一对可透光电极，形成在一对透光构件上并用于电控制该材料。具有显示装置的相机包括用于照亮显示部分的照明装置。显示部分根据被摄体的亮度照亮。照明光也可用于测量距离并照亮另一显示元件。

8. 发明授权

US5933181A Photographic recording apparatus 失效
标题翻译：照相记录装置
公开(公告)号：US5933181A
公开(公告)日：1999-08-03
申请号：US623845
申请日：1996-03-29
申请人： Yukihiko Shimizu , Kinya Ueda , Yoshijiro Ushio , Masahiro Furuta , Takehiko Ueda
发明人： Yukihiko Shimizu , Kinya Ueda , Yoshijiro Ushio , Masahiro Furuta , Takehiko Ueda
IPC分类号： G02B5/20 , B41J2/44 , B41J2/45 , G02B3/00 , G02B13/00 , G03B27/50 , H04N1/50 , H04N9/07 , B41J2/47 , B41J2/435
CPC分类号： G02B3/0037 , B41J2/451 , G02B13/0095 , G02B3/0087 , H04N1/508 , G02B3/0056
摘要： A photographic recording apparatus capable of being small-sized and simplified in structure and reducing color aberration of an optical system. A refractive index distribution type lens array has a central axis arranged perpendicularly to a light emission direction of a fluorescent luminous tube. Light emitted from the fluorescent luminous tube passes through red (R), green (G) and blue (B) color filters, is incident on the lens array, is reflected on a first mirror and then is guided to a color film, resulting in forming an image on the color film. The fluorescent luminous tube is driven depending on data on R, G and B colors and the whole apparatus is moved with respect to the color film. The color filters are changed over and scan of the color film is carried out three times, so that an image of R, G and B colors may be formed on the color film.
摘要翻译：一种照相记录装置，其能够小型化并且简化了结构并降低了光学系统的色差。折射率分布型透镜阵列具有垂直于荧光发光管的发光方向排列的中心轴。从荧光发光管发出的光通过红色（R），绿色（G）和蓝色（B）滤色器，入射到透镜阵列上，在第一反射镜上反射，然后被引导到彩色胶片，导致在彩色胶片上形成图像。荧光发光管根据R，G和B颜色的数据驱动，整个装置相对于彩色胶片移动。滤色器被切换并且彩色胶片的扫描进行三次，从而可以在彩色胶片上形成R，G和B颜色的图像。

9. 发明授权

US4141730A Multilayer color photographic materials 失效
标题翻译：多层彩色摄影材料
公开(公告)号：US4141730A
公开(公告)日：1979-02-27
申请号：US674460
申请日：1976-04-07
申请人： Yoshisato Minagawa , Naoki Arai , Takehiko Ueda
发明人： Yoshisato Minagawa , Naoki Arai , Takehiko Ueda
IPC分类号： G03C7/333 , G03C7/04 , G03C1/76
CPC分类号： G03C7/3335
摘要： In a multilayer color photographic material essentially comprising a support having coated thereon, in succession, a red-sensitive silver halide emulsion layer and a green-sensitive silver halide emulsion layer, with an optional yellow filter layer and a blue-sensitive silver halide emulsion layer, by disposing a non-sensitive auxiliary layer containing a non-diffusible colored coupling compound which releases a diffusible dye at color development capable of being removed from the photographic layer at development, an effective masking can be applied to the side absorption of cyan dye image without reducing the sensitivity of the red-sensitive silver halide emulsion layer during storage before or after exposure.The red-sensitive silver halide emulsion layer may optionally be composed of two or more layers having different sensitivities, whereby the non-diffusible colored coupling compound can be incorporated into at least one layer selected from the non-sensitive auxiliary layer and a red-sensitive silver halide emulsion layer having high sensitivity.The non-diffusible colored coupling compound can be present in the following locations:(1) in a non-photosensitive layer which contains no photosensitive silver halide grains disposed under a red-sensitive emulsion layer and in contact therewith on a support;(2) in the most sensitive layer of two or more red-sensitive emulsion layers having different sensitivities;(3) in a non-photosensitive layer containing no light-sensitive silver halide grains disposed between a red-sensitive emulsion layer and a green-sensitive emulsion layer.In addition to being present in any one of (1), (2) and (3) above, the colored coupling compound can also be present in the layers of (1) plus (2), (1) plus (3), (2) plus (3) or (1) plus (2) plus (3).
摘要翻译：在基本上包括其上涂覆有载体的红色感光卤化银乳剂层和感绿卤化银乳剂层的多层彩色照相材料中，具有任选的黄色滤光层和感蓝卤化银乳剂层通过配置含有非扩散着色的偶联化合物的非敏感性辅助层，其在显色下释放可以从照相层去除的可扩展染料，可以有效地掩蔽青色染料图像的侧面吸收而不会在曝光前后的储存期间降低感红卤化银乳剂层的敏感性。

10. 发明授权

US07169016B2 Chemical mechanical polishing end point detection apparatus and method 有权
标题翻译：化学机械抛光终点检测装置及方法
公开(公告)号：US07169016B2
公开(公告)日：2007-01-30
申请号：US11275715
申请日：2006-01-25
申请人： Andrew H. Barada , Takehiko Ueda
发明人： Andrew H. Barada , Takehiko Ueda
IPC分类号： B24B49/12
CPC分类号： B24B37/013 , B24B49/12
摘要： Methods and apparatus for substantially continuously measuring the surface of a wafer during a polishing process are disclosed. According to one aspect of the present invention, an apparatus includes a wafer support table that supports a wafer, a polishing pad that polishes a surface of the wafer, and a polishing pad structure that rotates the polishing pad over the surface of the wafer. The apparatus also includes a measuring device which is capable of continuously measuring the surface of the wafer during polishing of the surface of the wafer.
摘要翻译：公开了在抛光过程中基本上连续地测量晶片表面的方法和装置。根据本发明的一个方面，一种装置包括支撑晶片的晶片支撑台，抛光晶片表面的研磨垫，以及抛光垫结构，该抛光垫结构使抛光垫在晶片的表面上旋转。该装置还包括测量装置，其能够在抛光晶片表面期间连续地测量晶片的表面。

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