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    • 2. 发明授权
    • Thermally enhanced leadframe for packages that utilize a large number of
leads
    • 使用大量引线的封装的热增强引线框架
    • US5532905A
    • 1996-07-02
    • US445037
    • 1995-05-19
    • Thomas D. Moore
    • Thomas D. Moore
    • H01L23/495H05K7/20
    • H01L23/49503H01L23/49541H01L23/49568H01L2224/48247H01L2224/49171H01L24/48H01L24/49H01L2924/00014H01L2924/14H01L2924/181H01L2924/3025
    • A leadframe that exhibits improved thermal dissipation and that can be incorporated into standard integrated circuit (IC) packages is provided by increasing the thermal cross-section between the leadframe paddle and the lead fingers (leads) so that the leads are utilized for conducting a significant amount of heat away from the IC. A larger thermal cross-section can be achieved by making the shape of the paddle perimeter nonlinear to increase the surface area of its edge. In the preferred embodiment, the paddle perimeter has a "serpentine" shape and the inner ends of the leads are placed in close proximity to the paddle perimeter and are shaped to substantially follow its serpentine shape. The shaped paddle and lead ends increase the thermal cross-section between the paddle and the leads, resulting in improved thermal conduction. The leads conduct the heat to the outside of the package, where it is dissipated into the circuit board on which the leadframe package is mounted. For a package with a large number of leads, the paddle perimeter preferably has a saw-tooth shape, with at least some of the leads positioned between adjacent teeth.
    • 通过增加引线框桨和引线指(引线)之间的热横截面来提供展现出改善的热耗散并且可以并入标准集成电路(IC)封装中的引线框架,以便引线用于进行显着的 远离IC的热量。 可以通过使桨叶的形状非线性地增加其边缘的表面积来实现更大的热横截面。 在优选实施例中,桨周边具有“蛇形”形状,并且引线的内端被放置成紧邻桨周边,并且被成形为基本上遵循其蛇形形状。 成形的桨叶和引导端增加了桨叶和引线之间的热横截面,导致改善的热传导。 引线将热量传导到封装的外部,并将其散发到安装引线框封装的电路板中。 对于具有大量引线的封装,桨周边优选地具有锯齿形状,其中至少一些引线位于相邻的齿之间。
    • 7. 发明授权
    • Thermally enhanced leadframe
    • 热增强引线框架
    • US5519576A
    • 1996-05-21
    • US445036
    • 1995-05-19
    • Thomas D. Moore
    • Thomas D. Moore
    • H01L23/495H05K7/20
    • H01L23/49503H01L23/49541H01L23/49568H01L2224/48247H01L2224/49171H01L24/48H01L24/49H01L2924/00014H01L2924/14H01L2924/181H01L2924/3025
    • A leadframe that exhibits improved thermal dissipation and that can be incorporated into standard integrated circuit (IC) packages is provided by increasing the thermal cross-section between the leadframe paddle and the lead fingers (leads) so that the leads are utilized for conducting a significant amount of heat away from the IC. A larger thermal cross-section can be achieved by making the shape of the paddle perimeter nonlinear to increase the surface area of its edge. In the preferred embodiment, the paddle perimeter has a "serpentine" shape and the inner ends of the leads are placed in close proximity to the paddle perimeter and are shaped to substantially follow its serpentine shape. The shaped paddle and lead ends increase the thermal cross-section between the paddle and the leads, resulting in improved thermal conduction. The leads conduct the heat to the outside of the package, where it is dissipated into the circuit board on which the leadframe package is mounted. For a package with a large number of leads, the paddle perimeter preferably has a saw-tooth shape, with at least some of the leads positioned between adjacent teeth.
    • 通过增加引线框桨和引线指(引线)之间的热横截面来提供展现出改善的热耗散并且可以并入标准集成电路(IC)封装中的引线框架,以便引线用于进行显着的 远离IC的热量。 可以通过使桨叶的形状非线性地增加其边缘的表面积来实现更大的热横截面。 在优选实施例中,桨周边具有“蛇形”形状,并且引线的内端被放置成紧邻桨周边,并且被成形为基本上遵循其蛇形形状。 成形的桨叶和引导端增加了桨叶和引线之间的热横截面,导致改善的热传导。 引线将热量传导到封装的外部,并将其散发到安装引线框封装的电路板中。 对于具有大量引线的封装,桨周边优选地具有锯齿形状,其中至少一些引线位于相邻的齿之间。
    • 8. 发明授权
    • Dynamic blocking in a shared host-network interface
    • 在共享的主机 - 网络接口中动态阻止
    • US07646724B2
    • 2010-01-12
    • US10435882
    • 2003-05-12
    • Thomas D. MooreBruce H. RatcliffJerry W. StevensStephen R. Valley
    • Thomas D. MooreBruce H. RatcliffJerry W. StevensStephen R. Valley
    • H04L1/00
    • H04L47/10H04L47/32
    • A method, system, and program product for a data processing system having multiple hosts which dynamically determines blocking of packets in the data processing system. A connection is established between a host and an adapter for communication with a Local Area Network. A set of parameters is established for blocking packets transmitted from the adapter to the host. The set of parameters is stored in the adapter to be used by that connection. The packets transmitted from the adapter to the host are grouped or blocked in accordance with the set of parameters for that connection. Periodically, the packets being transmitted from the adapter to the host are evaluated for determining changes in the parameters. Changes to the set of parameters are recorded in the adapter for that connection to the host. Where there are multiple connections established between the adapter and multiple hosts, a set of parameters to be used for each connection is established such that packets are blocked in accordance with a respective set of parameters for a respective one of the hosts.
    • 一种用于具有多个主机的数据处理系统的方法,系统和程序产品,所述多个主机动态地确定数据处理系统中的分组的阻塞。 在主机和适配器之间建立与局域网进行通信的连接。 建立一组参数来阻止从适配器发送到主机的数据包。 参数集存储在适配器中以供该连接使用。 根据该连接的一组参数,从适配器发送到主机的数据包被分组或阻塞。 定期地,从适配器发送到主机的分组被评估以确定参数的变化。 参数集中的更改记录在与主机的连接的适配器中。 在适配器和多个主机之间建立多个连接的地方,建立用于每个连接的一组参数,使得根据相应的一个主机的相应参数集来阻止分组。