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    • 1. 发明授权
    • Nanotube transistor integrated circuit layout
    • 纳米管晶体管集成电路布局
    • US07462890B1
    • 2008-12-09
    • US11466893
    • 2006-08-24
    • Thomas W. Tombler, Jr.Brian Y. Lim
    • Thomas W. Tombler, Jr.Brian Y. Lim
    • H01L31/036
    • H01L51/0558B82Y10/00H01L51/0048H01L51/057Y10S977/742Y10S977/936
    • An integrated circuit layout of a carbon nanotube transistor device includes a first and second conductive material. The first conductive material is connected to ends of single-walled carbon nanotubes below (or above) the first conductive material. The second conductive material is not electrically connected to the nanotubes below (or above) the second conductive material. The first conductive material may be metal, and the second conductive material may be polysilicon or metal. The nanotubes are perpendicular to the first conductive material. In one implementation, the first and second conductive materials form interdigitated fingers. In another implementation, the first conductive material forms a serpentine track.
    • 碳纳米管晶体管器件的集成电路布局包括第一和第二导电材料。 第一导电材料连接到第一导电材料下方(或上方)的单壁碳纳米管的端部。 第二导电材料不与第二导电材料的下方(或更上方)电连接到纳米管。 第一导电材料可以是金属,第二导电材料可以是多晶硅或金属。 纳米管垂直于第一导电材料。 在一个实施方案中,第一和第二导电材料形成叉指。 在另一实施方案中,第一导电材料形成蛇形轨迹。
    • 3. 发明授权
    • Removing undesirable nanotubes during nanotube device fabrication
    • 在纳米管器件制造过程中去除不需要的纳米管
    • US07943418B2
    • 2011-05-17
    • US11467058
    • 2006-08-24
    • Thomas W. Tombler, Jr.
    • Thomas W. Tombler, Jr.
    • H01L51/40
    • H01L51/057B82Y10/00B82Y40/00H01L51/0048
    • Fabricating single-walled carbon nanotube transistor devices includes removing undesirable types of nanotubes. These undesirable types of nanotubes may include nonsemiconducting nanotubes, multiwalled nanotubes, and others. The undesirable nanotubes may be removed electrically using voltage or current, or a combination of these. This approach to removing undesirable nanotubes is sometimes referred to as “burn-off.” The undesirable nanotubes may be removed chemically or using radiation. The undesirable nanotubes of an integrated circuit may be removed in sections or one transistor (or a group of transistors) at a time in order to reduce the electrical current used or prevent damage to the integrated circuit during burn-off.
    • 制造单壁碳纳米管晶体管器件包括去除不想要的类型的纳米管。 这些不期望的类型的纳米管可以包括非半导体纳米管,多壁纳米管等。 可以使用电压或电流或这些的组合来电除去不需要的纳米管。 这种去除不需要的纳米管的方法有时被称为“燃烧”。不期望的纳米管可以化学去除或使用辐射。 集成电路的不期望的纳米管可以在一段时间内去除部分或一个晶体管(或一组晶体管),以便减少所使用的电流或防止在烧坏期间对集成电路的损坏。
    • 4. 发明申请
    • Nanotube Device Having Nanotubes with Multiple Characteristics
    • 具有多重特性的纳米管的纳米管装置
    • US20100065820A1
    • 2010-03-18
    • US11276076
    • 2006-02-13
    • Thomas W. Tombler, JR.
    • Thomas W. Tombler, JR.
    • H01L29/66H01L21/336
    • H01L51/057B82Y10/00G06N99/007
    • A carbon nanotube of a nanotube device has at least two segments with different characteristics. The segments meet at a junction and a diameter of the carbon nanotube on either side of the junction is about the same. One segment may be doped differently from another segment. One segment may be p doped and another segment n doped. One segment may be doped with a different carrier concentration from another segment. The nanotube device may be used in power semiconductor devices including power diodes and power transistors. These power devices will be very power efficient, wasting significantly less energy than similar manufactured using silicon technology.
    • 纳米管装置的碳纳米管具有至少两个具有不同特征的区段。 这些段在接合点处相交,并且在结的任一侧上的碳纳米管的直径大致相同。 一个段可以与另一段不同地掺杂。 一个段可以是p掺杂的,另一个段n掺杂。 一个区段可以掺杂有来自另一段的不同载流子浓度。 纳米管器件可以用于包括功率二极管和功率晶体管的功率半导体器件中。 与使用硅技术的制造商相比,这些功率器件将具有很高的功率效率,浪费的能源明显减少。
    • 10. 发明申请
    • REMOVING UNDESIRABLE NANOTUBES DURING NANOTUBE DEVICE FABRICATION
    • 在纳米管设备制造期间拆卸不可穿戴的纳米管
    • US20110081770A1
    • 2011-04-07
    • US11467058
    • 2006-08-24
    • Thomas W. Tombler, JR.
    • Thomas W. Tombler, JR.
    • H01L21/28B82Y40/00
    • H01L51/057B82Y10/00B82Y40/00H01L51/0048
    • Fabricating single-walled carbon nanotube transistor devices includes removing undesirable types of nanotubes. These undesirable types of nanotubes may include nonsemiconducting nanotubes, multiwalled nanotubes, and others. The undesirable nanotubes may be removed electrically using voltage or current, or a combination of these. This approach to removing undesirable nanotubes is sometimes referred to as “burn-off.” The undesirable nanotubes may be removed chemically or using radiation. The undesirable nanotubes of an integrated circuit may be removed in sections or one transistor (or a group of transistors) at a time in order to reduce the electrical current used or prevent damage to the integrated circuit during burn-off.
    • 制造单壁碳纳米管晶体管器件包括去除不想要的类型的纳米管。 这些不期望的类型的纳米管可以包括非半导体纳米管,多壁纳米管等。 可以使用电压或电流或这些的组合来电除去不需要的纳米管。 这种去除不需要的纳米管的方法有时被称为“燃烧”。不期望的纳米管可以化学去除或使用辐射。 集成电路的不期望的纳米管可以在一段时间内去除部分或一个晶体管(或一组晶体管),以便减少所使用的电流或防止在烧坏期间对集成电路的损坏。