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1. 发明授权

US08394731B2 Composite woven fabric and printed wiring board 有权
标题翻译：复合机织布和印刷线路板
公开(公告)号：US08394731B2
公开(公告)日：2013-03-12
申请号：US12447653
申请日：2007-11-07
申请人： Akira Sato , Akira Fujinoki , Hiroyuki Nishimura , Tsukasa Sakaguchi
发明人： Akira Sato , Akira Fujinoki , Hiroyuki Nishimura , Tsukasa Sakaguchi
IPC分类号： D03D15/00
CPC分类号： H05K1/0366 , D02G3/04 , D02G3/18 , D03D1/0082 , D03D1/0088 , D03D15/00 , D03D15/0011 , D03D15/0016 , D03D15/0027 , D10B2101/06 , D10B2201/00 , D10B2321/02 , D10B2321/021 , D10B2321/022 , D10B2321/121 , H05K1/024 , H05K2201/0158 , H05K2201/0278 , H05K2201/029 , Y10T442/30 , Y10T442/313 , Y10T442/3138 , Y10T442/3976
摘要： Disclosed is a printed wiring board which attains aims of printed wiring boards required for realizing high-speed, high-frequency semiconductor devices, namely a printed wiring board having low dielectric constant, low dielectric loss tangent and low linear expansion coefficient. Also disclosed is a composite woven fabric suitably used as a base material for such a printed wiring board. Specifically disclosed is a composite woven fabric containing quartz glass fibers and polyolefin fibers, in which the ratio of the quartz glass fibers to the composite woven fabric is set at 10 vol % or more and 90 vol % or less. It is preferred that the quartz glass fibers each have a filament diameter of 3 μm or more and 16 μm or less, and the composite woven fabric has a thickness of 200 μm or less.
摘要翻译：公开了实现高速，高频半导体器件所需的印刷线路板的目的的印刷线路板，即具有低介电常数，低介电损耗角正切和低线膨胀系数的印刷线路板。还公开了适合用作这种印刷线路板的基材的复合机织织物。具体公开了含有石英玻璃纤维和聚烯烃纤维的复合机织织物，其中石英玻璃纤维与复合机织织物的比率设定在10体积％以上且90体积％以下。优选石英玻璃纤维的长丝直径为3μm以上且16μm以下，复合织物的厚度为200μm以下。

2. 发明申请

US20100065316A1 COMPOSITE WOVEN FABRIC AND PRINTED WIRING BOARD 有权
标题翻译：复合织物和印刷布线板
公开(公告)号：US20100065316A1
公开(公告)日：2010-03-18
申请号：US12447653
申请日：2007-11-07
申请人： Akira Sato , Akira Fujinoki , Hiroyuku Nishimura , Tsukasa Sakaguchi
发明人： Akira Sato , Akira Fujinoki , Hiroyuku Nishimura , Tsukasa Sakaguchi
IPC分类号： H05K1/02 , D03D15/00 , B32B5/00
CPC分类号： H05K1/0366 , D02G3/04 , D02G3/18 , D03D1/0082 , D03D1/0088 , D03D15/00 , D03D15/0011 , D03D15/0016 , D03D15/0027 , D10B2101/06 , D10B2201/00 , D10B2321/02 , D10B2321/021 , D10B2321/022 , D10B2321/121 , H05K1/024 , H05K2201/0158 , H05K2201/0278 , H05K2201/029 , Y10T442/30 , Y10T442/313 , Y10T442/3138 , Y10T442/3976
摘要： Disclosed is a printed wiring board which attains aims of printed wiring boards required for realizing high-speed, high-frequency semiconductor devices, namely a printed wiring board having low dielectric constant, low dielectric loss tangent and low linear expansion coefficient. Also disclosed is a composite woven fabric suitably used as a base material for such a printed wiring board. Specifically disclosed is a composite woven fabric containing quartz glass fibers and polyolefin fibers, in which the ratio of the quartz glass fibers to the composite woven fabric is set at 10 vol % or more and 90 vol % or less. It is preferred that the quartz glass fibers each have a filament diameter of 3 μm or more and 16 μm or less, and the composite woven fabric has a thickness of 200 μm or less.
摘要翻译：公开了实现高速，高频半导体器件所需的印刷线路板的目的的印刷线路板，即具有低介电常数，低介电损耗角正切和低线膨胀系数的印刷线路板。还公开了适合用作这种印刷线路板的基材的复合机织织物。具体公开了含有石英玻璃纤维和聚烯烃纤维的复合机织织物，其中石英玻璃纤维与复合机织织物的比率设定在10体积％以上且90体积％以下。优选石英玻璃纤维的长丝直径为3μm以上且16μm以下，复合织物的厚度为200μm以下。

3. 发明授权

US06849242B1 Porous silica granule, method for producing the same, and method for producing synthetic quartz glass powder using the porous silica granule 有权
标题翻译：多孔二氧化硅颗粒，其制造方法以及使用多孔二氧化硅颗粒制造合成石英玻璃粉末的方法
公开(公告)号：US06849242B1
公开(公告)日：2005-02-01
申请号：US09672438
申请日：2000-09-28
申请人： Rainer Koeppler , Fritz-Ulrich Kreis , Klaus Arnold , Hiroshi Matsui , Kasumi Hoshikawa , Tsukasa Sakaguchi
发明人： Rainer Koeppler , Fritz-Ulrich Kreis , Klaus Arnold , Hiroshi Matsui , Kasumi Hoshikawa , Tsukasa Sakaguchi
IPC分类号： C01B33/12 , C03B8/02 , C03B19/10 , C03C1/02 , C03C11/00
CPC分类号： C01B33/124 , C03B19/108 , C03C1/02 , C03C1/026 , C03C11/00
摘要： The granule consists of individual granules approximately spherical in shape, having a pore volume of 0.5 cm3, a mean diameter of pores of 50 nm or less, a specific surface area of 100 m2/g or less, and a bulk density of 0.7 g/cm3 or higher. It is produced by dispersing a fumed silica obtained by hydrolysis of a silicon compound into pure water to obtain a slurry, and drying the slurry. The granule is used for producing high purity synthetic quartz glass powder. The method further comprises: a first heat treatment under an oxygen-containing atmosphere, a second heat treatment in a temperature range of from 600 to 1100° C., and a third heat treatment in a temperature range of from 1100 to 1300° C. under an atmosphere containing hydrogen chloride; and a step of densification comprising calcining the product at a temperature not higher than 1500° C. under vacuum or in an atmosphere of gaseous hydrogen or gaseous helium. To calcine the powder without causing fusion adhesion of the particles, bubbling fluidization of said porous silica granule is conducted by supplying gaseous helium and calcining thereof in a temperature range of from 1000 to 1600° C.
摘要翻译：颗粒由近似球形的单个颗粒组成，孔体积为0.5cm 3，孔的平均直径为50nm以下，比表面积为100m 2 / g以下，堆积密度为0.7g / cm 3以上。通过将通过硅化合物的水解获得的热解法二氧化硅分散在纯水中得到浆料并干燥浆料而制备。该颗粒用于生产高纯度合成石英玻璃粉末。该方法还包括：在含氧气氛下进行第一次热处理，在600〜1100℃的温度范围进行第二次热处理，在1100〜1300℃的温度范围进行第三次热处理。在含有氯化氢的气氛下; 以及致密化步骤，包括在真空下或在气态氢气或气态氦气氛中，在不高于1500℃的温度下煅烧产品。为了煅烧粉末而不引起颗粒的熔融粘附，所述多孔二氧化硅颗粒的鼓泡流化是通过在1000至1600℃的温度范围内提供气态氦和煅烧来进行的。

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