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1. 发明授权

US09974186B2 Method of manufacturing printed circuit board with embedded electronic components positioned by using solder paste 有权
公开(公告)号：US09974186B2
公开(公告)日：2018-05-15
申请号：US15146418
申请日：2016-05-04
申请人： UNITECH PRINTED CIRCUIT BOARD CORP.
发明人： Ming Yi Yeh , Shun Yueh Hsu , Kun Chi Chen , Hung Min Chen
IPC分类号： H05K3/34 , H05K1/18 , H05K3/46 , H05K1/02
CPC分类号： H05K1/188 , H05K1/0266 , H05K1/186 , H05K3/3442 , H05K3/4679 , H05K2201/10015 , H05K2201/10022 , H05K2201/1003 , H05K2201/10106 , H05K2203/0361 , H05K2203/048 , H05K2203/166 , H05K2203/167 , H05K2203/308 , Y10T29/49124 , Y10T29/49144
摘要： A method of manufacturing a printed circuit board with embedded electronic components fixed by a solder paste includes: providing a carrier board with a copper foil layer on the carrier board, an insulating layer on the copper foil layer, and an opening on the insulating layer by laser; putting a solder paste into the opening to form a solder paste layer; performing a high-temperature reflow process of the electronic components on the solder paste layer until the solder paste layer is molten; curing the solder paste layer after cooling to fix the components to the center position of the opening; placing the copper foil layer below the electronic components and removing the solder paste layer; and performing copper plating and electroplating processes in an electroplating space to form a plating copper. The cohesion of the molten solder paste pulls the electronic components towards the center to eliminate position offset produced when the electronic components are installed.

2. 发明申请

US20030064325A1 Method of manufacturing printed circuit board having wiring layers electrically connected via solid cylindrical copper interconnecting bodies 审中-公开
标题翻译：具有通过实心圆柱形铜互连体电连接的布线层的印刷电路板的制造方法
公开(公告)号：US20030064325A1
公开(公告)日：2003-04-03
申请号：US09969043
申请日：2001-10-03
申请人： Unitech Printed Circuit Board Corp.
发明人： Cheng-Hsien Chou , Chien-Jung Huang , Lin-Chuan Lee
IPC分类号： G03F007/00
CPC分类号： H05K3/4647 , H05K3/243 , H05K2203/0542 , H05K2203/0733
摘要： A method of manufacturing a printed circuit board (PCB) having wiring layers electrically connected via solid cylindrical copper interconnecting bodies includes the following steps: locally providing on a base or an insulated layer with a first copper foil wiring layer; fully coating the first wiring layer with a conductive layer; coating areas on the first wiring layer that are not used for interconnection purpose with a layer of dry-film resist to expose other areas on the first wiring layer to be used for interconnection purpose; removing the conductive layer by micro etching; forming solid cylindrical copper interconnecting bodies of a desired height on the interconnecting areas through electric plating; removing the dry-film resist, so that the solid cylindrical copper interconnecting bodies consisting of pure copper project from the interconnecting areas; and providing a second wiring layer over the first wiring layer.
摘要翻译：一种制造具有通过实心圆柱形铜互连体电连接的布线层的印刷电路板（PCB）的方法包括以下步骤：在基底或绝缘层上局部提供第一铜箔布线层; 用导电层完全涂覆第一布线层; 在第一布线层上涂覆不用于互连目的的一层干膜抗蚀剂，以露出用于互连目的的第一布线层上的其它区域; 通过微蚀刻去除导电层; 通过电镀在互连区域上形成所需高度的实心圆柱形铜互连体; 去除干膜抗蚀剂，使得由纯铜构成的实心圆柱形铜互连体从互连区域突出; 以及在所述第一布线层上设置第二布线层。

3. 发明申请

US20170006708A1 METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD WITH EMBEDDED ELECTRONIC COMPONENTS POSITIONED BY USING SOLDER PASTE 有权
标题翻译：使用焊膏定位的嵌入式电子元件制造印刷电路板的方法
公开(公告)号：US20170006708A1
公开(公告)日：2017-01-05
申请号：US15146418
申请日：2016-05-04
申请人： UNITECH PRINTED CIRCUIT BOARD CORP.
发明人： MING YI YEH , SHUN YUEH HSU , KUN CHI CHEN , HUNG MIN CHEN
IPC分类号： H05K1/18 , H05K1/09 , H05K3/00 , H05K1/11 , H05K3/06 , H05K3/18 , H05K1/03 , H05K3/42 , H05K3/46 , H05K3/34
CPC分类号： H05K1/188 , H05K1/0266 , H05K1/186 , H05K3/3442 , H05K3/4679 , H05K2201/10015 , H05K2201/10022 , H05K2201/1003 , H05K2201/10106 , H05K2203/0361 , H05K2203/048 , H05K2203/166 , H05K2203/167 , H05K2203/308 , Y10T29/49124 , Y10T29/49144
摘要： A method of manufacturing a printed circuit board with embedded electronic components fixed by a solder paste includes: providing a carrier board with a copper foil layer on the carrier board, an insulating layer on the copper foil layer, and an opening on the insulating layer by laser; putting a solder paste into the opening to form a solder paste layer; performing a high-temperature reflow process of the electronic components on the solder paste layer until the solder paste layer is molten; curing the solder paste layer after cooling to fix the components to the center position of the opening; placing the copper foil layer below the electronic components and removing the solder paste layer; and performing copper plating and electroplating processes in an electroplating space to form a plating copper. The cohesion of the molten solder paste pulls the electronic components towards the center to eliminate position offset produced when the electronic components are installed.
摘要翻译：一种制造具有通过焊膏固定的嵌入式电子部件的印刷电路板的方法包括：在载体板上提供载体板上的铜箔层，铜箔层上的绝缘层和绝缘层上的开口激光; 将焊膏放入开口以形成焊膏层; 对焊膏层上的电子部件进行高温回流处理，直到焊膏层熔融为止; 冷却后固化焊膏层，将部件固定在开口的中心位置; 将铜箔层放置在电子元件下方并去除焊膏层; 并且在电镀空间中进行镀铜和电镀工艺以形成电镀铜。熔融焊膏的内聚力将电子部件朝向中心拉动，以消除当安装电子部件时产生的位置偏移。

4. 发明授权

US09443743B1 Method for directly attaching dielectric to circuit board with embedded electronic devices 有权
标题翻译：将电介质直接连接到具有嵌入式电子设备的电路板的方法
公开(公告)号：US09443743B1
公开(公告)日：2016-09-13
申请号：US14735871
申请日：2015-06-10
申请人： UNITECH PRINTED CIRCUIT BOARD CORP.
发明人： Ming Yi Yeh , Shun Yueh Hsu , Kun Chi Chen , Hung Min Chen
IPC分类号： H01L21/00 , H01L21/48 , H01L33/48 , H01L33/62 , H01L33/52
CPC分类号： H01L21/486 , H01L21/4857 , H01L23/49827 , H01L23/5389 , H01L24/24 , H01L24/82 , H01L25/167 , H01L33/486 , H01L33/52 , H01L33/62 , H01L2224/04105 , H01L2224/24195 , H01L2224/92144 , H01L2924/12041 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19105 , H01L2933/005 , H01L2933/0066 , H05K1/188 , H05K2201/10106 , H05K2201/10636 , H05K2201/10674 , H05K2203/063 , Y02P70/611
摘要： A method for directly attaching dielectric to a circuit board with embedded electronic devices is provided. That is, a plurality of through holes are produced before embedding an electronic device, wherein plural through holes are corresponding to a plurality of electrodes of the electronic device. So that the plural electrodes of the electronic device is accurately positioned with the through holes if the electronic device is being embedded. On the other hand, since the first dielectric layer is adhesive, the electronic device is directly stuck on the first dielectric layer in order to save cost of adhesive material or metal conductive paste in prior arts.
摘要翻译：提供了一种用于将电介质直接连接到具有嵌入式电子设备的电路板的方法。也就是说，在嵌入电子设备之前产生多个通孔，其中多个通孔对应于电子设备的多个电极。如果电子设备被嵌入，则电子设备的多个电极与通孔精确地定位。另一方面，由于第一电介质层是粘合剂，所以为了节约现有技术中的粘合剂材料或金属导电糊剂的成本，将电子设备直接粘贴在第一电介质层上。

5. 发明申请

US20030029034A1 Method of removing and replacing defective piece of printed circuit board formed on a panel 审中-公开
标题翻译：去除和更换在面板上形成的印刷电路板的有缺陷的部件的方法
公开(公告)号：US20030029034A1
公开(公告)日：2003-02-13
申请号：US09923452
申请日：2001-08-08
申请人： Unitech Printed Circuit Board Corp.
发明人： Cheng-Hsien Chou
IPC分类号： H05K003/36 , B23P017/00
CPC分类号： H05K3/0052 , H05K3/225 , H05K2201/09063 , H05K2201/0909 , Y10T29/49126 , Y10T29/49144 , Y10T29/4979
摘要： A method of removing and replacing a defective piece of printed circuit board formed on a panel, including the steps of using a router to form a breaking aperture at each connecting joint around a good piece on an unqualified panel, so that a connecting edge about 50 nullm long is left at each end of the breaking aperture, and breaking the connecting edges through one punch to remove the good piece from the panel; using the same way to remove a bad piece from a qualified panel to produce a void having size and shape identical to those of the removed good piece; positioning the removed good piece into the void; and filling the reconnected breaking aperture with bonding agent to securely connect the substitute good piece to the panel, allowing subsequent printing of solder layer and insertion of surface mounting devices to be smoothly completed on the panel.
摘要翻译：一种去除和更换形成在面板上的有缺陷的印刷电路板的方法，包括以下步骤：使用路由器在不合格面板上的好片周围的每个连接接头处形成断开孔，使得连接边缘约为50 在打开孔的每一端处留下长长的毛孔，并通过一个冲头将连接边缘打破以从面板上移除好的部件; 使用相同的方式从合格的面板中移除一个坏的部件，以产生具有与被移除的好部件相同的尺寸和形状的空隙; 将移除的好的部件放入空隙中; 并用接合剂填充重新连接的断路孔，以将替代的良好部件牢固地连接到面板，允许随后印刷焊料层并且在面板上平滑地完成表面安装装置的插入。

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