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    • 1. 发明授权
    • Electronic apparatus
    • 电子仪器
    • US08730663B2
    • 2014-05-20
    • US13352656
    • 2012-01-18
    • Sung Nien DuTing-Chiang HuangWei-Yi LinLi-Ting Wang
    • Sung Nien DuTing-Chiang HuangWei-Yi LinLi-Ting Wang
    • H05K5/00H05K7/00G06F1/20H05K7/20
    • G06F1/203
    • An electronic apparatus is disclosed, which comprises: a housing, configured with a plurality of inlets and one outlet; a plurality of electronic elements, disposed inside the housing; and a plurality of gates, arranged at positions corresponding to the plural inlets in an one-by-one manner; wherein, the plural electronic elements are activated while the electronic apparatus is enabled for causing the temperature of the plural electronic elements to be raised to their respective working temperatures, thereby, causing a plurality of heating zones to be formed inside the housing at positions respectively corresponding to the plural inlets; and by enabling each gate to be configured with one thermal expansion element that is enabled to deform with the temperature variation of the corresponding heating zone, each gate is enabled to move between a first position and a second position according to the deformation of the corresponding thermal expansion element.
    • 公开了一种电子设备,其包括:壳体,其配置有多个入口和一个出口; 设置在所述壳体内的多个电子元件; 以及多个门,以一个一个方式布置在与多个入口对应的位置处; 其中,当电子设备能够使多个电子元件的温度升高到其各自的工作温度时,多个电子元件被激活,从而在壳体内部分别形成多个加热区域 到多个入口; 并且通过使得每个门能够配置有能够随着相应的加热区域的温度变化而变形的一个热膨胀元件,每个门能够根据相应热量的变形在第一位置和第二位置之间移动 膨胀元件
    • 2. 发明申请
    • HEAT DISSIPATING MODULE
    • 散热模块
    • US20130141869A1
    • 2013-06-06
    • US13332577
    • 2011-12-21
    • WEI-YI LINTing-Chiang HuangLi-Ting WangSung Nien Du
    • WEI-YI LINTing-Chiang HuangLi-Ting WangSung Nien Du
    • H05K7/20
    • H01L23/433G06F1/20H01L23/467H01L2924/0002H01L2924/00
    • A heat dissipation module, comprising: a fan; and a heat dissipating fin; a heat conducting element, made of a conductive material, and composed of a first conductive component and two second conductive components in a manner that the first conductive component is disposed engaging with a heating element while allowing the two second conductive components to engage with the heat dissipating fin; and a wall element; wherein, the heat from the heating element is conducted to the first conductive component where it is further being dividedly conducted to the two second conductive components; and the air flow blowing from the fan is guided to the heating element and then it is blocked by the wall element for diverting the air flow toward the heat dissipating fin from an air intake side to an air outlet side, and then to be discharged out of the heat dissipating module through an outlet.
    • 一种散热模块,包括:风扇; 和散热片; 导电元件,由导电材料制成,并且由第一导电部件和两个第二导电部件组成,其中第一导电部件设置成与加热元件接合,同时允许两个第二导电部件与热接合 散热片 和墙元素; 其中,来自所述加热元件的热​​量被传导到所述第一导电部件,在所述第一导电部件中,所述第二导电部件被进一步分成两个第二导电部件; 从风扇吹出的空气流被引导到加热元件,然后被壁元件阻挡,用于将空气流朝向散热翅片从进气侧转向出气侧,然后排出 的散热模块。
    • 5. 发明申请
    • Fan and frame thereof
    • 风扇及其框架
    • US20080053639A1
    • 2008-03-06
    • US11898076
    • 2007-09-07
    • Wei-Yi LinHui-Neng YangPo-Hui ShenCheng-Chieh LiuKun-Ming LeeCheng-Wei Yan
    • Wei-Yi LinHui-Neng YangPo-Hui ShenCheng-Chieh LiuKun-Ming LeeCheng-Wei Yan
    • F28F7/00
    • H05K7/20172
    • A fan has a fan frame for accommodating a first circuit board and a second circuit board. A fan frame includes a housing, a base, and at least one supporting element. The base is disposed in the housing, and the base includes a bottom portion and a tube portion, which is connected to and extended from the bottom portion. The supporting element is connected between the housing and the base. There is a predetermined distance between the bottom portion of the base and an end of the housing so as to form an accommodating space, the first circuit board is disposed on the base and is located on a first side of the bottom portion facing the tube portion, and the second circuit board is disposed in the accommodating space which is located on a second side of the bottom portion facing away from the tube portion.
    • 风扇具有用于容纳第一电路板和第二电路板的风扇框架。 风扇框架包括壳体,基座和至少一个支撑元件。 基部设置在壳体中,并且基部包括底部和与底部连接并从底部延伸的管部。 支撑元件连接在壳体和底座之间。 在基座的底部与壳体的端部之间存在预定的距离,以形成容纳空间,第一电路板设置在基座上并且位于底部的面向管部分的第一侧上 并且所述第二电路板设置在所述容纳空间中,所述容纳空间位于所述底部的远离所述管部分的第二侧。