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    • 5. 发明申请
    • METHOD FOR MANUFACTURING SEMICONDUCTOR STRUCTURE
    • 制造半导体结构的方法
    • US20140287565A1
    • 2014-09-25
    • US14354894
    • 2011-12-02
    • Haizhou YinWeize Yu
    • Haizhou YinWeize Yu
    • H01L29/66
    • H01L29/66545H01L21/28H01L29/66575H01L29/78
    • The present invention provides a method for manufacturing a semiconductor structure, which comprises: a) providing a substrate (100); b) forming a dummy gate stack on the substrate (100), wherein the dummy gate stack consists of a gate dielectric layer (203) and a dummy gate (201) located on the gate dielectric layer (203), and the material of the dummy gate (201) is amorphous Si; c) performing ion implantation to regions exposed on both sides of the dummy gate (201) on the substrate (100), so as to form source/drain regions (110); d) forming an interlayer dielectric layer (400) that covers the source/drain regions (110) and the dummy gate stack; e) removing part of the interlayer dielectric layer (400) to expose the dummy gate (201) and removing the dummy gate (201); and f) annealing to activate dopants in source/drain regions. Procedures of the traditional gate-replacement process have been modified by the method for manufacturing a semiconductor structure provided by the present invention, thus etching period can be easily controlled, etching difficulty is alleviated, and stability of etching process is guaranteed as well.
    • 本发明提供一种制造半导体结构的方法,其包括:a)提供衬底(100); b)在所述衬底(100)上形成虚拟栅极堆叠,其中所述虚设栅极叠层由位于所述栅极介电层(203)上的栅极介电层(203)和伪栅极(201)组成, 伪栅极(201)是非晶Si; c)对在衬底(100)上的伪栅极(201)的两侧露出的区域进行离子注入,以形成源/漏区(110); d)形成覆盖源极/漏极区域(110)和虚拟栅极叠层的层间电介质层(400) e)去除所述层间介电层(400)的一部分以暴露所述虚拟栅极(201)并去除所述伪栅极(201); 和f)退火以激活源/漏区中的掺杂剂。 已经通过本发明提供的半导体结构的制造方法改进了传统的栅极替换工艺,因此可以容易地控制蚀刻时间,减轻蚀刻难度,并且保证蚀刻工艺的稳定性。
    • 6. 发明申请
    • Semiconductor Structure And Method For Manufacturing The Same
    • 半导体结构及其制造方法
    • US20130277768A1
    • 2013-10-24
    • US13816228
    • 2011-12-01
    • Haizhou YinWeize Yu
    • Haizhou YinWeize Yu
    • H01L29/66H01L29/78
    • H01L29/66545H01L21/28176H01L29/42368H01L29/513H01L29/518H01L29/66553H01L29/66575H01L29/78
    • The present invention provides a semiconductor structure and a method for manufacturing the same. The method comprises the following steps: providing a substrate and forming a sacrificial gate, sidewall spacers and source/drain regions located on both sides of the sacrificial gate; forming an interlayer dielectric layer that covers the device; removing the sacrificial gate to form a cavity within the sidewall spacers; forming first oxygen absorbing layers in the cavity; forming a second oxygen absorbing layer in the remaining of the space of the cavity; and performing an annealing step to make the surface of the substrate form an interfacial layer. The present invention further provides a semiconductor structure. By forming a symmetrical interfacial layer in a channel region, the present invention has reduced processing difficulty while effectively mitigating short-channel effects and preserving carrier mobility.
    • 本发明提供半导体结构及其制造方法。 该方法包括以下步骤:提供衬底并形成位于牺牲栅极两侧的牺牲栅极,侧壁间隔物和源极/漏极区域; 形成覆盖所述器件的层间电介质层; 去除所述牺牲栅极以在所述侧壁间隔件内形成空腔; 在空腔中形成第一氧吸收层; 在空腔的剩余部分中形成第二氧吸收层; 并进行退火步骤以使基材的表面形成界面层。 本发明还提供一种半导体结构。 通过在通道区域中形成对称的界面层,本发明降低了处理难度,同时有效地减轻了短沟道效应并保持了载流子迁移率。