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1. 发明授权

US08653673B2 Method for packaging semiconductors at a wafer level 有权
标题翻译：在晶圆级封装半导体的方法
公开(公告)号：US08653673B2
公开(公告)日：2014-02-18
申请号：US13331408
申请日：2011-12-20
申请人： Robert B. Hallock , William J. Davis , Yiwen Zhang , Ward G. Fillmore , Susan C. Trulli , Jason G. Milne
发明人： Robert B. Hallock , William J. Davis , Yiwen Zhang , Ward G. Fillmore , Susan C. Trulli , Jason G. Milne
IPC分类号： H01L23/48
CPC分类号： H01L23/3114 , H01L21/561 , H01L23/24 , H01L23/3121 , H01L23/3135 , H01L24/05 , H01L24/13 , H01L24/48 , H01L2224/0401 , H01L2224/04042 , H01L2224/05567 , H01L2224/131 , H01L2924/00014 , H01L2924/1461 , H01L2924/014 , H01L2924/00 , H01L2224/05552 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A package and method for packaging a semiconductor device formed in a surface portion of a semiconductor wafer. The package includes: a dielectric layer disposed on the surface portion of the semiconductor wafer having a device exposing opening to expose one of the devices and an electrical contacts pad opening to expose an electrical contact pad; and a porous material in the device exposing opening over said one of the devices.
摘要翻译：一种用于封装形成在半导体晶片的表面部分中的半导体器件的封装和方法。所述封装包括：设置在所述半导体晶片的表面部分上的电介质层，具有暴露开口以暴露所述器件中的一个的器件和用于暴露电接触焊盘的电触点焊盘开口; 以及所述装置中的多孔材料暴露在所述装置之一上的开口。

2. 发明授权

US08542720B2 Detection of outbound message signals in a power line two-way communications system 有权
标题翻译：在电力线双向通信系统中检测出站信息信号
公开(公告)号：US08542720B2
公开(公告)日：2013-09-24
申请号：US12596987
申请日：2008-04-18
申请人： Quentin H. Spencer , John B. Hessling, Jr. , Benjamin A. Hammond , Dennis L. Kelley , David W. Rieken , William J. Davis , Michael R. Walker, II
发明人： Quentin H. Spencer , John B. Hessling, Jr. , Benjamin A. Hammond , Dennis L. Kelley , David W. Rieken , William J. Davis , Michael R. Walker, II
IPC分类号： H04B1/38 , H04L27/00
CPC分类号： H04L7/042 , H04B3/542
摘要： Improvements in the detection of TWACS outbound message signals. A first improvement involves matching some (or all) of the intermediate points in an outbound preamble occurring between bits of the preamble currently being detected. This reduces the possibility of a false synchronization and therefore decreases the probability of missing outbound message signals. A second improvement is to require some or all of the known preamble bits to exceed a predetermined threshold where both the thresh-old and which bits are adjustable. An additional approach is using 4-8 additional buffers in a transponder to detect preamble patterns in the outbound message. Each half cycle of the outbound message waveform requires entering a bit only into the buffers active for the particular frame of reference in which the message is being transmitted, since only buffers for that frame of reference are employed. The process continues until all bits specified to be sent, based on the length of the outbound message, are extracted. A CRC is then performed for the message. Using this method eliminates the problem of inbound messages being detected as outbound messages, and the resulting “blindness” of the transponder. It further makes the transponders less sensitive to noise which currently causes the transponder to detect a preamble when there is none, resulting in a valid outbound message being missed.
摘要翻译：检测TWACS出站信息信号的改进。第一改进涉及匹配在当前正被检测的前同步码之间出现的出站前导码中的一些（或全部）中间点。这减少了错误同步的可能性，从而降低了丢失出站信息信号的可能性。第二个改进是要求一些或全部已知的前导码比特超过预定阈值，其中阈值和哪些位都是可调整的。另外一种方法是在应答器中使用4-8个附加缓冲区来检测出站消息中的前导码模式。出站消息波形的每个半周期只需要在针对正在发送消息的特定参考帧有效的缓冲区中输入一个比特，因为仅使用该参考帧的缓冲区。该过程继续，直到提取基于出站消息的长度指定发送的所有位。然后对消息执行CRC。使用此方法消除了入站邮件被检测为出站邮件的问题，以及由此导致的应答器的“盲目性”。它进一步使得应答器对噪声不太敏感，当前没有发送应答器会导致应答器检测到前同步码，从而导致有效的出站信息被丢失。

3. 发明申请

US20130154124A1 METHOD FOR PACKAGING SEMICONDUCTORS AT A WAFER LEVEL 有权
标题翻译：在半导体层上封装半导体的方法
公开(公告)号：US20130154124A1
公开(公告)日：2013-06-20
申请号：US13331408
申请日：2011-12-20
申请人： Robert B. Hallock , William J. Davis , Yiwen Zhang , Ward G. Fillmore , Susan C. Trulli , Jason G. Milne
发明人： Robert B. Hallock , William J. Davis , Yiwen Zhang , Ward G. Fillmore , Susan C. Trulli , Jason G. Milne
IPC分类号： H01L23/48 , H01L21/56
CPC分类号： H01L23/3114 , H01L21/561 , H01L23/24 , H01L23/3121 , H01L23/3135 , H01L24/05 , H01L24/13 , H01L24/48 , H01L2224/0401 , H01L2224/04042 , H01L2224/05567 , H01L2224/131 , H01L2924/00014 , H01L2924/1461 , H01L2924/014 , H01L2924/00 , H01L2224/05552 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A package and method for packaging a semiconductor device formed in a surface portion of a semiconductor wafer. The package includes: a dielectric layer disposed on the surface portion of the semiconductor wafer having a device exposing opening to expose one of the devices and an electrical contacts pad opening to expose an electrical contact pad; and a porous material in the device exposing opening over said one of the devices.
摘要翻译：一种用于封装形成在半导体晶片的表面部分中的半导体器件的封装和方法。所述封装包括：设置在所述半导体晶片的表面部分上的电介质层，具有暴露开口以暴露所述器件中的一个的器件和用于暴露电接触焊盘的电触点焊盘开口; 以及所述装置中的多孔材料暴露在所述装置之一上的开口。

4. 发明申请

US20120009735A1 METHOD FOR PACKAGING SEMICONDUCTORS AT WAFER LEVEL 有权
标题翻译：用于在水平层包装半导体的方法
公开(公告)号：US20120009735A1
公开(公告)日：2012-01-12
申请号：US13243179
申请日：2011-09-23
申请人： William J. Davis , Ward G. Fillmore , Scott MacDonald
发明人： William J. Davis , Ward G. Fillmore , Scott MacDonald
IPC分类号： H01L21/50
CPC分类号： H01L23/10 , H01L21/50 , H01L2224/48091 , H01L2924/1423 , H01L2924/1461 , H01L2924/00014 , H01L2924/00
摘要： A method for packaging a plurality of semiconductor devices formed in a surface portion of a semiconductor wafer. The method includes: lithographically forming, in a first lithographically processable material disposed on the surface portion of the semiconductor wafer, device exposing openings to expose the devices and electrical contact pad openings to expose electrical contact pads for devices; and mounting a support having a rigid dielectric layer formed on a selected portion of the support, such rigid dielectric layer comprising a second lithographically processable material, such rigid material being suspended over the device exposing openings and removed from portions of the support disposed over the electrical contacts pads openings in the first lithographically processable material. The support is released and removed from the second lithographically processable material, leaving the second photolithographically processable material bonded to the first photolithographically processable material.
摘要翻译：一种用于封装形成在半导体晶片的表面部分中的多个半导体器件的方法。该方法包括：在设置在半导体晶片的表面部分上的第一可光刻处理的材料中光刻形成设备，暴露出所述器件和电接触焊盘开口的开口以暴露用于器件的电接触焊盘; 以及安装具有形成在所述支撑件的选定部分上的刚性介电层的支撑件，所述刚性介电层包括第二可光刻处理的材料，所述刚性材料悬挂在所述装置上，露出开口并从所述电气第一可光刻处理材料中的接触垫开口。支撑体从第二种可光刻加工的材料中释放并除去，留下第二光刻加工材料结合到第一可光刻加工的材料上。

5. 发明授权

US08035219B2 Packaging semiconductors at wafer level 有权
标题翻译：在晶圆级封装半导体
公开(公告)号：US08035219B2
公开(公告)日：2011-10-11
申请号：US12175692
申请日：2008-07-18
申请人： William J. Davis , Ward G. Fillmore , Scott MacDonald
发明人： William J. Davis , Ward G. Fillmore , Scott MacDonald
IPC分类号： H01L23/12 , H01L21/00
CPC分类号： H01L23/10 , H01L21/50 , H01L2224/48091 , H01L2924/1423 , H01L2924/1461 , H01L2924/00014 , H01L2924/00
摘要： A method for packaging a plurality of semiconductor devices formed in a surface portion of a semiconductor wafer. The method includes: lithographically forming, in a first lithographically processable material disposed on the surface portion of the semiconductor wafer, device exposing openings to expose the devices and electrical contact pad openings to expose electrical contact pads for devices; and mounting a support having a rigid dielectric layer formed on a selected portion of the support, such rigid dielectric layer comprising a second lithographically processable material, such rigid material being suspended over the device exposing openings and removed from portions of the support disposed over the electrical contacts pads openings in the first lithographically processable material. The support is released and removed from the second lithographically processable material, leaving the second photolithographically processable material bonded to the first photolithographically processable material.
摘要翻译：一种用于封装形成在半导体晶片的表面部分中的多个半导体器件的方法。该方法包括：在设置在半导体晶片的表面部分上的第一可光刻处理的材料中光刻形成设备，暴露出所述器件和电接触焊盘开口的开口以暴露用于器件的电接触焊盘; 以及安装具有形成在所述支撑件的选定部分上的刚性介电层的支撑件，所述刚性介电层包括第二可光刻处理的材料，所述刚性材料悬挂在所述装置上，露出开口并从所述电气第一可光刻处理材料中的接触垫开口。支撑体从第二种可光刻加工的材料中释放并除去，留下第二光刻加工材料结合到第一可光刻加工的材料上。

6. 发明授权

US06256147B1 Compensating layer to reduce wavefront errors in coatings on mirrors for optical systems 失效
标题翻译：补偿层以减少用于光学系统的镜子上的涂层中的波前误差
公开(公告)号：US06256147B1
公开(公告)日：2001-07-03
申请号：US07612369
申请日：1990-11-14
申请人： William J. Davis
发明人： William J. Davis
IPC分类号： G02B110
CPC分类号： G02B27/0025 , G02B1/10 , G02B1/11 , G02B5/08 , Y10S359/90
摘要： A method is disclosed for reducing or eliminating the wavefront error caused by variations in the thickness of an optical coating applied to a mirror without requiring that the thickness variation in the optical coating be reduced to reduce the wavefront error. The reduction in the wavefront error is achieved by adding a compensating layer to the top of the optical coating. The thickness of the compensating layer is directly proportional to the thickness of the optical coating and inversely proportional to one minus the index of refraction of the material used for the compensating layer.
摘要翻译：公开了一种用于减少或消除由施加到反射镜的光学涂层的厚度变化引起的波前误差的方法，而不需要减小光学涂层中的厚度变化以减少波前误差。通过在光学涂层的顶部添加补偿层来实现波前误差的减小。补偿层的厚度与光学涂层的厚度成正比，与一个负值成反比，减去用于补偿层的材料的折射率。

7. 发明授权

US5082365A Remote identification and speed determination system 失效
标题翻译：远程识别和速度确定系统
公开(公告)号：US5082365A
公开(公告)日：1992-01-21
申请号：US458417
申请日：1989-12-28
申请人： Kenneth F. Kuzmick , Robert A. Kuzmick , William J. Davis
发明人： Kenneth F. Kuzmick , Robert A. Kuzmick , William J. Davis
IPC分类号： G01P3/68 , G06K7/10 , G07B15/02
CPC分类号： G06K7/10861 , G01P3/68 , G07B15/00
摘要： A remote object/vehicle identification and speed determination system including a bar code label on each object/vehicle and a device for continuously scanning an area to determine when the object/vehicle is present at a predetermined distance from the scanning device. The scanning device may be responsive to ambient visible or invisible radiation from the label. Each label includes unique identification data for the object/vehicle as well as spaced framing signals used for making distance determinations. Each label may be invisible and may be on or in the windshield of a vehicle.The signals from the scanning device are sampled continuously and the sampled signals are stepped along a shift register. Parallel outputs from the shift register are continuously analyzed so that signals from a single scan across a label are sufficient to determine if an object/vehicle is at a predetermined distance from the scanning device and to read the unique identification data.Speed determinations are made by using the change in apparent size of the label to determine when an object/vehicle passes two predetermined distances from the scanning device and measuring the time lapse between the two passing events. The speed and the unique identification of the object/vehicle are both obtained.
摘要翻译：包括每个物体/车辆上的条形码标签的远程物体/车辆识别和速度确定系统以及用于连续地扫描区域的装置，以确定物体/车辆何时存在于距扫描装置预定距离处。扫描装置可以响应来自标签的环境可见或不可见的辐射。每个标签包括用于对象/车辆的唯一识别数据以及用于进行距离确定的间隔成帧信号。每个标签可能是不可见的，并且可以在车辆的挡风玻璃上或挡风玻璃上。来自扫描装置的信号被连续采样，采样信号沿移位寄存器步进。持续分析来自移位寄存器的并行输出，使得跨标签的单次扫描的信号足以确定物体/车辆是否距离扫描装置处于预定距离并且读取唯一的识别数据。通过使用标签的表观尺寸的变化来确定物体/车辆何时从扫描装置通过两个预定距离并测量两次传递事件之间的时间间隔来进行速度确定。获得对象/车辆的速度和唯一识别。

8. 发明授权

US4481509A Raster-scanned display system for digitally-encoded graphics 失效
标题翻译：用于数字编码图形的光栅扫描显示系统
公开(公告)号：US4481509A
公开(公告)日：1984-11-06
申请号：US512569
申请日：1983-07-11
申请人： Akira Sasaki , William J. Davis
发明人： Akira Sasaki , William J. Davis
IPC分类号： G09G1/04 , G09G5/391 , G09G1/16
CPC分类号： G09G5/391 , G09G1/04
摘要： The positional resolution of a display of graphic information generated from a digital-encoded description taken from memory is improved without increasing the fine-line resolution of the display, this being done to reduce the memory required to store the digitally encoded description of the display. The departure of the pixels in the display from their normal position in a raster defined by a relatively coarse scanning line structure and limited video bandwidth is digitally encoded; and the bits of the code are stored in respective memory planes, each having an array of storage locations mapping the normal positions of pixels in the display raster.
摘要翻译：从存储器获取的数字编码描述生成的图形信息的显示的位置分辨率得到改善，而不增加显示器的细线分辨率，这是为了减少存储显示器的数字编码描述所需的存储器。在由相对粗略的扫描线结构和受限视频带宽限定的光栅中的显示器中的像素从它们的正常位置的偏离被数字编码; 并且代码的位被存储在相应的存储器平面中，每个存储器平面具有映射显示栅格中的像素的正常位置的存储位置的阵列。

9. 发明授权

US4374232A Graft copolymer membrane and processes of manufacturing and using the same 失效
标题翻译：接枝共聚物膜及其制造和使用过程
公开(公告)号：US4374232A
公开(公告)日：1983-02-15
申请号：US263222
申请日：1981-05-13
申请人： William J. Davis
发明人： William J. Davis
IPC分类号： C08F291/00 , H01M2/16 , C08F279/00
CPC分类号： H01M2/1666 , C08F291/00 , H01M2/1653 , H01M2300/0014
摘要： A cast film, sheet or coating of a crosslinked graft copolymer of an organic polymeric substrate and an ethylenically unsaturated organic monomer is formed by effecting the graft copolymerization while the polymeric substrate and monomer are in solution in a solvent thereby to form the crosslinked graft copolymer in the form of a gel, subjecting the gel to high shear forces to convert it to a thixotropic suspension, forming the thixotropic suspension into a layer, and removing the solvent from the layer.
摘要翻译：有机聚合物基质和烯属不饱和有机单体的交联接枝共聚物的流延膜，片或涂层是通过在聚合物基体和单体溶于溶剂中进行接枝共聚而形成的，由此形成交联的接枝共聚物凝胶的形式，使凝胶经受高剪切力将其转化成触变性悬浮液，将触变悬浮液形成层，并从层中除去溶剂。

10. 发明授权

US08754421B2 Method for processing semiconductors using a combination of electron beam and optical lithography 有权
标题翻译：使用电子束和光学光刻的组合处理半导体的方法
公开(公告)号：US08754421B2
公开(公告)日：2014-06-17
申请号：US13404245
申请日：2012-02-24
申请人： Paul J. Duval , Kamal Tabatabaie , William J. Davis
发明人： Paul J. Duval , Kamal Tabatabaie , William J. Davis
IPC分类号： H01L29/201 , H01L21/30
CPC分类号： H01L21/71 , G03F9/7076 , G03F9/708 , H01L23/544 , H01L2223/5442 , H01L2223/54426 , H01L2223/54453 , H01L2924/0002 , H01L2924/00
摘要： Forming an alignment mark on a semiconductor structure using an optical lithography to form a metal alignment mark on a substrate of the structure, using the formed metal alignment mark to form a first feature of a semiconductor device being formed on the substrate using optical lithography, and using the formed metal alignment mark to form a second, different feature for the semiconductor using electron beam lithography. In one embodiment, the first feature is an ohmic contact, the second feature is a Schottky contact, the metal alignment mark is a refractory metal or a refractory metal compound having an atomic weight greater than 60 such as TaN and the semiconductor device is a GaN semiconductor device. A semiconductor structure having a metal alignment mark on a zero layer of the structure, the metal alignment mark is a TaN and the semiconductor is GaN.
摘要翻译：使用光刻法在半导体结构上形成对准标记，以在结构的基板上形成金属对准标记，使用所形成的金属对准标记，以形成利用光刻法形成在基板上的半导体器件的第一特征，以及使用形成的金属对准标记来形成使用电子束光刻的半导体的第二不同特征。在一个实施例中，第一特征是欧姆接触，第二特征是肖特基接触，金属对准标记是原子量大于60的难熔金属或难熔金属化合物，例如TaN，并且半导体器件是GaN 半导体器件。在结构的零层上具有金属对准标记的半导体结构，金属对准标记为TaN，半导体为GaN。

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