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1. 发明公开

US20240140905A1 LEVELER AND ELECTROPLATING COMPOSITION FOR FILLING VIA HOLE 审中-公开
公开(公告)号：US20240140905A1
公开(公告)日：2024-05-02
申请号：US18342397
申请日：2023-06-27
申请人： YMT CO., LTD.
发明人： Dea Geun KIM , Sung Wook CHUN , Bo Mook CHUNG , Nak Eun KO
IPC分类号： C25D3/38 , C07D233/64 , C07D241/12
CPC分类号： C25D3/38 , C07D233/64 , C07D241/12
摘要： The present invention relates to a leveler capable of efficiently filling the inside of via holes formed during the manufacturing process of a printed circuit board, and an electroplating composition comprising the same. When via holes on a substrate are filled with the electroplating composition according to the present invention, the via holes can be filled in a relatively short time while minimizing the formation of dimples or voids.

2. 发明申请

US20230020180A1 CARRIER FOIL-ATTACHED METAL FOIL, METHOD OF MANUFACTURING THE SAME, AND LAMINATE INCLUDING THE SAME 有权
公开(公告)号：US20230020180A1
公开(公告)日：2023-01-19
申请号：US17779955
申请日：2020-10-15
申请人： YMT CO.,LTD.
发明人： Hyun Woo JEON , Bo Mook CHUNG , Sung Wook CHUN
IPC分类号： C25D5/10 , C25D3/56 , C25D3/38 , B32B5/02 , B32B15/14 , C09D7/63
摘要： The present invention relates to a carrier foil-attached metal foil including a release layer having a specific composition and structure, a method of manufacturing the carrier foil-attached metal foil, and a laminate for forming a printed circuit board including the carrier foil-attached metal foil. The laminate for forming a printed circuit board according to the present invention comprises the carrier foil-attached metal foil, so that a defect rate can be minimized.

3. 发明申请

US20150327364A1 METHOD FOR PRODUCING SUBSTRATE FORMED WITH COPPER THIN LAYER, METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARD AND PRINTED CIRCUIT BOARD MANUFACTURED THEREBY 有权
标题翻译：用铜薄膜制造底材的方法，制造印刷电路板的方法和印刷电路板的制造方法
公开(公告)号：US20150327364A1
公开(公告)日：2015-11-12
申请号：US14273541
申请日：2014-05-08
申请人： YMT CO., LTD.
发明人： Sung Wook CHUN
IPC分类号： H05K1/03 , H05K3/18 , C25D5/02 , H05K1/09 , H05K3/06
CPC分类号： C25D5/02 , B32B15/017 , C23C18/38 , C23F1/36 , C25D5/022 , H05K1/03 , H05K1/09 , H05K3/025 , H05K3/062 , H05K3/188 , H05K2203/0152 , Y10T428/12479 , Y10T428/24917
摘要： One embodiment of the present disclosure provides a method for producing a substrate formed with a copper thin layer. The method includes providing a carrier, forming a separation-inducing layer on the surface of the carrier, forming a copper thin layer on the separation-inducing layer, and bonding a core to the copper thin layer.
摘要翻译：本公开的一个实施方案提供了一种用铜薄层形成的基板的制造方法。该方法包括提供载体，在载体的表面上形成分离诱导层，在分离诱导层上形成铜薄层，并将芯结合到铜薄层上。

4. 发明公开

US20240260200A1 METAL FOIL WITH CARRIER FOIL, LAMINATE FOR PRINTED WIRING BOARD USING SAME, AND MANUFACTURING METHOD FOR LAMINATE 审中-公开
公开(公告)号：US20240260200A1
公开(公告)日：2024-08-01
申请号：US18290528
申请日：2022-06-24
申请人： YMT CO., LTD.
发明人： Sung Wook CHUN , Bo Mook CHUNG , Myong Whan PARK
IPC分类号： H05K3/46 , H05K3/04
CPC分类号： H05K3/4652 , H05K3/048 , H05K3/4661
摘要： The present invention relates to a carrier foil-attached metal foil, a laminate for a printed wiring board manufactured using the carrier foil-attached metal foil, and a manufacturing method of the laminate for the printed wiring board.

5. 发明公开

US20240015885A1 METAL FOIL, METAL FOIL WITH CARRIER COMPRISING SAME, AND PRINTED CIRCUIT BOARD COMPRISING SAME 审中-公开
公开(公告)号：US20240015885A1
公开(公告)日：2024-01-11
申请号：US18038671
申请日：2021-12-10
申请人： YMT CO., LTD
发明人： Sung Wook CHUN , Bo Mook CHUNG , Dea Geun KIM , Myong Hwan PARK , Nak Eun KO , Ju Yong SIM
IPC分类号： H05K1/09 , H05K1/02
CPC分类号： H05K1/09 , H05K1/0237 , H05K2201/0355
摘要： The present invention relates to a metal foil having a rough surface, a carrier-attached metal foil including the metal foil, and a printed circuit board manufactured using the metal foil. The rough surface is naturally formed during formation of the metal foil. The formation of the rough surface allows the metal foil to have a high adhesive strength to an insulating resin substrate and enables the manufacture of a printed circuit board with improved efficiency.

6. 发明授权

US09758889B2 Method for producing substrate formed with copper thin layer, method for manufacturing printed circuit board and printed circuit board manufactured thereby 有权
公开(公告)号：US09758889B2
公开(公告)日：2017-09-12
申请号：US14273541
申请日：2014-05-08
申请人： YMT CO., LTD.
发明人： Sung Wook Chun
IPC分类号： C25D5/02 , B32B15/01 , H05K1/03 , H05K1/09 , H05K3/06 , H05K3/18 , H05K3/02
CPC分类号： C25D5/02 , B32B15/017 , C23C18/38 , C23F1/36 , C25D5/022 , H05K1/03 , H05K1/09 , H05K3/025 , H05K3/062 , H05K3/188 , H05K2203/0152 , Y10T428/12479 , Y10T428/24917
摘要： One embodiment of the present disclosure provides a method for producing a substrate formed with a copper thin layer. The method includes providing a carrier, forming a separation-inducing layer on the surface of the carrier, forming a copper thin layer on the separation-inducing layer, and bonding a core to the copper thin layer.

7. 发明申请

US20140098504A1 ELECTROPLATING METHOD FOR PRINTED CIRCUIT BOARD 审中-公开
标题翻译：印刷电路板电镀方法
公开(公告)号：US20140098504A1
公开(公告)日：2014-04-10
申请号：US13678973
申请日：2012-11-16
申请人： YMT CO., LTD.
发明人： Sung-Wook CHUN , Jung Il Kim , Young Kuk Kim
IPC分类号： H05K3/18 , H05K1/09
CPC分类号： H05K3/188 , C25D3/562 , C25D5/12 , C25D7/00 , H05K1/092 , H05K3/108 , H05K3/243 , H05K2203/0574 , H05K2203/0723
摘要： Disclosed is an electroplating method for printed circuit board. The method includes: providing a printed circuit board including a circuit pattern, a pad part on which components are mounted, a terminal part for electrical connection to an external device, and a connector part; masking the portion of the printed circuit board other than the terminal part and the connector part; dipping the printed circuit board in a nickel-tungsten alloy plating solution including a water-soluble nickel compound, a water-soluble tungsten compound, a complexing agent, and a ductility improver; forming a nickel-tungsten alloy plated layer on each of the exposed portions of the terminal part and the connector part by direct-current (DC) electroplating; and forming a gold-containing plated layer on the nickel-tungsten alloy plated layer by DC electroplating.
摘要翻译：公开了一种用于印刷电路板的电镀方法。该方法包括：提供包括电路图案的印刷电路板，安装有部件的焊盘部分，用于与外部设备电连接的端子部分和连接器部分; 遮蔽除了端子部分和连接器部分之外的印刷电路板的部分; 将印刷电路板浸渍在包含水溶性镍化合物，水溶性钨化合物，络合剂和延展性改进剂的镍 - 钨合金电镀溶液中; 通过直流（DC）电镀在端子部分和连接器部分的每个暴露部分上形成镍 - 钨合金镀层; 并通过直流电镀在镍 - 钨合金镀层上形成含金的镀层。

8. 发明公开

US20240237229A9 RELEASE LAYER FOR METAL FOIL WITH CARRIER AND METAL FOIL COMPRISING THE SAME 审中-公开
公开(公告)号：US20240237229A9
公开(公告)日：2024-07-11
申请号：US18271461
申请日：2021-12-10
申请人： YMT CO., LTD.
发明人： Sung Wook CHUN , Bo Mook CHUNG , Dea Geun KIM , Myong Hwan PARK , Nak Eun KO , Ju Yong SIM
IPC分类号： H05K3/38 , C09J7/40
CPC分类号： H05K3/382 , C09J7/401 , H05K1/0237
摘要： The present invention relates to a release layer for a metal foil with carrier and a metal foil with carrier including the release layer. The release layer is designed for easy removal of the carrier and includes one or more nitrogenous heterocyclic compounds and one or more inorganic compounds containing at least one metal selected from the group consisting of nickel, molybdenum, cobalt, phosphorus, manganese, and iron.

9. 发明公开

US20240174812A1 LEVELING AGENT AND ELECTROPLATING COMPOSITION FOR FORMING CIRCUIT PATTERN INCLUDING THE SAME 审中-公开
公开(公告)号：US20240174812A1
公开(公告)日：2024-05-30
申请号：US17926111
申请日：2022-06-24
申请人： YMT CO., LTD.
发明人： Sung Wook CHUN , Bo Mook CHUNG , Dae Geun KIM , Nak Eun KO , Ju Yong SIM
IPC分类号： C08G73/18 , C08G59/18 , C08G59/40 , C08G73/02 , C08G73/06 , C25D3/38
CPC分类号： C08G73/18 , C08G59/182 , C08G59/4064 , C08G73/0273 , C08G73/0627 , C25D3/38
摘要： Provided is a leveling agent that controls a plating process for forming a circuit pattern. The leveling agent allows the circuit pattern to have a uniform height and square shape even though the circuit pattern has various line widths. Also provided is an electroplating composition including the leveling agent.

10. 发明公开

US20240138075A1 RELEASE LAYER FOR METAL FOIL WITH CARRIER AND METAL FOIL COMPRISING THE SAME 审中-公开
公开(公告)号：US20240138075A1
公开(公告)日：2024-04-25
申请号：US18271461
申请日：2021-12-10
申请人： YMT CO>< LTD.
发明人： Sung Wook CHUN , Bo Mook CHUNG , Dea Geun KIM , Myong Hwan PARK , Nak Eun KO , Ju Young SIM
IPC分类号： H05K3/38 , C09J7/40
CPC分类号： H05K3/382 , C09J7/401 , H05K1/0237
摘要： The present invention relates to a release layer for a metal foil with carrier and a metal foil with carrier including the release layer. The release layer is designed for easy removal of the carrier and includes one or more nitrogenous heterocyclic compounds and one or more inorganic compounds containing at least one metal selected from the group consisting of nickel, molybdenum, cobalt, phosphorus, manganese, and iron.

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