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    • 10. 发明申请
    • LIQUID EJECTION HEAD AND METHOD OF MANUFACTURING THE SAME
    • 液体喷射头及其制造方法
    • US20130201249A1
    • 2013-08-08
    • US13749346
    • 2013-01-24
    • Yoshihiro HamadaTadayoshi InamotoIsao ImamuraHiroki Kihara
    • Yoshihiro HamadaTadayoshi InamotoIsao ImamuraHiroki Kihara
    • B41J2/01H01L21/02
    • B41J2/01B41J2/14024B41J2/14072H01L21/02126
    • A liquid ejection head includes: a chip including a substrate having an energy generating element, an ejection orifice member, and an electrode terminal; an electric wiring board; a support member for supporting the wiring board, the support member having an opening surrounding the chip; a chip periphery sealing member which fills a gap between the chip and the opening; and an electrically connecting portion sealing member disposed in contact with the chip periphery sealing member and which covers an electrically connecting portion between the chip and the electric wiring board. The electrically connecting portion sealing member is a cured product of a material containing filler. The chip periphery sealing member is a cured product of a material containing at least one of specific siloxanes. The chip periphery sealing member and the electrically connecting portion sealing member has a difference in coefficient of linear expansion of 50 ppm/° C. or more.
    • 液体喷射头包括:包括具有能量产生元件的基板,喷射孔构件和电极端子的芯片; 电气布线板; 用于支撑所述布线板的支撑构件,所述支撑构件具有围绕所述芯片的开口; 填充芯片和开口之间的间隙的芯片周边密封构件; 以及电连接部密封部件,其与所述芯片周边密封部件接触地设置,并且覆盖所述芯片和所述电气布线板之间的电连接部。 电连接部密封部件是含有填料的材料的固化物。 芯片周边密封构件是含有至少一种特定硅氧烷的材料的固化产物。 芯片周边密封构件和电连接部密封构件的线性膨胀系数差为50ppm /℃以上。