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    • 1. 发明申请
    • SEMICONDUCTOR MEMORY DEVICE AND DATA WRITE METHOD THEREOF
    • 半导体存储器件及其数据写入方法
    • US20120257456A1
    • 2012-10-11
    • US13525978
    • 2012-06-18
    • Yukio KOMATSU
    • Yukio KOMATSU
    • G11C16/06
    • G11C11/5628G11C16/0483G11C16/10G11C16/24G11C16/3459G11C2211/5621
    • A semiconductor memory device includes a control circuit. The control circuit executes control to perform a verify operation with respect to only a lowest threshold voltage level of a memory cell at a time of a data write operation, and to skip the verify operation with respect to the other threshold voltage levels. The control circuit determines whether a verify pass bit number of the lowest threshold voltage level, which is counted by a bit scan circuit, is a prescribed bit number or more, and the control circuit further executes control, if the verify pass bit number is the prescribed bit number or more, to perform the verify operation with respect to only the lowest threshold voltage level and a threshold voltage level that is higher than the lowest threshold voltage level, and to skip the verify operation with respect to the other threshold voltage levels.
    • 半导体存储器件包括控制电路。 控制电路执行控制,以在数据写入操作时仅对存储单元的最低阈值电压电平执行验证操作,并且跳过相对于其它阈值电压电平的验证操作。 控制电路确定由位扫描电路计数的最低阈值电压电平的验证通过位数是否为规定位数或更多,并且如果验证通过位数为 规定的位数以上,仅对最低阈值电压电平和高于最低阈值电压电平的阈值电压电平进行验证操作,并且跳过关于其它阈值电压电平的验证操作。
    • 2. 发明授权
    • Semiconductor memory device and data write method thereof
    • 半导体存储器件及其数据写入方法
    • US07948804B2
    • 2011-05-24
    • US12535040
    • 2009-08-04
    • Yukio Komatsu
    • Yukio Komatsu
    • G11C16/06
    • G11C11/5628G11C16/0483G11C16/10G11C16/24G11C16/3459G11C2211/5621
    • A semiconductor memory device includes a control circuit. The control circuit executes control to perform a verify operation with respect to only a lowest threshold voltage level of a memory cell at a time of a data write operation, and to skip the verify operation with respect to the other threshold voltage levels. The control circuit determines whether a verify pass bit number of the lowest threshold voltage level, which is counted by a bit scan circuit, is a prescribed bit number or more, and the control circuit further executes control, if the verify pass bit number is the prescribed bit number or more, to perform the verify operation with respect to only the lowest threshold voltage level and a threshold voltage level that is higher than the lowest threshold voltage level, and to skip the verify operation with respect to the other threshold voltage levels.
    • 半导体存储器件包括控制电路。 控制电路执行控制,以在数据写入操作时仅对存储单元的最低阈值电压电平执行验证操作,并且跳过相对于其它阈值电压电平的验证操作。 控制电路确定由位扫描电路计数的最低阈值电压电平的验证通过位数是否为规定位数或更多,并且如果验证通过位数为 规定的位数以上,仅对最低阈值电压电平和高于最低阈值电压电平的阈值电压电平进行验证操作,并且跳过关于其它阈值电压电平的验证操作。
    • 6. 发明授权
    • Semiconductor memory device and data write method thereof
    • 半导体存储器件及其数据写入方法
    • US08223557B2
    • 2012-07-17
    • US13099962
    • 2011-05-03
    • Yukio Komatsu
    • Yukio Komatsu
    • G11C16/06
    • G11C11/5628G11C16/0483G11C16/10G11C16/24G11C16/3459G11C2211/5621
    • A semiconductor memory device includes a control circuit. The control circuit executes control to perform a verify operation with respect to only a lowest threshold voltage level of a memory cell at a time of a data write operation, and to skip the verify operation with respect to the other threshold voltage levels. The control circuit determines whether a verify pass bit number of the lowest threshold voltage level, which is counted by a bit scan circuit, is a prescribed bit number or more, and the control circuit further executes control, if the verify pass bit number is the prescribed bit number or more, to perform the verify operation with respect to only the lowest threshold voltage level and a threshold voltage level that is higher than the lowest threshold voltage level, and to skip the verify operation with respect to the other threshold voltage levels.
    • 半导体存储器件包括控制电路。 控制电路执行控制以在数据写入操作时仅对存储单元的最低阈值电压电平执行验证操作,并且跳过相对于其它阈值电压电平的验证操作。 控制电路确定由位扫描电路计数的最低阈值电压电平的验证通过位数是否为规定的位数或更多,并且如果验证通过位数为 规定的位数以上,仅对最低阈值电压电平和高于最低阈值电压电平的阈值电压电平进行验证操作,并且跳过关于其他阈值电压电平的验证操作。
    • 7. 发明申请
    • SEMICONDUCTOR MEMORY DEVICE AND DATA WRITE METHOD THEREOF
    • 半导体存储器件及其数据写入方法
    • US20110205807A1
    • 2011-08-25
    • US13099962
    • 2011-05-03
    • Yukio KOMATSU
    • Yukio KOMATSU
    • G11C16/06
    • G11C11/5628G11C16/0483G11C16/10G11C16/24G11C16/3459G11C2211/5621
    • A semiconductor memory device includes a control circuit. The control circuit executes control to perform a verify operation with respect to only a lowest threshold voltage level of a memory cell at a time of a data write operation, and to skip the verify operation with respect to the other threshold voltage levels. The control circuit determines whether a verify pass bit number of the lowest threshold voltage level, which is counted by a bit scan circuit, is a prescribed bit number or more, and the control circuit further executes control, if the verify pass bit number is the prescribed bit number or more, to perform the verify operation with respect to only the lowest threshold voltage level and a threshold voltage level that is higher than the lowest threshold voltage level, and to skip the verify operation with respect to the other threshold voltage levels.
    • 半导体存储器件包括控制电路。 控制电路执行控制,以在数据写入操作时仅对存储单元的最低阈值电压电平执行验证操作,并且跳过相对于其它阈值电压电平的验证操作。 控制电路确定由位扫描电路计数的最低阈值电压电平的验证通过位数是否为规定位数或更多,并且如果验证通过位数为 规定的位数以上,仅对最低阈值电压电平和高于最低阈值电压电平的阈值电压电平进行验证操作,并且跳过关于其它阈值电压电平的验证操作。
    • 8. 发明授权
    • Method for manufacturing SIMOX wafer
    • 制造SIMOX晶圆的方法
    • US07807545B2
    • 2010-10-05
    • US11670636
    • 2007-02-02
    • Yoshiro AokiYukio KomatsuTetsuya NakaiSeiichi Nakamura
    • Yoshiro AokiYukio KomatsuTetsuya NakaiSeiichi Nakamura
    • H01L21/76H01L21/265H01L21/31H01L21/469
    • H01L21/76243
    • A SIMOX wafer having a BOX layer with a thin film thickness is obtained without a reduction in productivity or deterioration in quality. In a method for manufacturing a SIMOX wafer comprising: a step of forming a first ion-implanted layer in a silicon wafer; a step of forming a second ion-implanted layer that is in an amorphous state; and a high-temperature heat treatment step of maintaining the wafer in an oxygen contained atmosphere at a temperature that is not lower than 1300° C. but less than a silicon melting point for 6 to 36 hours to change the first and the second ion-implanted layers into a BOX layer, a gas containing chlorine that is not less than 0.1 volume % but less than 1.0 volume % is mixed into an atmosphere during temperature elevation in the high-temperature heat treatment.
    • 获得具有薄膜厚度的BOX层的SIMOX晶片,而不会降低生产率或质量劣化。 一种用于制造SIMOX晶片的方法,包括:在硅晶片中形成第一离子注入层的步骤; 形成处于非晶态的第二离子注入层的步骤; 以及将晶片保持在含氧气氛中的不低于1300℃但小于硅熔点6〜36小时的高温热处理步骤,以改变第一和第二离子交换树脂, 将注入层置于BOX层中,在高温热处理的升温过程中将含有不少于0.1体积%但小于1.0体积%的氯的气体混入大气中。
    • 9. 发明申请
    • Method for Manufacturing Simox Wafer and Simox Wafer Obtained by This Method
    • 通过该方法获得的Simox晶圆和Simox晶圆的制造方法
    • US20070238269A1
    • 2007-10-11
    • US11695706
    • 2007-04-03
    • Yoshiro AokiRiyuusuke KasamatsuYukio Komatsu
    • Yoshiro AokiRiyuusuke KasamatsuYukio Komatsu
    • H01L21/20
    • H01L21/76243
    • It is an object of the present invention to provide a method for manufacturing SIMOX wafer, wherein roughness Rms of a measurement area of 10 square micrometers in a surface of an SOI layer and roughness Rms of a measurement area of 10 square micrometers in an interface between the SOI layer and a BOX layer can be reduced respectively and a SIMOX obtained by the method. The method is to manufacture a SIMOX wafer comprising; a step of forming a first ion-implanted layer 12 containing highly concentrated oxygen within a wafer 11; a step of forming a second ion-implanted amorphous layer 13; and a high temperature heat treatment step of transforming the first and second ion-implanted layers into a BOX layer 15 by holding the wafer at a temperature between 1300° C. or more and a temperature less than a silicon melting point in an atmosphere containing oxygen, wherein when a first dose amount in the step of forming the first ion-implanted layer is set to 2×1017 to 3×1017 atoms/cm2, the first implantation energy is set to 165 to 240 keV and a second dose amount in the step of forming the second ion-implanted layer is set to 1×1014 to 1×1016 atoms/cm2.
    • 本发明的目的是提供一种制造SIMOX晶片的方法,其中在SOI层的表面上的测量面积为10平方微米的粗糙度Rms和在10μm的界面上的测量面积为10平方微米的粗糙度Rms 可以分别降低SOI层和BOX层,并通过该方法获得SIMOX。 该方法是制造SIMOX晶片,其包括: 在晶片11内形成含有高浓度氧的第一离子注入层12的步骤; 形成第二离子注入非晶层13的步骤; 以及高温热处理步骤,通过将晶片保持在含有氧气的气氛中在1300℃以上的温度和小于硅熔点的温度下,将第一和第二离子注入层转变成BOX层15 其中当形成第一离子注入层的步骤中的第一剂量设定为2×10 17至3×10 17原子/ cm 2时, >,将第一注入能量设定为165至240keV,并且在形成第二离子注入层的步骤中的第二剂量设定为1×10 14至1×10 16 >原子/ cm 2。