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1. 发明申请

US20130243239A1 PLANAR SPEAKER SYSTEM 有权
公开(公告)号：US20130243239A1
公开(公告)日：2013-09-19
申请号：US13419874
申请日：2012-03-14
申请人： Zhijun Zhao
发明人： Zhijun Zhao
IPC分类号： H04R1/00
CPC分类号： H04R9/06 , H04R7/04 , H04R7/045 , H04R7/12 , H04R9/025
摘要： A planar speaker system may include a bottom frame having a cavity. Within this cavity a plurality of magnets may be arranged to form a substantially circular pattern. A diaphragm that includes a plurality of electrically conductive traces may be connected to the bottom frame and extend across the cavity of the bottom frame. When alternating current flows through the electrically conductive traces, the diaphragm may vibrate in response to the interaction between the current flowing in the electrically conductive traces and the magnetic field, thereby producing sound. The planar speaker system may include a top frame having a cavity, and a second set of magnets may be disposed in the cavity of the top frame.

2. 发明申请

US20080075318A1 SPIDER WITH SPIRAL TINSEL LEAD AND TRANSDUCER AND LOUDSPEAKER COMPRISING SAME 审中-公开
标题翻译：具有螺旋导管的传感器和传感器和包括其的扬声器
公开(公告)号：US20080075318A1
公开(公告)日：2008-03-27
申请号：US11845857
申请日：2007-08-28
申请人： Zhijun Zhao
发明人： Zhijun Zhao
IPC分类号： H04R9/06 , H04R1/00 , H04R11/02
CPC分类号： H04R9/043
摘要： A spider for a loudspeaker. The spider comprises a spider plate with integrated leads. The spider plate is an annular plate that forms a wave shape in the radial section. Each lead, when installed, assumes a generally spiral shape passing up and down through the spider plate along its length so the spiral formed by the installed lead extends radially from the inner opening of the spider plate. The internal abrasion of the leads is very small; the reliability and lifespan of the leads are increased, and loudspeaker power is enhanced, and loudspeaker operating time is extended.
摘要翻译：一个扬声器的蜘蛛。蜘蛛包括具有集成引线的蜘蛛板。蜘蛛板是在径向部分形成波形的环形板。每个引线在安装时呈现大致螺旋形状，沿着其长度上下穿过蜘蛛板，使得由安装的引线形成的螺旋从蜘蛛板的内部开口径向延伸。引线的内部磨损非常小; 引线的可靠性和寿命增加，扬声器功率提高，扬声器工作时间延长。

3. 发明授权

US06731773B1 Dual basket speaker with replaceable, self-aligning cone assembly and super ventilated pole piece 失效
标题翻译：双篮式扬声器，可更换，自调心锥形组件和超通风极片
公开(公告)号：US06731773B1
公开(公告)日：2004-05-04
申请号：US10286431
申请日：2002-11-01
申请人： Chanc L. Bergbower , Zhijun Zhao
发明人： Chanc L. Bergbower , Zhijun Zhao
IPC分类号： H04R2500
CPC分类号： H04R9/06
摘要： A speaker with a replaceable cone assembly. The motor assembly has its own basket, which is mounted in the enclosure. The cone assembly also has its own basket, which fits inside the motor basket. In the event of damage or malfunction in the cone or coil, the entire cone assembly is easily removed and replaced, while the motor assembly and the main basket remain undisturbed in the enclosure. Preferably, the speaker includes a pole with additional vents to improve heat dissipation. The pole has a pole cap with vent openings aligned with the secondary vent passages in the pole. The pole cap has a plug to occlude the front end opening of the central or primary vent passage in the pole. The top of the cap is domed to provide a guide surface for the former as the replacement cone assembly is inserted in the motor assembly.
摘要翻译：带可更换锥形组件的扬声器。马达组件具有自己的篮子，其安装在外壳中。锥形组件还具有自己的篮子，其装配在马达篮内。在锥体或线圈中发生损坏或故障的情况下，整个锥形组件易于拆卸和更换，而电机组件和主篮子在外壳中保持不受干扰。优选地，扬声器包括具有附加通风口的极以改善散热。极杆有一个带有排气孔的极帽，排气孔与杆中的二次通气通道对齐。极帽具有塞子以堵塞杆中的中央或主通风通道的前端开口。由于更换锥形组件插入电机组件中，盖的顶部圆顶形成为前者的导向面。

4. 发明授权

US08983112B2 Planar speaker system 有权
标题翻译：平面扬声器系统
公开(公告)号：US08983112B2
公开(公告)日：2015-03-17
申请号：US13419874
申请日：2012-03-14
申请人： Zhijun Zhao
发明人： Zhijun Zhao
IPC分类号： H04R9/06 , H04R7/04 , H04R7/12 , H04R9/02
CPC分类号： H04R9/06 , H04R7/04 , H04R7/045 , H04R7/12 , H04R9/025
摘要： A planar speaker system may include a bottom frame having a cavity. Within this cavity a plurality of magnets may be arranged to form a substantially circular pattern. A diaphragm that includes a plurality of electrically conductive traces may be connected to the bottom frame and extend across the cavity of the bottom frame. When alternating current flows through the electrically conductive traces, the diaphragm may vibrate in response to the interaction between the current flowing in the electrically conductive traces and the magnetic field, thereby producing sound. The planar speaker system may include a top frame having a cavity, and a second set of magnets may be disposed in the cavity of the top frame.
摘要翻译：平面扬声器系统可以包括具有空腔的底部框架。在该空腔内，可以布置多个磁体以形成基本圆形的图案。包括多个导电迹线的隔膜可以连接到底部框架并延伸穿过底部框架的空腔。当交流电流流过导电迹线时，隔膜可以响应于在导电迹线中流动的电流与磁场之间的相互作用而振动，从而产生声音。平面扬声器系统可以包括具有空腔的顶部框架，并且第二组磁体可以设置在顶部框架的空腔中。

5. 发明申请

US20130243238A1 PLANAR SPEAKER SYSTEM 有权
标题翻译：平面扬声器系统
公开(公告)号：US20130243238A1
公开(公告)日：2013-09-19
申请号：US13419858
申请日：2012-03-14
申请人： Zhijun Zhao
发明人： Zhijun Zhao
IPC分类号： H04R1/00
CPC分类号： H04R7/045
摘要： A planar speaker system may include a bottom frame having a cavity. Within this cavity a plurality of magnets may be arranged to form a substantially circular pattern. A diaphragm that includes a plurality of electrically conductive traces may be connected to the bottom frame and extend across the cavity of the bottom frame. When alternating current flows through the electrically conductive traces, the diaphragm may vibrate in response to the interaction between the current flowing in the electrically conductive traces and the magnetic field, thereby producing sound. The planar speaker system may include a top frame having a cavity, and a second set of magnets may be disposed in the cavity of the top frame.
摘要翻译：平面扬声器系统可以包括具有空腔的底部框架。在该空腔内，可以布置多个磁体以形成基本圆形的图案。包括多个导电迹线的隔膜可以连接到底部框架并延伸穿过底部框架的空腔。当交流电流流过导电迹线时，隔膜可以响应于在导电迹线中流动的电流与磁场之间的相互作用而振动，从而产生声音。平面扬声器系统可以包括具有空腔的顶部框架，并且第二组磁体可以设置在顶部框架的空腔中。

6. 发明授权

US06968069B1 Low-profile tweeter with lateral air chamber 失效
标题翻译：薄型高音扬声器带侧向气室
公开(公告)号：US06968069B1
公开(公告)日：2005-11-22
申请号：US10752071
申请日：2004-01-06
申请人： Zhijun Zhao
发明人： Zhijun Zhao
IPC分类号： H04R9/02 , H04R9/06 , H04R25/00
CPC分类号： H04R9/06 , H04R9/025 , H04R2499/13
摘要： A vented tweeter with a low profile particularly suited for automotive applications where the mounting depth is limited. The tweeter comprises a motor with a central air passage extending through it and a lateral air chamber formed around it. Radial channels on the top of the motor connect the air gap in the motor with the central air passage, and radial channels under the motor connect the central air passage with the lateral air chamber. As the diaphragm oscillates, air can move back and forth between the air gap around the magnet and lateral space outside the motor. This configuration substantially increases the volume of air that can be acted on by the diaphragm without significantly increasing the length of the assembled tweeter or compromising the power of the motor. To enhance the power of the motor, a secondary magnet can be included above the top plate.
摘要翻译：具有低外形的通风高音单元特别适用于安装深度有限的汽车应用。高音单元包括具有延伸穿过其的中央空气通道的马达和围绕其形成的侧向空气室。电机顶部的径向通道将电机的气隙与中央空气通道相连，电动机下方的径向通道将中央空气通道与侧风室连接起来。当隔膜振荡时，空气可以在磁体周围的气隙和电动机外部的横向空间之间来回移动。这种构造大大增加了可以由隔膜作用的空气的体积，而不显着增加组装的高音单元的长度或损害电动机的功率。为了增强电机的功率，可以在顶板上方包括二次磁体。

7. 发明授权

US08948441B2 Planar speaker system 有权
公开(公告)号：US08948441B2
公开(公告)日：2015-02-03
申请号：US13419858
申请日：2012-03-14
申请人： Zhijun Zhao
发明人： Zhijun Zhao
IPC分类号： H04R1/00
CPC分类号： H04R7/045
摘要： A planar speaker system may include a bottom frame having a cavity. Within this cavity a plurality of magnets may be arranged to form a substantially circular pattern. A diaphragm that includes a plurality of electrically conductive traces may be connected to the bottom frame and extend across the cavity of the bottom frame. When alternating current flows through the electrically conductive traces, the diaphragm may vibrate in response to the interaction between the current flowing in the electrically conductive traces and the magnetic field, thereby producing sound. The planar speaker system may include a top frame having a cavity, and a second set of magnets may be disposed in the cavity of the top frame.

8. 发明授权

US08836136B2 Package-on-package assembly with wire bond vias 有权
标题翻译：带导线通孔的封装封装组件
公开(公告)号：US08836136B2
公开(公告)日：2014-09-16
申请号：US13405108
申请日：2012-02-24
申请人： Ellis Chau , Reynaldo Co , Roseann Alatorre , Philip Damberg , Wei-Shun Wang , Se Young Yang , Zhijun Zhao
发明人： Ellis Chau , Reynaldo Co , Roseann Alatorre , Philip Damberg , Wei-Shun Wang , Se Young Yang , Zhijun Zhao
IPC分类号： H01L23/48
CPC分类号： H01L24/85 , H01L21/4853 , H01L21/56 , H01L21/565 , H01L23/3114 , H01L23/3128 , H01L23/3677 , H01L23/4334 , H01L23/49517 , H01L23/49811 , H01L23/49816 , H01L24/06 , H01L24/16 , H01L24/43 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/78 , H01L25/0655 , H01L25/0657 , H01L25/105 , H01L25/50 , H01L2224/0401 , H01L2224/05599 , H01L2224/131 , H01L2224/16145 , H01L2224/16225 , H01L2224/16227 , H01L2224/32145 , H01L2224/32225 , H01L2224/32245 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/4554 , H01L2224/45565 , H01L2224/48091 , H01L2224/48145 , H01L2224/48227 , H01L2224/4824 , H01L2224/48245 , H01L2224/48247 , H01L2224/48997 , H01L2224/49171 , H01L2224/73204 , H01L2224/73207 , H01L2224/73253 , H01L2224/73257 , H01L2224/73265 , H01L2224/78301 , H01L2224/851 , H01L2224/8518 , H01L2224/85399 , H01L2224/85951 , H01L2224/85986 , H01L2225/06506 , H01L2225/0651 , H01L2225/06513 , H01L2225/06517 , H01L2225/06558 , H01L2225/06562 , H01L2225/06565 , H01L2225/06568 , H01L2225/1023 , H01L2225/1029 , H01L2225/1052 , H01L2225/1058 , H01L2225/1088 , H01L2225/1094 , H01L2924/00011 , H01L2924/00012 , H01L2924/00014 , H01L2924/01013 , H01L2924/01028 , H01L2924/01029 , H01L2924/01047 , H01L2924/01049 , H01L2924/12042 , H01L2924/1431 , H01L2924/1434 , H01L2924/15311 , H01L2924/15331 , H01L2924/1715 , H01L2924/181 , H01L2924/1815 , H01L2924/19107 , H01L2924/3511 , H05K3/3436 , H05K2201/10515 , H05K2201/1053 , Y10T29/49149 , Y10T29/49151 , H01L2224/45664 , H01L2924/00 , H01L2924/014 , H01L2924/20751 , H01L2924/20752 , H01L2924/20753 , H01L2924/20754 , H01L2924/20755 , H01L2924/20756 , H01L2924/20757 , H01L2924/20758 , H01L2924/20759 , H01L2924/2076
摘要： A microelectronic package can include wire bonds having bases bonded to respective conductive elements on a substrate and ends opposite the bases. A dielectric encapsulation layer extending from the substrate covers portions of the wire bonds such that covered portions of the wire bonds are separated from one another by the encapsulation layer, wherein unencapsulated portions of the wire bonds are defined by portions of the wire bonds which are uncovered by the encapsulation layer. Unencapsulated portions can be disposed at positions in a pattern having a minimum pitch which is greater than a first minimum pitch between bases of adjacent wire bonds.
摘要翻译：微电子封装可以包括引线键合，其具有结合到衬底上的相应导电元件的底部并且与基底相对的端部。从衬底延伸的电介质封装层覆盖引线接合的部分，使得引线键合的被覆部分通过封装层彼此分离，其中引线键合的未封装部分由未被覆盖的引线键的部分限定通过封装层。未封装的部分可以布置在具有最小间距的图案的位置处，该最小间距大于相邻引线键的基部之间的第一最小间距。

9. 发明申请

US20130093088A1 PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BOND VIAS 有权
标题翻译：包装封装组装与线束VIAS
公开(公告)号：US20130093088A1
公开(公告)日：2013-04-18
申请号：US13405108
申请日：2012-02-24
申请人： Ellis Chau , Reynaldo Co , Roseann Alatorre , Philip Damberg , Wei-Shun Wang , Se Young Yang , Zhijun Zhao
发明人： Ellis Chau , Reynaldo Co , Roseann Alatorre , Philip Damberg , Wei-Shun Wang , Se Young Yang , Zhijun Zhao
IPC分类号： H01L23/498 , H01L21/56
CPC分类号： H01L24/85 , H01L21/4853 , H01L21/56 , H01L21/565 , H01L23/3114 , H01L23/3128 , H01L23/3677 , H01L23/4334 , H01L23/49517 , H01L23/49811 , H01L23/49816 , H01L24/06 , H01L24/16 , H01L24/43 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/78 , H01L25/0655 , H01L25/0657 , H01L25/105 , H01L25/50 , H01L2224/0401 , H01L2224/05599 , H01L2224/131 , H01L2224/16145 , H01L2224/16225 , H01L2224/16227 , H01L2224/32145 , H01L2224/32225 , H01L2224/32245 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/4554 , H01L2224/45565 , H01L2224/48091 , H01L2224/48145 , H01L2224/48227 , H01L2224/4824 , H01L2224/48245 , H01L2224/48247 , H01L2224/48997 , H01L2224/49171 , H01L2224/73204 , H01L2224/73207 , H01L2224/73253 , H01L2224/73257 , H01L2224/73265 , H01L2224/78301 , H01L2224/851 , H01L2224/8518 , H01L2224/85399 , H01L2224/85951 , H01L2224/85986 , H01L2225/06506 , H01L2225/0651 , H01L2225/06513 , H01L2225/06517 , H01L2225/06558 , H01L2225/06562 , H01L2225/06565 , H01L2225/06568 , H01L2225/1023 , H01L2225/1029 , H01L2225/1052 , H01L2225/1058 , H01L2225/1088 , H01L2225/1094 , H01L2924/00011 , H01L2924/00012 , H01L2924/00014 , H01L2924/01013 , H01L2924/01028 , H01L2924/01029 , H01L2924/01047 , H01L2924/01049 , H01L2924/12042 , H01L2924/1431 , H01L2924/1434 , H01L2924/15311 , H01L2924/15331 , H01L2924/1715 , H01L2924/181 , H01L2924/1815 , H01L2924/19107 , H01L2924/3511 , H05K3/3436 , H05K2201/10515 , H05K2201/1053 , Y10T29/49149 , Y10T29/49151 , H01L2224/45664 , H01L2924/00 , H01L2924/014 , H01L2924/20751 , H01L2924/20752 , H01L2924/20753 , H01L2924/20754 , H01L2924/20755 , H01L2924/20756 , H01L2924/20757 , H01L2924/20758 , H01L2924/20759 , H01L2924/2076
摘要： A microelectronic package can include wire bonds having bases bonded to respective conductive elements on a substrate and ends opposite the bases. A dielectric encapsulation layer extending from the substrate covers portions of the wire bonds such that covered portions of the wire bonds are separated from one another by the encapsulation layer, wherein unencapsulated portions of the wire bonds are defined by portions of the wire bonds which are uncovered by the encapsulation layer. Unencapsulated portions can be disposed at positions in a pattern having a minimum pitch which is greater than a first minimum pitch between bases of adjacent wire bonds.
摘要翻译：微电子封装可以包括引线键合，其具有结合到衬底上的相应导电元件的底部并且与基底相对的端部。从衬底延伸的电介质封装层覆盖引线接合的部分，使得引线键合的被覆部分通过封装层彼此分离，其中引线键合的未封装部分由未被覆盖的引线键的部分限定通过封装层。未封装的部分可以布置在具有最小间距的图案的位置处，该最小间距大于相邻引线键的基部之间的第一最小间距。

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