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    • 9. 发明申请
    • THERMAL MODULE WITH ENHANCED ASSEMBLING STRUCTURE
    • 具有增强组装结构的热模块
    • US20150260462A1
    • 2015-09-17
    • US14205275
    • 2014-03-11
    • ASIA VITAL COMPONENTS CO., LTD.
    • Sheng-Huang LinKuo-Sheng Lin
    • F28D15/02
    • F28D15/0275F28D15/0233
    • A thermal module with enhanced assembling structure includes a base and a heat pipe. The base is formed on a middle portion with a longitudinal receiving recess, which has two end portions forming two supporting portions and a middle portion formed into an opening. A first and a second extended arm are formed at junctions between the receiving recess and two longitudinal sides of the opening. Wall surfaces of the first and second extended arms adjacent to the longitudinal sides of the opening are formed with alternating elevated and sunken areas. The heat pipe is held down in the receiving recess by the first and second extended arms to fitly engage with the elevated and sunken areas. Therefore, there is an increased fitting tightness between the heat pipe and the base to ensure enhanced assembling strength of the thermal module and reduce the manufacturing cost thereof.
    • 具有增强的组装结构的热模块包括基座和热管。 基部形成在具有纵向容纳凹部的中间部分上,其具有形成两个支撑部分的两个端部和形成开口的中间部分。 第一和第二延伸臂形成在接收凹槽和开口的两个纵向侧之间的接合处。 与开口的纵向侧面相邻的第一和第二延伸臂的壁表面形成有交替的升高和下沉的区域。 热管通过第一和第二延伸臂压住接收凹槽,以与升高的和凹陷的区域适配地接合。 因此,在热管与基座之间存在增加的配合密封性,以确保增加热模块的组装强度并降低其制造成本。