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1. 发明授权

US11070006B2 Connector for low loss interconnection system 有权
公开(公告)号：US11070006B2
公开(公告)日：2021-07-20
申请号：US16054807
申请日：2018-08-03
申请人： Amphenol Corporation
发明人： Mark W. Gailus , Allan Astbury , David Manter , Marc B. Cartier, Jr. , Vysakh Sivarajan , John Robert Dunham
IPC分类号： H01R13/6471 , H01R12/72 , H01R13/514 , H01R24/30 , H01R13/6477 , H01R4/02 , H01R12/70 , H01R12/71 , H05K1/02 , H05K3/32 , H01R13/6587 , H01R12/52 , H01R13/6474
摘要： A modular electrical connector facilitates low loss connections to components on a printed circuit board. A portion is of the connector is formed of one or more first type units with conductive elements designed to be attached to a printed circuit board. Signals passing through those units may be routed to components on the printed circuit board through traces in the board. One or more second type units may be integrated with the connector. Those units may be designed for attachment to a cable, which may provide signal paths to a location on the printed circuit board near relatively distant components.

2. 发明申请

US20210257788A1 ELECTRICAL CONNECTOR WITH HIGH SPEED MOUNTING INTERFACE 有权
公开(公告)号：US20210257788A1
公开(公告)日：2021-08-19
申请号：US17159855
申请日：2021-01-27
申请人： Amphenol Corporation
发明人： Marc B. Cartier, JR. , John Robert Dunham , Mark W. Gailus , David Levine , Allan Astbury , Vysakh Sivarajan , Daniel B. Provencher , Eric Leo
IPC分类号： H01R13/6587 , H01R13/6471 , H01R12/71 , H01R12/51
摘要： An electrical interconnect for passing high speed signals through an electronic system with a high density of signals and high signal integrity. The interconnect includes an electrical connector and a transition portion of a printed circuit board to which the connector is mounted. Signal conductors are connected to pads on the surface of the PCB using edge-to-pad mounting. The pads align with intermediate portions of the signal conductors such that transitions within the connector that could degrade signal integrity are avoided. The signal conductors may be positioned as individually shielded broadside coupled pairs extending in rows within the connector. Surface traces on the PCB connect the pads to signal vias aligned for vertical routing out of the connector footprint. Ground planes underlying the surface traces facilitate a transition from the signal paths in the connector to those in the PCB with low mode conversion avoiding resonances in the connector shields.

3. 发明申请

US20170025783A1 EXTENDER MODULE FOR MODULAR CONNECTOR 审中-公开
标题翻译：模块化连接器扩展模块
公开(公告)号：US20170025783A1
公开(公告)日：2017-01-26
申请号：US15216254
申请日：2016-07-21
申请人： Amphenol Corporation
发明人： Allan Astbury , John Robert Dunham
IPC分类号： H01R13/514 , H01R12/73 , H01R13/659 , H01R13/6474 , H01R13/6471 , H01R43/20 , H01R12/71
CPC分类号： H01R13/514 , H01R12/716 , H01R12/737 , H01R13/6461 , H01R13/6471 , H01R13/6474 , H01R13/6477 , H01R13/6587 , H01R13/659 , H01R43/20
摘要： A modular electrical connector with modular components suitable for assembly into a right angle connector may also be used in forming an orthogonal connector or connector in other desired configurations. The connector modules may be configured through the user of extender modules. Those connector modules may be held together as a right angle connector with a front housing portion, which, in some embodiments, may be shaped differently depending on whether the connector modules are used to form a right angle connector or an orthogonal connector. When designed to form an orthogonal connector, the extender modules may interlock into subarrays, which may be held to other connector components through the use of an extender shell. The mating contact portions on the extender modules may be such that a right angle connector, similarly made with connector modules, may directly mate with the orthogonal connector.
摘要翻译：具有适于组装成直角连接器的模块化部件的模块化电连接器也可以用于形成其它期望配置中的正交连接器或连接器。连接器模块可以通过用户的扩展模块来配置。这些连接器模块可以作为具有前壳体部分的直角连接器一起保持在一起，其在一些实施例中可以根据连接器模块是用于形成直角连接器还是正交连接器而被不同地改变。当设计成形成正交连接器时，扩展器模块可以互锁成子阵列，其可以通过使用扩展器外壳来保持到其它连接器部件。扩展器模块上的配合接触部分可以使得类似地由连接器模块制成的直角连接器可以直接与正交连接器配合。

4. 发明申请

US20220013962A1 CONNECTOR FOR LOW LOSS INTERCONNECTION SYSTEM 有权
公开(公告)号：US20220013962A1
公开(公告)日：2022-01-13
申请号：US17353649
申请日：2021-06-21
申请人： Amphenol Corporation
发明人： Mark W. Gailus , Allan Astbury , David Manter , Marc B. Cartier, JR. , Vysakh Sivarajan , John Robert Dunham
IPC分类号： H01R13/6471 , H01R12/72 , H01R13/514 , H01R24/30 , H01R13/6477 , H01R4/02 , H01R12/70 , H01R12/71 , H05K1/02 , H05K3/32
摘要： A modular electrical connector facilitates low loss connections to components on a printed circuit board. A portion is of the connector is formed of one or more first type units with conductive elements designed to be attached to a printed circuit board. Signals passing through those units may be routed to components on the printed circuit board through traces in the board. One or more second type units may be integrated with the connector. Those units may be designed for attachment to a cable, which may provide signal paths to a location on the printed circuit board near relatively distant components.

5. 发明申请

US20210234290A1 ELECTRICAL CONNECTOR WITH HIGH SPEED MOUNTING INTERFACE 有权
公开(公告)号：US20210234290A1
公开(公告)日：2021-07-29
申请号：US17159794
申请日：2021-01-27
申请人： Amphenol Corporation
发明人： John Robert Dunham , Marc B. Cartier, JR. , Mark W. Gailus , David Levine , Allan Astbury , Vysakh Sivarajan , Daniel B. Provencher , Eric Leo
IPC分类号： H01R12/52 , H01R12/58 , H01R13/6585
摘要： An electrical interconnect for passing high speed signals through an electronic system with a high density of signals and high signal integrity. The interconnect includes an electrical connector and a transition portion of a printed circuit board to which the connector is mounted. Signal conductors are connected to pads on the surface of the PCB using edge-to-pad mounting. The pads align with intermediate portions of the signal conductors such that transitions within the connector that could degrade signal integrity are avoided. The signal conductors may be positioned as individually shielded broadside coupled pairs extending in rows within the connector. Surface traces on the PCB connect the pads to signal vias aligned for vertical routing out of the connector footprint. Ground planes underlying the surface traces facilitate a transition from the signal paths in the connector to those in the PCB with low mode conversion avoiding resonances in the connector shields.

6. 发明授权

US10141676B2 Extender module for modular connector 有权
公开(公告)号：US10141676B2
公开(公告)日：2018-11-27
申请号：US15216254
申请日：2016-07-21
申请人： Amphenol Corporation
发明人： Allan Astbury , John Robert Dunham , Marc B. Cartier, Jr. , Mark W. Gailus , Daniel B. Provencher
IPC分类号： H01R13/648 , H01R13/514 , H01R12/71 , H01R12/73 , H01R13/6471 , H01R13/6474 , H01R13/659 , H01R43/20 , H01R13/6477 , H01R13/6587 , H01R13/6461
摘要： A modular electrical connector with modular components suitable for assembly into a right angle connector may also be used in forming an orthogonal connector or connector in other desired configurations. The connector modules may be configured through the user of extender modules. Those connector modules may be held together as a right angle connector with a front housing portion, which, in some embodiments, may be shaped differently depending on whether the connector modules are used to form a right angle connector or an orthogonal connector. When designed to form an orthogonal connector, the extender modules may interlock into subarrays, which may be held to other connector components through the use of an extender shell. The mating contact portions on the extender modules may be such that a right angle connector, similarly made with connector modules, may directly mate with the orthogonal connector.

7. 发明授权

US11637401B2 Cable connector for high speed in interconnects 有权
公开(公告)号：US11637401B2
公开(公告)日：2023-04-25
申请号：US17194644
申请日：2021-03-08
申请人： Amphenol Corporation
发明人： Mark W. Gailus , Allan Astbury , David Manter , Marc B. Cartier, Jr. , Vysakh Sivarajan , John Robert Dunham
IPC分类号： H01R13/6471 , H01R12/72 , H01R13/514 , H01R24/30 , H01R13/6477 , H01R4/02 , H01R12/70 , H01R12/71 , H05K1/02 , H05K3/32 , H01R13/6587 , H01R12/52 , H01R13/6474
摘要： A cable termination that provides low signal distortion even at high frequencies. Conductive elements of the cable are fused to edges of signal conductors in a cable connector or other component terminating the cable. For terminating a differential pair, the conductive elements of the cable may be terminated to opposing edges of a pair of signal conductors in the cable termination. The conductive elements may be shaped such that the spacing between signal paths passing through the conductive elements of the cable and into the signal conductors of the cable termination is uniform.

8. 发明申请

US20210194182A1 CABLE CONNECTOR FOR HIGH SPEED INTERCONNECTS 有权
公开(公告)号：US20210194182A1
公开(公告)日：2021-06-24
申请号：US17194644
申请日：2021-03-08
申请人： Amphenol Corporation
发明人： Mark W. Gailus , Allan Astbury , David Manter , Marc B. Cartier, JR. , Vysakh Sivarajan , John Robert Dunham
IPC分类号： H01R13/6471 , H01R12/72 , H01R13/514 , H01R24/30 , H01R13/6477 , H01R4/02 , H01R12/70 , H01R12/71 , H05K1/02 , H05K3/32
摘要： A cable termination that provides low signal distortion even at high frequencies. Conductive elements of the cable are fused to edges of signal conductors in a cable connector or other component terminating the cable. For terminating a differential pair, the conductive elements of the cable may be terminated to opposing edges of a pair of signal conductors in the cable termination. The conductive elements may be shaped such that the spacing between signal paths passing through the conductive elements of the cable and into the signal conductors of the cable termination is uniform.

9. 发明申请

US20190109405A1 EXTENDER MODULE FOR MODULAR CONNECTOR 审中-公开
公开(公告)号：US20190109405A1
公开(公告)日：2019-04-11
申请号：US16200372
申请日：2018-11-26
申请人： Amphenol Corporation
发明人： Allan Astbury , John Robert Dunham , Marc B. Cartier, JR. , Mark W. Gailus , Daniel B. Provencher
IPC分类号： H01R13/514 , H01R12/71 , H01R12/73 , H01R13/6471 , H01R13/6474 , H01R13/6587 , H01R43/20 , H01R13/659 , H01R13/6477 , H01R13/6461
摘要： A modular electrical connector with modular components suitable for assembly into a right angle connector may also be used in forming an orthogonal connector or connector in other desired configurations. The connector modules may be configured through the user of extender modules. Those connector modules may be held together as a right angle connector with a front housing portion, which, in some embodiments, may be shaped differently depending on whether the connector modules are used to form a right angle connector or an orthogonal connector. When designed to form an orthogonal connector, the extender modules may interlock into subarrays, which may be held to other connector components through the use of an extender shell. The mating contact portions on the extender modules may be such that a right angle connector, similarly made with connector modules, may directly mate with the orthogonal connector.

10. 发明授权

US11637403B2 Electrical connector with high speed mounting interface 有权
公开(公告)号：US11637403B2
公开(公告)日：2023-04-25
申请号：US17159855
申请日：2021-01-27
申请人： Amphenol Corporation
发明人： Marc B. Cartier, Jr. , John Robert Dunham , Mark W. Gailus , David Levine , Allan Astbury , Vysakh Sivarajan , Daniel B. Provencher , Eric Leo
IPC分类号： H01R13/648 , H01R13/6587 , H01R12/51 , H01R12/71 , H01R13/6471
摘要： An electrical interconnect for passing high speed signals through an electronic system with a high density of signals and high signal integrity. The interconnect includes an electrical connector and a transition portion of a printed circuit board to which the connector is mounted. Signal conductors are connected to pads on the surface of the PCB using edge-to-pad mounting. The pads align with intermediate portions of the signal conductors such that transitions within the connector that could degrade signal integrity are avoided. The signal conductors may be positioned as individually shielded broadside coupled pairs extending in rows within the connector. Surface traces on the PCB connect the pads to signal vias aligned for vertical routing out of the connector footprint. Ground planes underlying the surface traces facilitate a transition from the signal paths in the connector to those in the PCB with low mode conversion avoiding resonances in the connector shields.

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