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    • 5. 发明申请
    • COMBINATION TEST METHOD BY USING ARGON AS GROSS-LEAK TEST TRACER GAS AND USING HELIUM AS FINE-LEAK TEST TRACER GAS
    • 通过使用ARGON作为泄漏测试跟踪器气体并使用HELIUM作为微弱测试跟踪气体的组合测试方法
    • US20160313207A1
    • 2016-10-27
    • US14971623
    • 2015-12-16
    • Genglin WANGNingbo LiLijun Dong
    • Genglin WANGNingbo LiLijun Dong
    • G01M3/20
    • G01M3/20
    • The present invention discloses an improved method of combination test by using argon as gross-leak tracer gas and using helium as fine-leak tracer gas, belongs to the field of hermeticity test. The method is designed to solve the problem that the existing methods are not ideal when the component has lower τHemin and wider range of volume V. The invention comprises step S1 of selecting: using helium-argon prefilling method for the first hermeticity test and helium-argon pressuring method after helium-argon prefilling for repetitive hermeticity test, or using helium-argon pressuring method after argon prefilling for the first hermeticity test and helium-argon multi-pressuring method after argon prefilling for repetitive hermeticity tests. The improved method extends the maximum detection-waiting time, effectively prevents detection missing and misjudges in gross-leak/fine-leak test, and solves the detection problems on applicability, feasibility and credibility.
    • 本发明公开了一种通过使用氩气作为总泄漏示踪气体并使用氦气作为微量泄漏示踪气体的组合试验的改进方法,属于气密性试验领域。 该方法旨在解决当组件具有较低体积V的较小范围时,现有方法不理想的问题。本发明包括步骤S1,其选择:使用氦氩预填充方法进行第一密封试验和氦 - 氦氩预充气后进行重复气密性试验时的氩压加压法,或氩气预充填后的氦氩加压法进行第一气密性试验和氦氩多次加压法。 改进的方法扩展了最大检测等待时间,有效防止了漏检/细漏检测中的检测缺失和误判,解决了适用性,可行性和可信度的检测问题。
    • 8. 发明授权
    • Solid hole array and method for forming the same
    • 固体孔阵列及其形成方法
    • US09136160B2
    • 2015-09-15
    • US13697372
    • 2012-07-31
    • Lijun DongChao Zhao
    • Lijun DongChao Zhao
    • H01L23/498H01L21/768H01L23/14H01L21/48
    • H01L21/76802H01L21/486H01L23/147H01L23/49827H01L2924/0002H01L2924/00
    • A solid hole array and a method for forming the same are disclosed. The solid hold array may comprise: substrate with a via; a top hole array base formed on a top surface of the substrate and a bottom hole array base formed on a bottom surface of the substrate, wherein a front hole is located in the top hole array base at a place corresponding to the via; and top protection layer formed on a surface and sidewalls of the top hole array base and a bottom protection layer formed on a surface of the bottom hole array base, wherein a rear window is located in the bottom hole array base and the bottom protection layer at a place corresponding to the via.
    • 公开了一种固体孔阵列及其形成方法。 固体保持阵列可以包括:具有通孔的基底; 形成在所述基板的上表面上的顶孔阵列基座和形成在所述基板的底面的底孔阵列基座,其中,在与所述通孔相对应的位置处,所述顶孔阵列基座中的前孔位于所述顶孔阵列基底中; 以及形成在顶孔阵列基底的表面和侧壁上的顶部保护层和形成在底部孔阵列基底的表面上的底部保护层,其中后部窗口位于底部孔阵列基底中,底部保护层位于底部保护层 一个对应于通道的地方。
    • 9. 发明申请
    • SOLID HOLE ARRAY AND MANUFACTURE METHOD THEREOF
    • 固体盖阵列及其制造方法
    • US20140001646A1
    • 2014-01-02
    • US13697372
    • 2012-07-31
    • Lijun DongChao Zhao
    • Lijun DongChao Zhao
    • H01L21/768H01L23/498
    • H01L21/76802H01L21/486H01L23/147H01L23/49827H01L2924/0002H01L2924/00
    • A solid hole array and a manufacture method thereof are provided. The method for manufacturing the solid hole array comprises: forming a top hole array base and a bottom hole array base on a top surface and a bottom surface of a substrate respectively; forming a front hole in the top hole array base; forming a top protection layer on the substrate with the top hole array base, and forming a bottom protection layer on the bottom hole array base; forming a rear window in the bottom hole array base and the bottom protection layer; and etching through the substrate by alkali corrosion to connect the front hole with the rear window. In addition, the present disclosure also provides a solid hole array. Using the method of the present disclosure, the intensity of the front film is enhanced, the process steps are simplified, the cost is decreased, and a large scale manufacture is more likely.
    • 提供了一种固体孔阵列及其制造方法。 固体孔阵列的制造方法包括:分别在衬底的顶表面和底表面上形成顶孔阵列基底和底孔阵列基底; 在顶孔阵列基底中形成前孔; 在顶孔阵列基底上形成顶层保护层,在底孔阵列基底上形成底层保护层; 在底孔阵列基底和底部保护层中形成后窗; 并通过碱腐蚀蚀刻基板,将前孔与后窗连接起来。 此外,本公开还提供了一种固体孔阵列。 利用本公开的方法,提高了前膜的强度,简化了工艺步骤,降低了成本,并且更有可能进行大规模制造。
    • 10. 发明申请
    • METHOD AND APPARATUS FOR HOP-BY-HOP RELIABLE MULTICAST IN WIRELESS NETWORKS
    • 无线网络中HOP-By-HOP可靠多播的方法与装置
    • US20120188934A1
    • 2012-07-26
    • US13499420
    • 2009-10-06
    • Hang LiuLijun Dong
    • Hang LiuLijun Dong
    • H04W4/06
    • H04L12/1863H04B7/155H04L1/004H04L1/02H04L1/1607H04L41/0816H04L41/083H04L41/12H04L41/5022H04L45/02H04L45/123H04L45/28
    • A method and apparatus are described including performing hop-by-hop multicasting including network coding of data packets of a portion of content, wherein network coding further includes receiving an encoded data packet of a portion of content from an upstream transmitter, determining if the received encoded data packet is innovative, storing the received encoded data packet responsive to the first determination, determining if a full rank of the encoded data packet of the portion of content has been received, determining if an acknowledgement message for the portion of the content has already been sent to the upstream transmitter responsive to the second determination, sending the acknowledgement message to the upstream transmitter responsive to the third determination and discarding the received encoded data packet responsive to the first determination.
    • 描述了一种方法和装置,包括执行包括内容的一部分的数据分组的网络编码的逐跳多播,其中网络编码还包括从上游发送器接收内容的一部分的编码数据分组,确定是否接收到 编码数据分组是创新的,响应于第一确定存储接收到的编码数据分组,确定是否已经接收到内容部分的编码数据分组的完整等级,确定内容部分的确认消息是否已经 响应于所述第二确定被发送到所述上行发射机,响应于所述第三确定发送所述确认消息到所述上行发射机,并且响应于所述第一确定而丢弃所接收的编码数据分组。