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1. 发明授权

US11207795B1 Mold materials for formed ceramic 有权
公开(公告)号：US11207795B1
公开(公告)日：2021-12-28
申请号：US16137434
申请日：2018-09-20
申请人： Apple Inc.
发明人： Jeffrey L. Mattlin , Abhijeet Misra , Herng-Jeng Jou , James A. Wright , James A. Yurko , Lei Gao , Weiming Huang , William A. Counts
IPC分类号： B28B7/36 , B29C43/32
摘要： A mold apparatus to form a ceramic (or glass) includes a first mold portion having a first coefficient of thermal expansion and a second mold portion having a second coefficient of thermal expansion. In some embodiments, the first mold portion and/or the second mold portion are substantially immiscible with the ceramic material, such as silicon oxide, at a temperature greater than 600° C. In some embodiments, the first coefficient of thermal expansion and the second coefficient of thermal expansion are substantially similar to that of the glass or ceramic material. In some embodiments, the first coefficient of thermal expansion is different from the second coefficient of thermal expansion. In some embodiments, the first mold portion and the second mold portion contain a surface coating and a passivation layer.

2. 发明授权

US10856443B2 Cladded metal structures for dissipation of heat in a portable electronic device 有权
公开(公告)号：US10856443B2
公开(公告)日：2020-12-01
申请号：US16407011
申请日：2019-05-08
申请人： Apple Inc.
发明人： William A. Counts , Abhijeet Misra , Nagarajan Kalyanasundaram , James A. Yurko
IPC分类号： H05K7/20 , H05K5/04
摘要： This application relates to an enclosure for a portable electronic device is described. The enclosure can include metal bands included along the enclosure and a support structure. The support structure can include a thermally conductive core that is capable of conducting thermal energy generated by the operational components and rails that are bound between the metal bands and the thermally conductive core, where the rails are characterized as having a rate of thermal conductivity that is less than a rate of thermal conductivity of the thermally conductive core so that the thermal energy generated by the operational component is directed away from the operational component and away from the metal bands.

3. 发明申请

US20170088917A1 MICRO-ALLOYING TO MITIGATE THE SLIGHT DISCOLORATION RESULTING FROM ENTRAINED METAL IN ANODIZED ALUMINUM SURFACE FINISHES 有权
公开(公告)号：US20170088917A1
公开(公告)日：2017-03-30
申请号：US14927225
申请日：2015-10-29
申请人： Apple Inc.
发明人： James A. Curran , William A. Counts , Abhijeet Misra
IPC分类号： C22C1/06 , C25D11/06 , C22C21/10 , C25D11/16
CPC分类号： C22C1/06 , C22C21/10 , C25D11/06 , C25D11/14 , C25D11/16 , C25D11/243
摘要： Micro additions of certain elements such as zirconium or titanium are added to high strength aluminum alloys to counter discoloring effects of other micro-alloying elements when the high strength alloys are anodized. The other micro-alloying elements are added to increase the adhesion of an anodic film to the aluminum alloy substrate. However, these micro-alloying elements can also cause slight discoloration, such as a yellowing, of the anodic film. Such micro-alloying elements that can cause discoloration can include copper, manganese, iron and silver. The micro additions of additional elements, such as one or more of zirconium, tantalum, molybdenum, hafnium, tungsten, vanadium, niobium and tantalum, can dilute the discoloration of the micro-alloying elements. The resulting anodic films are substantially colorless.

4. 发明授权

US10524372B2 Enclosure with metal interior surface layer 有权
公开(公告)号：US10524372B2
公开(公告)日：2019-12-31
申请号：US16360939
申请日：2019-03-21
申请人： Apple Inc.
发明人： James A. Wright , Guangtao Zhang , Raymund W. M. Kwok , Karl Ruben F. Larsson , Christopher S. Graham , Matthew D. Hill , Abhijeet Misra
IPC分类号： H05K5/04 , H02J50/10 , H01Q1/38 , H01Q7/00 , H05K5/03 , G06F1/18 , H04M1/02 , H05K7/14 , G06F1/16
摘要： An enclosure is formed by coupling an outer cover to a back enclosure piece. The enclosure defines an interior volume for receiving components of an electronic device. The back enclosure piece is formed from a metal frame component and a non-metal outer cover. A metal layer overlaps the metal frame component and the outer cover within the interior volume. The metal layer has a thickness that provides support and shatter resistance to the non-metal outer cover. The metal layer can form an inductor of a wireless power transfer circuit.

5. 发明申请

US20190223310A1 Enclosure with Metal Interior Surface Layer 审中-公开
公开(公告)号：US20190223310A1
公开(公告)日：2019-07-18
申请号：US16360939
申请日：2019-03-21
申请人： Apple Inc.
发明人： James A. Wright , Guanglao Zhang , Raymund W.M. Kwok , Karl Ruben F. Larsson , Christopher S. Graham , Matthew D. Hill , Abhijeet Misra
IPC分类号： H05K5/04 , H05K7/14 , H05K5/03 , H01Q7/00 , G06F1/18 , H02J50/10 , H04M1/02 , H01Q1/38
CPC分类号： H05K5/04 , G06F1/1656 , G06F1/1658 , G06F1/182 , H01Q1/38 , H01Q7/00 , H02J50/10 , H04M1/0202 , H05K5/03 , H05K7/1427
摘要： An enclosure is formed by coupling an outer cover to a back enclosure piece. The enclosure defines an interior volume for receiving components of an electronic device. The back enclosure piece is formed from a metal frame component and a non-metal outer cover. A metal layer overlaps the metal frame component and the outer cover within the interior volume. The metal layer has a thickness that provides support and shatter resistance to the non-metal outer cover. The metal layer can form an inductor of a wireless power transfer circuit.

6. 发明申请

US20190211432A1 Aluminum Alloys with High Strength and Cosmetic Appeal 审中-公开
公开(公告)号：US20190211432A1
公开(公告)日：2019-07-11
申请号：US16244750
申请日：2019-01-10
申请人： Apple Inc.
发明人： Abhijeet Misra , James A. Wright , Herng-Jeng Jou
IPC分类号： C22F1/053 , C22C1/02 , C22C21/10
摘要： The disclosure provides aluminum alloys having varying ranges of alloying elements and properties.

7. 发明授权

US09300036B2 Radio-frequency transparent window 有权
标题翻译：射频透明窗口
公开(公告)号：US09300036B2
公开(公告)日：2016-03-29
申请号：US13913382
申请日：2013-06-07
申请人： Apple Inc.
发明人： Abhijeet Misra , Brian S. Tryon , Charles J. Kuehmann , Stephen B. Lynch , James A. Wright
IPC分类号： H01Q1/24 , H01Q1/42
CPC分类号： H01Q1/42 , H01Q1/243 , H01Q1/44
摘要： A patch for a device in an electronic housing including an aluminum layer having a threshold thickness, a non-conductive layer on a first side of the aluminum layer, and a radio-frequency (RF) transparent layer on a second side of the aluminum layer is provided. A method for manufacturing an antenna window including a patch as above is also provided, the method including determining a thickness of the aluminum layer adjacent to an anodized aluminum layer. A method for manufacturing an antenna window including coating an aluminum layer having a threshold thickness on a radio-frequency (RF) transparent layer to form an RF transparent laminate is also provided. A method for manufacturing an antenna window including removing a thickness of aluminum is also provided. A method for manufacturing an antenna window including disposing a mask on an aluminum substrate and anodizing the aluminum substrate to a selected thickness is also provided.
摘要翻译：一种用于电子外壳中的装置的贴片，包括具有阈值厚度的铝层，在铝层的第一侧上的非导电层和在铝层的第二侧上的射频（RF）透明层被提供。还提供了一种用于制造包括如上所述的贴片的天线窗的方法，所述方法包括确定与阳极化铝层相邻的铝层的厚度。还提供一种用于制造天线窗的方法，包括在射频（RF）透明层上涂覆具有阈值厚度的铝层以形成RF透明层压板。还提供了一种用于制造包括去除铝厚度的天线窗的方法。还提供了一种制造天线窗的方法，包括在铝基板上设置掩模并将铝基板阳极氧化至所选择的厚度。

8. 发明申请

US20220304175A1 ADDITIVELY MANUFACTURED DEVICE ENCLOSURES 有权
公开(公告)号：US20220304175A1
公开(公告)日：2022-09-22
申请号：US17805641
申请日：2022-06-06
申请人： Apple Inc.
发明人： Eric W. Hamann , Abhijeet Misra , Anthony D. Prescenzi , Brian M. Gable , Christopher D. Prest , Hoishun Li , James A. Yurko , Lee E. Hooton , Michael B. Wittenberg , Richard H. Dinh , Jennifer D. Schuler
IPC分类号： H05K5/04 , H05K5/00 , H05K5/02
摘要： A component for an electronic device can include a pre-formed substrate comprising a first metal and an additively manufactured portion bonded to the pre-formed substrate. The additively manufactured portion can include a first portion comprising a second metal and defining a volume, the first portion having a first value of a material property, and a second portion disposed in the volume, the second portion having a second value of the material property that is different from the first value.

9. 发明授权

US11418638B2 Electronic device having a composite structure 有权
公开(公告)号：US11418638B2
公开(公告)日：2022-08-16
申请号：US16569525
申请日：2019-09-12
申请人： Apple Inc.
发明人： Abhijeet Misra , Steven J. Osborne , Ian A. Spraggs , Marwan Rammah , William A. Counts
IPC分类号： G06F1/16 , H04M1/18 , H04M1/02
摘要： Embodiments are directed to an enclosure for an electronic device. In one aspect, an embodiment includes an enclosure having an enclosure component and an internal component that may be affixed along a bonding region. The enclosure component may be formed from an enclosure material and defines an exterior surface of the enclosure and an opening configured to receive a display. The internal component may be formed from a metal material different than the enclosure material. The bonding region may include an interstitial material that has a melting temperature that is less than a melting temperature of either one of the enclosure material or the metal material. The bonding region may also include one or more of the enclosure material or the metal material.

10. 发明授权

US11178781B2 Etching for bonding polymer material to a metal surface 有权
公开(公告)号：US11178781B2
公开(公告)日：2021-11-16
申请号：US16125409
申请日：2018-09-07
申请人： Apple Inc.
发明人： Todd S. Mintz , Shi Hua Zhang , Abhijeet Misra , Eric W. Hamann
IPC分类号： H05K5/02 , C25F3/14 , B29C45/14 , C25D11/10 , C25D11/08 , H05K5/00 , H05K5/04 , H05K5/06 , C23F1/02 , H04M1/02 , C23G1/12 , B29K705/00 , C23F1/20
摘要： This application relates to a composite part that can include a non-metal layer having attachment features, and a metal part that is joined with the non-metal layer. The metal part can include a plurality of interlocking structures that are disposed at an external surface of the metal part, where each of the interlocking structures can include an opening characterized as having a first width, and an undercut region, where the opening leads into the undercut region, and the undercut region is characterized as having a second width that is greater than the first width such that the undercut region captures and retains one of the attachment features of the non-metal layer.

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