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1. 发明授权

US09494178B2 Methods for bonding substrates using liquid adhesive 有权
标题翻译：使用液体粘合剂粘合基材的方法
公开(公告)号：US09494178B2
公开(公告)日：2016-11-15
申请号：US14183224
申请日：2014-02-18
申请人： Apple Inc.
发明人： Cyrus Y. Liu , Kuo-Hua Sung , Po-Jui Chen , Silvio Grespan
IPC分类号： H05K5/06 , F16B11/00 , C09J5/00 , B32B5/26 , B32B7/12
CPC分类号： F16B11/006 , B32B5/26 , B32B7/12 , B32B2457/00 , B32B2457/20 , C09J5/00 , C09J2205/31 , G02F2202/28 , Y10T156/10
摘要： Structures in an electronic device such as substrates associated with a display may be bonded together using liquid adhesive. Fiber-based equipment may be used to apply ultraviolet light to peripheral edges of an adhesive layer during bonding. There-dimensional adhesive shapes may be produced using nozzles with adjustable openings, computer-controlled positioners, and other adhesive dispensing equipment. Ultraviolet light may be applied to liquid adhesive through a mask with an opacity gradient. Adjustable shutter structures may control adhesive exposure to ultraviolet light. Ultraviolet light exposure may be used to create an adhesive dam that helps create a well defined adhesive border. Multiple layers of adhesive may be applied between a pair of substrates.
摘要翻译：诸如与显示器相关联的基板的电子设备中的结构可以使用液体粘合剂粘合在一起。可以使用基于光纤的设备在粘合期间将紫外光施加到粘合剂层的周边边缘。可以使用具有可调开口的喷嘴，计算机控制的定位器和其它粘合剂分配设备来制造尺寸的粘合剂形状。可以通过具有不透明度梯度的面罩将紫外光施加到液体粘合剂上。可调节的快门结构可以控制粘合剂暴露于紫外线。可以使用紫外线曝光来创建粘合剂坝，有助于创建良好界定的粘合剂边界。可以在一对基板之间施加多层粘合剂。

2. 发明申请

US20170062379A1 ANISOTROPIC CONDUCTIVE FILM STRUCTURES 有权
标题翻译：各向异性导电膜结构
公开(公告)号：US20170062379A1
公开(公告)日：2017-03-02
申请号：US14836859
申请日：2015-08-26
申请人： Apple Inc.
发明人： Bo Zhang , Sang Ha Kim , Cyrus Y. Liu , Kuo-Hua Sung
IPC分类号： H01L23/00
CPC分类号： H01L24/83 , H01L24/29 , H01L24/32 , H01L2224/32227 , H01L2224/83203 , H01L2224/83851 , H01L2224/83874 , H01L2924/2075
摘要： Anisotropic conductive film (ACF) structures and manufacturing methods for forming the same are described. The manufacturing methods include preventing clusters of conductive particles from forming between adjacent bonding pads and that are associated with electrical shorting of ACF structures. In some embodiments, the methods involve use of multiple layered ACF materials that include a non-electrically conductive layer that reduces the likelihood of formation of conductive particle clusters between bonding pads. In some embodiment, the methods include the use of ultraviolet sensitive ACF material combined with lithography techniques that eliminate conductive particles from between neighboring bonding pads. In some embodiments, the methods involve the use of insulation spacers that block conductive particles from entering between bonding pads. Any suitable combination of the described methods can be used.
摘要翻译：描述各向异性导电膜（ACF）结构及其制造方法。制造方法包括防止在相邻焊盘之间形成导电颗粒簇并且与ACF结构的电短路相关联。在一些实施方案中，该方法涉及使用包含非导电层的多层ACF材料，其降低在接合焊盘之间形成导电颗粒簇的可能性。在一些实施方案中，所述方法包括使用紫外线敏感的ACF材料与光刻技术相结合，从而消除相邻接合焊盘之间的导电颗粒。在一些实施例中，该方法涉及使用阻挡导电颗粒进入接合焊盘之间的绝缘间隔物。可以使用所述方法的任何合适的组合。

3. 发明申请

US20170336831A1 Electronic Devices With Flexible Displays 审中-公开
公开(公告)号：US20170336831A1
公开(公告)日：2017-11-23
申请号：US15272957
申请日：2016-09-22
申请人： Apple Inc.
发明人： Zhen Zhang , Victor H. Yin , Cyrus Y. Liu , Paul S. Drzaic , Sungwon Bae , Chun-Hao Tung , Kiarash Vakhshouri , Sunggu Kang , John Z. Zhong
IPC分类号： G06F1/16 , G06F3/041 , G06F3/044
CPC分类号： G06F1/1652 , G06F1/1626 , G06F1/1643 , G06F3/0412 , G06F3/0416 , G06F3/044 , G06F2203/04102 , G06F2203/04103
摘要： An electronic device may have a flexible portion that allows the device to be folded. The device may have a flexible display. The flexible display may have a flexible display layer, a cover layer, a touch sensor interposed between the flexible display layer and the cover layer, a support layer, and a polarizer layer. The polarizer layer may be interposed between the touch sensor and the flexible display or between the touch sensor and the cover layer. The touch sensor may include optically clear adhesive that is flexible and facilitates bending of the display. The optically clear adhesive may include additives such as water vapor penetration reducing additive, anticorrosion additive, ultraviolet-light blocking additive, and index-of-refraction adjustment additive. The support layer may be formed from shape memory alloy or amorphous metal and may have openings to facilitate bending.

4. 发明申请

US20180092209A1 System With Field-Assisted Conductive Adhesive Bonds 有权
公开(公告)号：US20180092209A1
公开(公告)日：2018-03-29
申请号：US15400677
申请日：2017-01-06
申请人： Apple Inc.
发明人： Koohee Han , Hui Chen , Kuo-Hua Sung , Cyrus Y. Liu , To C. Tan
IPC分类号： H05K1/14 , H05K1/02 , H05K1/11 , H05K1/09 , H05K3/10 , H05K3/36 , H05K3/38
CPC分类号： H05K1/144 , H05K1/028 , H05K1/09 , H05K1/11 , H05K3/10 , H05K3/365 , H05K3/38 , H05K2201/041 , H05K2203/10
摘要： Components may have substrates with metal traces that form mating contacts. The components may be bonded together using anisotropic conductive adhesive bonding techniques. During bonding, conductive particles may be concentrated over the contacts by application of magnetic or electric fields or by using a template transfer process. Gaps between the contacts may be at least partially free of conductive particles to help isolate adjacent contacts. Polymer between the substrates may attach the substrates together. The conductive particles may be embedded in the polymer and crushed or melted to short opposing contacts together.

5. 发明授权

US09302457B2 Liquid optically clear adhesive lamination process control 有权
标题翻译：液体光学透明胶粘剂层压工艺控制
公开(公告)号：US09302457B2
公开(公告)日：2016-04-05
申请号：US13766393
申请日：2013-02-13
申请人： Apple Inc.
发明人： Silvio Grespan , Shih-Min Hsu , Heng-Hsi Wu , Kuo-Hua Sung , Cyrus Y. Liu
IPC分类号： B32B38/00 , G01N33/00 , G01B11/14 , G03F7/20 , G06F3/041
CPC分类号： B32B38/0008 , G01B11/14 , G01N33/00 , G03F7/70008 , G06F3/0412 , G06F2203/04103
摘要： Methods and devices for using liquid optically clear adhesives (LOCAs) are described. A method for detecting uncured LOCA between a first substrate and a second substrate is described. In addition, an improved method for curing a laminated stack up having LOCA between a first substrate and a second substrate is described. The method includes a pre-curing method involving variable exposure of the LOCA. In addition, an improved light emitting diode (LED) unit assembly for exposing a laminated stack up to ultraviolet (UV) light during a pre-curing process is described. A method for testing the LED unit assembly prior to a pre-curing process is described.
摘要翻译：描述了使用液体光学透明粘合剂（LOCA）的方法和装置。描述了用于检测第一基板和第二基板之间的未固化LOCA的方法。另外，描述了在第一基板和第二基板之间固化具有LOCA的叠层叠层的改进方法。该方法包括涉及LOCA可变暴露的预固化方法。另外，还描述了一种改进的发光二极管（LED）单元组件，用于在预固化过程中将层压叠层暴露于紫外（UV）光。描述了在预固化过程之前测试LED单元组件的方法。

6. 发明申请

US20140246148A1 Methods for Bonding Substrates Using Liquid Adhesive 有权
标题翻译：使用液体粘合剂粘合基材的方法
公开(公告)号：US20140246148A1
公开(公告)日：2014-09-04
申请号：US14183224
申请日：2014-02-18
申请人： Apple Inc.
发明人： Cyrus Y. Liu , Kuo-Hua Sung , Po-Jui Chen , Silvio Grespan
IPC分类号： H05K5/06 , H05K13/00
CPC分类号： F16B11/006 , B32B5/26 , B32B7/12 , B32B2457/00 , B32B2457/20 , C09J5/00 , C09J2205/31 , G02F2202/28 , Y10T156/10
摘要： Structures in an electronic device such as substrates associated with a display may be bonded together using liquid adhesive. Fiber-based equipment may be used to apply ultraviolet light to peripheral edges of an adhesive layer during bonding. There-dimensional adhesive shapes may be produced using nozzles with adjustable openings, computer-controlled positioners, and other adhesive dispensing equipment. Ultraviolet light may be applied to liquid adhesive through a mask with an opacity gradient. Adjustable shutter structures may control adhesive exposure to ultraviolet light. Ultraviolet light exposure may be used to create an adhesive dam that helps create a well defined adhesive border. Multiple layers of adhesive may be applied between a pair of substrates.
摘要翻译：诸如与显示器相关联的基板的电子设备中的结构可以使用液体粘合剂粘合在一起。可以使用基于光纤的设备在粘合期间将紫外光施加到粘合剂层的周边边缘。可以使用具有可调开口的喷嘴，计算机控制的定位器和其它粘合剂分配设备来制造尺寸的粘合剂形状。可以通过具有不透明度梯度的面罩将紫外光施加到液体粘合剂上。可调节的快门结构可以控制粘合剂暴露于紫外线。可以使用紫外线曝光来创建粘合剂坝，有助于创建良好界定的粘合剂边界。可以在一对基板之间施加多层粘合剂。

7. 发明授权

US10198040B2 Electronic devices with flexible displays 有权
公开(公告)号：US10198040B2
公开(公告)日：2019-02-05
申请号：US15272957
申请日：2016-09-22
申请人： Apple Inc.
发明人： Zhen Zhang , Victor H. Yin , Cyrus Y. Liu , Paul S. Drzaic , Sungwon Bae , Chun-Hao Tung , Kiarash Vakhshouri , Sunggu Kang , John Z. Zhong
IPC分类号： G06F1/16 , G06F3/041 , G06F3/044
摘要： An electronic device may have a flexible portion that allows the device to be folded. The device may have a flexible display. The flexible display may have a flexible display layer, a cover layer, a touch sensor interposed between the flexible display layer and the cover layer, a support layer, and a polarizer layer. The polarizer layer may be interposed between the touch sensor and the flexible display or between the touch sensor and the cover layer. The touch sensor may include optically clear adhesive that is flexible and facilitates bending of the display. The optically clear adhesive may include additives such as water vapor penetration reducing additive, anticorrosion additive, ultraviolet-light blocking additive, and index-of-refraction adjustment additive. The support layer may be formed from shape memory alloy or amorphous metal and may have openings to facilitate bending.

8. 发明授权

US09942986B1 System with field-assisted conductive adhesive bonds 有权
公开(公告)号：US09942986B1
公开(公告)日：2018-04-10
申请号：US15400677
申请日：2017-01-06
申请人： Apple Inc.
发明人： Koohee Han , Hui Chen , Kuo-Hua Sung , Cyrus Y. Liu , To C. Tan
IPC分类号： H05K1/14 , H05K1/02 , H05K1/11 , H05K1/09 , H05K3/10 , H05K3/36 , H05K3/38
CPC分类号： H05K1/144 , H05K1/028 , H05K1/09 , H05K1/11 , H05K3/10 , H05K3/365 , H05K3/38 , H05K2201/041 , H05K2203/10
摘要： Components may have substrates with metal traces that form mating contacts. The components may be bonded together using anisotropic conductive adhesive bonding techniques. During bonding, conductive particles may be concentrated over the contacts by application of magnetic or electric fields or by using a template transfer process. Gaps between the contacts may be at least partially free of conductive particles to help isolate adjacent contacts. Polymer between the substrates may attach the substrates together. The conductive particles may be embedded in the polymer and crushed or melted to short opposing contacts together.

9. 发明授权

US09653425B2 Anisotropic conductive film structures 有权
公开(公告)号：US09653425B2
公开(公告)日：2017-05-16
申请号：US14836859
申请日：2015-08-26
申请人： Apple Inc.
发明人： Bo Zhang , Sang Ha Kim , Cyrus Y. Liu , Kuo-Hua Sung
IPC分类号： H01L23/48 , H01L23/52 , H01L29/40 , H01L23/00
CPC分类号： H01L24/83 , H01L24/29 , H01L24/32 , H01L2224/32227 , H01L2224/83203 , H01L2224/83851 , H01L2224/83874 , H01L2924/2075
摘要： Anisotropic conductive film (ACF) structures and manufacturing methods for forming the same are described. The manufacturing methods include preventing clusters of conductive particles from forming between adjacent bonding pads and that are associated with electrical shorting of ACF structures. In some embodiments, the methods involve use of multiple layered ACF materials that include a non-electrically conductive layer that reduces the likelihood of formation of conductive particle clusters between bonding pads. In some embodiment, the methods include the use of ultraviolet sensitive ACF material combined with lithography techniques that eliminate conductive particles from between neighboring bonding pads. In some embodiments, the methods involve the use of insulation spacers that block conductive particles from entering between bonding pads. Any suitable combination of the described methods can be used.

10. 发明申请

US20160101609A1 Methods for Bonding Structures With Adhesive in Electronic Devices 审中-公开
标题翻译：电子设备中粘合剂结合方法
公开(公告)号：US20160101609A1
公开(公告)日：2016-04-14
申请号：US14538221
申请日：2014-11-11
申请人： Apple Inc.
发明人： Cyrus Y. Liu , Der-Song Lin , Kuo-Hua Sung
IPC分类号： B32B37/12 , B32B38/00
CPC分类号： B32B37/12 , B32B2037/1253 , B32B2457/00 , B32B2457/20 , G02F1/133308 , G02F2201/56 , G02F2202/023 , G02F2202/28
摘要： An electronic device may have display layers and other structures. A layer of liquid adhesive may be patterned onto a structure. The liquid adhesive may be pre-cured to increase the viscosity of the liquid adhesive and to partially shrink the liquid adhesive. The structure to which the liquid adhesive has been applied may be laminated to another structure. During lamination, the pre-cured liquid adhesive may be compressed between the structures that are being laminated. The adhesive may then be fully cured to bond the structures together. The thickening of the liquid adhesive during pre-curing helps control the spread of the adhesive. The shrinking of the liquid adhesive helps prevent stresses from developing that could lead to visible stress-induced artifacts following curing.
摘要翻译：电子设备可以具有显示层和其他结构。液体粘合剂层可以被图案化到结构上。液体粘合剂可以预固化以增加液体粘合剂的粘度并部分收缩液体粘合剂。已经施加了液体粘合剂的结构可以层压到另一种结构。在层压期间，预固化的液体粘合剂可以在被层压的结构之间被压缩。然后可以将粘合剂完全固化以将结构粘合在一起。在预固化期间液体粘合剂的增稠有助于控制粘合剂的扩散。液体粘合剂的收缩有助于防止发生应力，这可能导致固化后可见的应力引起的伪影。

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