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1. 发明授权

US10996713B2 Portable electronic device 有权
公开(公告)号：US10996713B2
公开(公告)日：2021-05-04
申请号：US16056306
申请日：2018-08-06
申请人： Apple Inc.
发明人： David A. Pakula , Daniel W. Jarvis , Shimon Elkayam , Brandon R. Garbus , Christopher S. Graham , Karl Ruben F. Larsson , Ashley E. Fletcher , Jared M. Kole , Eric S. Jol , Aaron A. Oro , Michael D. Quinones , Gregory N. Stephens , Ian A. Spraggs , James A. Bertin , Simon C. Helmore , Melissa A. Wah , Matthew D. Hill , Jon F. Housour , Douglas G. Fournier , Christopher S. Tomasetta
IPC分类号： G06F1/16 , H04N5/225 , H02J50/10 , H04M1/02 , H02J50/70 , G06F1/26 , G06K9/00
摘要： An electronic disclosed herein may include a band formed from metal that combines with a bottom wall formed from a non-metal to form an enclosure that carries internal components. The electronic device may include a transparent cover and a display assembly partially covered by a border having a uniform dimension. The electronic device may include a vision system designed for facial recognition of a user of the electronic device. A bracket assembly may hold the vision system. The bracket assembly may not be affixed to the enclosure and may move relative to the enclosure. The electronic device may include a battery assembly having multiple battery components coupled together. The electronic device may further include a receiver coil for wireless charging of the battery assembly. The electronic device may include a circuit board assembly having stacked circuit boards. The electronic device may further include a dual camera assembly.

2. 发明授权

US10455738B2 Stacked circuit board architecture in an electronic device 有权
公开(公告)号：US10455738B2
公开(公告)日：2019-10-22
申请号：US15712071
申请日：2017-09-21
申请人： Apple Inc.
发明人： David A. Pakula , Daniel W. Jarvis , Gregory N. Stephens , Ian A. Spraggs , Vu Thanh Vo , Amir Salehi , Dennis R. Pyper , Alex J. Crumlin , Corey S. Provencher , Derek J. Walters , Michael V. Yeh
IPC分类号： H05K5/02 , H04B1/03 , H05K7/20 , G06F3/041 , H01M2/10 , H05K1/02 , H05K1/14 , G06F1/16 , H05K9/00 , H01M2/08 , H02J7/00 , G06F3/044
摘要： A circuit board assembly in an electronic is disclosed. To conserve space in the electronic device, the circuit board assembly includes stacked circuit boards in electrical communication with each other, such as a first circuit board stacked over a second circuit board. Each circuit board may include multiple surfaces that carry operational components. Moreover, the first circuit board may include a first surface and the second circuit board may include a second surface facing the first surface. The first and second surfaces may include operational components in corresponding locations. Also, the operational components may include corresponding shapes such that one component is positioned in another component. The components may electrically connect to each other. Also, the circuit board assembly may include EMI shields around an outer perimeter in order to shield the operational components form EMI and to components in the electronic device from EMI emanating from the operational components.

3. 发明授权

US09680187B2 Battery removal apparatus 有权
公开(公告)号：US09680187B2
公开(公告)日：2017-06-13
申请号：US13903867
申请日：2013-05-28
申请人： Apple Inc.
发明人： Gregory N. Stephens , David A. Pakula , Ashutosh Y. Shukla
IPC分类号： H01M10/42 , G06F1/16 , H01M2/10
CPC分类号： H01M10/425 , G06F1/1635 , H01M2/1066 , Y10T156/1994
摘要： This application relates generally to battery removal apparatuses. For example, one battery removal apparatus disclosed herein comprises a pull tab configured to be disposed between a battery and a casing of a portable computing device. The pull tab is shaped such that at least one area of the battery and the casing are exposed to one another when the battery, the pull tab and the casing are compressed together. An adhesive layer is shaped to cover the at least one exposed area such that the battery adheres to the casing, and the pull tab is reinforced so as to prevent the pull tab from tearing when used to remove the battery from the portable computing device. Other battery removal apparatuses include a pull string battery removal apparatus as well as a battery removal apparatus that incorporates both a pull tab and one or more pull strings.

4. 发明申请

US20160093975A1 MAGNETIC PINS 审中-公开
标题翻译：磁性针
公开(公告)号：US20160093975A1
公开(公告)日：2016-03-31
申请号：US14870749
申请日：2015-09-30
申请人： APPLE INC.
发明人： Vivek Katiyar , Ibuki Kamei , Gregory N. Stephens
IPC分类号： H01R13/62 , H01F7/08 , H01F1/147
CPC分类号： H01F7/08 , H01F1/147 , H01F7/0252 , H01R11/30 , H01R13/2407 , H01R24/28
摘要： Connectors that may provide an improved reliability by having a reduced tendency for damage to their contacts and may have a reduced size and complexity. One example may provide a magnetic connector having a magnetic pin. The magnetic pin may have a plunger that may remain protected in a barrel and housing when the magnetic connector is not engaged with a corresponding connector. When the magnetic connector is engaged with a corresponding connector, the plunger may be magnetically attracted to a corresponding contact on the corresponding connector and may emerge from the barrel or housing to make an electrical connection between the plunger and the corresponding contact.
摘要翻译：连接器可通过降低其触点损坏的趋势而提供改进的可靠性，并且可能具有减小的尺寸和复杂性。一个示例可以提供具有磁销的磁性连接器。当磁性连接器未与相应的连接器接合时，磁性销可以具有可保持在筒体和壳体中的保护柱塞。当磁性连接器与对应的连接器接合时，柱塞可以被磁力地吸引到相应的连接器上的对应接触件上，并且可以从机筒或壳体上出来，以在柱塞和对应的接触件之间形成电连接。

5. 发明申请

US20150064937A1 OVERPASS GROUNDING SPRING AND INTEGRATED COMPONENT PROTECTION 有权
标题翻译：超导接地弹簧和集成部件保护
公开(公告)号：US20150064937A1
公开(公告)日：2015-03-05
申请号：US14231372
申请日：2014-03-31
申请人： Apple Inc.
发明人： Gregory N. Stephens , Matthew D. Hill , Scott A. Myers
IPC分类号： H01R12/75 , H01R43/20
CPC分类号： H05K1/0215 , H01R4/64 , H01R12/57 , H01R2201/06 , H05K2201/10265 , Y10T29/4913
摘要： The described embodiments relate generally to use of an electrically conductive member, such as a grounding spring, used to electrically ground components on a printed circuit board as well as provide mechanical protection to the components. More particularly, a method and apparatus for attaching a grounding spring to multiple locations on the printed circuit board are disclosed. In one embodiment, the grounding spring can act as both a ground and a mechanical protection element for other surface mounted components disposed on the printed circuit board.
摘要翻译：所描述的实施例大体上涉及用于电气接地印刷电路板上的部件的导电部件，例如接地弹簧，以及为部件提供机械保护。更具体地，公开了一种用于将接地弹簧连接到印刷电路板上的多个位置的方法和装置。在一个实施例中，接地弹簧可以用作布置在印刷电路板上的其它表面安装部件的接地和机械保护元件。

6. 发明授权

US10225964B2 Component shielding structures with magnetic shielding 有权
公开(公告)号：US10225964B2
公开(公告)日：2019-03-05
申请号：US15250066
申请日：2016-08-29
申请人： Apple Inc.
发明人： James B. Smith , Daniel W. Jarvis , David A. Pakula , Gregory N. Stephens , Nicholas G. L. Merz , Shayan Malek , Sina Bigdeli
IPC分类号： H05K9/00 , H05K1/18 , H01L23/552
摘要： Electrical components may be shielded using a shielding can or other shielding structure that covers the electrical components. The electrical components and the shielding structure may be mounted on a substrate such as a printed circuit board using solder or other conductive material. The shielding structure may have one or more shielding layers. The shielding layers may include high conductivity material for providing shielding for radio-frequency electromagnetic interference and magnetic material for blocking magnetic flux. Shielding structures may be formed from materials such as ferritic stainless steel, coatings that enhance solderability, corrosion resistance, and conductivity, magnetic materials printed or otherwise formed on metal layers, and other shielding structures.

7. 发明授权

US09966587B2 Battery for routing signals 有权
公开(公告)号：US09966587B2
公开(公告)日：2018-05-08
申请号：US14832989
申请日：2015-08-21
申请人： Apple Inc.
发明人： Richard A. Besen , David A. Pakula , Gregory N. Stephens
IPC分类号： H01M10/02 , H01M2/30 , G06F1/26 , H01M2/10 , H01M10/42
CPC分类号： H01M2/30 , G06F1/26 , H01M2/1016 , H01M2/1066 , H01M10/4257
摘要： This application relates to batteries that are capable of routing signals that are separate from the charge supplied by the batteries. In some embodiments, a battery can incorporate a conductive trace that extends through a portion of the battery to allow for signals to be routed through the battery, as opposed to around the battery. The conductive trace can be a single wire, multiple wires, a coaxial trace, optical cable, or any other mechanism for allowing a signal to be transmitted between one or more components. By providing the conductive trace within the battery, shorter pathways to components can be created thereby reducing signal or power loss over the pathways.

8. 发明授权

US09538662B2 3D flex soldering 有权
标题翻译： 3D柔性焊接
公开(公告)号：US09538662B2
公开(公告)日：2017-01-03
申请号：US14574191
申请日：2014-12-17
申请人： Apple Inc.
发明人： Richard A. Besen , Eric W. Bates , Gregory N. Stephens
IPC分类号： H04M1/00 , H05K1/18 , H01R12/00 , H05K3/34
CPC分类号： H05K1/189 , H01R12/00 , H05K3/3431 , H05K3/3436 , H05K2201/10189 , H05K2201/10333 , H05K2201/2036 , Y02P70/613
摘要： In some designs, getting a flexible circuit (flex) to assume a bent state can be helpful in efficiently routing electrically conductive pathways. One efficient way to implement soldering of flexes in a bent state during a reflow operation is to manipulate paneling that hold batches of the flexes to reliably maintain a suitable bend in those flexes. In some embodiments, a flex can be surface mounted to a portion or the whole of an electric device during a reflow operation during which the bent state is maintained by paneling that is at least partially attached to a periphery of the flex. Another solution is to utilize vacuum or hot glue fixtures to maintain a bend in the flex during surface mounting and reflow operations.
摘要翻译：在某些设计中，使柔性电路（flex）呈现弯曲状态可有助于有效地布线导电通路。在回流操作期间实现弯曲状态下的弯曲焊接的一种有效方式是操纵镶板，其将多个弯曲部分保持在可弯曲的位置，以可靠地保持弯曲。在一些实施例中，柔性件可以在回流操作期间表面安装到电气设备的一部分或全部，在此期间，弯曲状态通过至少部分地附接到柔性件的周边的镶板来保持。另一个解决方案是在表面安装和回流操作期间利用真空或热胶装置来保持弯曲。

9. 发明申请

US20160066438A1 Component Protection Structures for Electronic Devices 有权
标题翻译：电子元器件保护结构
公开(公告)号：US20160066438A1
公开(公告)日：2016-03-03
申请号：US14801686
申请日：2015-07-16
申请人： Apple Inc.
发明人： Shayan Malek , David A. Pakula , Gregory N. Stephens , Sawyer I. Cohen , Scott A. Myers , Tyler B. Cater , Eric W. Bates
IPC分类号： H05K5/00 , H05K1/18 , H05K1/11
CPC分类号： H05K1/181 , G06F1/1658 , H05K2201/10151 , H05K2201/10219 , H05K2201/10598 , Y02P70/611
摘要： An electronic device may have a printed circuit to which electrical components are mounted. The electrical components may include a thermal sensor and a pressure sensor. A through hole in the printed circuit may receive the shaft of a standoff The standoff may be soldered to plated metal on the sides of the through hole. A screw or other fastener may secure the printed circuit to a housing for the electronic device. A ring-shaped metal member may be soldered to the printed circuit. The ring-shaped metal member may form a bumper that surrounds the screw or other fastener and the thermal sensor. The pressure sensor may have a port through which ambient pressure measurements are made. A dust protection cover such as a fabric or other porous layer may cover the port.
摘要翻译：电子设备可以具有安装电气部件的印刷电路。电气部件可以包括热传感器和压力传感器。印刷电路中的通孔可以接收支架的轴。支座可以焊接到通孔侧面的电镀金属。螺钉或其他紧固件可将印刷电路固定到电子设备的外壳。可以将环形金属构件焊接到印刷电路。环形金属构件可以形成围绕螺钉或其他紧固件和热传感器的保险杠。压力传感器可以具有通过其进行环境压力测量的端口。诸如织物或其它多孔层的防尘罩可以覆盖端口。

10. 发明授权

US09161434B2 Methods for shielding electronic components from moisture 有权
标题翻译：屏蔽电子元件免受潮湿的方法
公开(公告)号：US09161434B2
公开(公告)日：2015-10-13
申请号：US14230639
申请日：2014-03-31
申请人： Apple Inc.
发明人： Nicholas G. Merz , Scott A. Myers , Gregory N. Stephens , Joseph C. Poole
IPC分类号： H01L21/00 , H05K1/02 , C23C16/50 , H05K3/28 , C23C16/04
CPC分类号： H05K1/0216 , C23C16/042 , C23C16/50 , H05K3/282 , H05K3/284 , H05K2201/0715 , H05K2201/09872 , H05K2201/10189 , H05K2201/10371
摘要： Methods for applying a hydrophobic coating to various components within a computing device are disclosed. More specifically, a hydrophobic coating can be applied by a plasma assisted chemical vapor deposition (PACVD) process to a fully assembled circuit board. Frequently, a fully assembled circuit board can have various components such as electromagnetic interference (EMI) shields which cover water sensitive electronics. A method is disclosed for perforating portions of the EMI shields that overlay the water sensitive electronics. Methods of sealing board to board connectors are also disclosed. In one embodiment solder leads of the board to board connectors can be covered by a silicone seal.
摘要翻译：公开了将疏水涂层施加到计算装置内的各种部件的方法。更具体地，疏水涂层可以通过等离子体辅助化学气相沉积（PACVD）方法施加到完全组装的电路板上。通常，完全组装的电路板可以具有各种部件，例如覆盖水敏电子器件的电磁干扰（EMI）屏蔽。公开了一种用于穿透覆盖水敏电子器件的EMI屏蔽部分的穿孔方法。还公开了板对板连接器的密封方法。在一个实施例中，板对板连接器的焊接引线可以被硅树脂密封覆盖。

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