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    • 5. 发明申请
    • THERMAL MANAGEMENT OF AN INTEGRATED CIRCUIT
    • 集成电路的热管理
    • US20140365793A1
    • 2014-12-11
    • US14297472
    • 2014-06-05
    • Apple Inc.
    • Keith CoxKit-Man WanGaurav Kapoor
    • G06F1/20G06F1/32
    • G06F1/206G06F1/3203Y02D10/16
    • Methods for thermal management of an integrated circuit are disclosed. In particular, a dual control loop, having a first control loop and a second control loop, is used to maintain the temperature of an integrated circuit at a first temperature and a second temperature, respectively. In order to prevent the integrated circuit from overheating during periods of rapid temperature increase, the second control loop may be configured to control temperature at the second temperature below the specification limit of the integrated circuit by reducing power to the integrated circuit. The second control loop samples and maintains temperature of the integrated circuit at time intervals relatively faster than that of the first control loop. However, the second control loop is configured to release control to the first control loop when the temperature of the integrated circuit is reduced. The first control loop may then control power to the integrated circuit.
    • 公开了集成电路的热管理方法。 特别地,使用具有第一控制回路和第二控制回路的双重控制回路来将集成电路的温度分别维持在第一温度和第二温度。 为了防止集成电路在快速升温期间过热,第二控制回路可以被配置为通过降低集成电路的功率来将第二温度的温度控制在集成电路的规格极限以下。 第二控制回路以比第一控制回路相对更快的时间间隔采样和维持集成电路的温度。 然而,当集成电路的温度降低时,第二控制回路被配置为释放对第一控制回路的控制。 然后,第一控制环路可以控制集成电路的电力。