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1. 发明授权

US10589399B2 Textured small pad for chemical mechanical polishing 有权
公开(公告)号：US10589399B2
公开(公告)日：2020-03-17
申请号：US15461944
申请日：2017-03-17
申请人： Applied Materials, Inc.
发明人： Jeonghoon Oh , Edwin C. Suarez , Jason Garcheung Fung , Eric Lau , King Yi Heung , Ashwin Murugappan Chockalingam , Daniel Redfield , Charles C. Garretson , Thomas H. Osterheld
IPC分类号： B24B37/26 , B24B37/10
摘要： A chemical mechanical polishing system includes a substrate support configured to hold a substrate, a polishing pad assembly include a membrane and a polishing pad portion having a polishing surface, a polishing pad carrier, and a drive system configured to cause relative motion between the substrate support and the polishing pad carrier. The polishing pad portion is joined to the membrane on a side opposite the polishing surface. The polishing surface has a width parallel to the polishing surface at least four times smaller than a diameter of the substrate. An outer surface of the polishing pad portion includes at least one recess and at least one plateau having a top surface that provides the polishing surface. The polishing surface has a plurality of edges defined by intersections between side walls of the at least one recess and a top surface of the at least one plateau.

2. 发明申请

US20160016280A1 ORBITAL POLISHING WITH SMALL PAD 审中-公开
标题翻译： ORBITAL POLISHING WITH SMAD PAD
公开(公告)号：US20160016280A1
公开(公告)日：2016-01-21
申请号：US14334608
申请日：2014-07-17
申请人： Applied Materials, Inc.
发明人： Hung Chih Chen , Paul D. Butterfield , Jay Gurusamy , Jason Garcheung Fung , Shou-Sung Chang , Jimin Zhang , Eric Lau
IPC分类号： B24B37/10 , H01L21/768 , H01L21/67
CPC分类号： B24B37/10
摘要： A chemical mechanical polishing apparatus includes a plate on which a substrate is received, and a movable polishing pad support and coupled polishing pad which move across the substrate and orbit a local region of the substrate during polishing operation. The load of the pad against the substrate, the revolution rate of the pad, and the size, shape, and composition of the pad, may be varied to control the rate of material removed by the pad.
摘要翻译：化学机械抛光装置包括其上容纳有基底的板，以及可抛光垫支撑和耦合的抛光垫，其在抛光操作期间移动穿过基板并且在基板的局部区域上轨道。可以改变衬垫抵靠衬底的载荷，垫的转速以及衬垫的尺寸，形状和组成，以控制衬垫移除的材料的速率。

3. 发明申请

US20220001507A1 CORRECTION OF FABRICATED SHAPES IN ADDITIVE MANUFACTURING 有权
公开(公告)号：US20220001507A1
公开(公告)日：2022-01-06
申请号：US17478836
申请日：2021-09-17
申请人： Applied Materials, Inc.
发明人： Mayu Felicia Yamamura , Jason Garcheung Fung , Daniel Redfield , Rajeev Bajaj , Hou T. Ng
IPC分类号： B24B37/26 , B24D18/00 , B29C64/393 , B29C64/112 , B29C64/165 , B33Y10/00 , B33Y30/00 , B33Y50/02 , B33Y80/00 , B24B37/20
摘要： A method of fabricating an object using an additive manufacturing system includes receiving data indicative of a desired shape of the object to be fabricated by droplet ejection. The desired shape defines a profile including a top surface and one or more recesses. Data indicative of a pattern of dispensing feed material is generated to at least partially compensate for distortions of the profile caused by the additive manufacturing system, and a plurality of layers of the feed material are dispensed by droplet ejection in accordance to the pattern.

4. 发明申请

US20210114172A1 USING SACRIFICIAL MATERIAL IN ADDITIVE MANUFACTURING OF POLISHING PADS 有权
公开(公告)号：US20210114172A1
公开(公告)日：2021-04-22
申请号：US17137304
申请日：2020-12-29
申请人： Applied Materials, Inc.
发明人： Daniel Redfield , Jason Garcheung Fung , Mayu Felicia Yamamura
IPC分类号： B24D11/00 , B29C64/112 , B29C64/393 , B33Y30/00 , B33Y80/00 , B33Y50/02 , B33Y10/00 , B29C64/282 , B29C64/40 , C09G1/16
摘要： A method of fabricating a polishing pad using an additive manufacturing system includes depositing a first set successive layers by droplet ejection to form a. Depositing the successive layers includes dispensing a polishing pad precursor to first regions corresponding to partitions of the polishing pad and dispensing a sacrificial material to second regions corresponding to grooves of the polishing pad. Removing the sacrificial material provides the polishing pad with a polishing surface that has the partitions separated by the grooves.

5. 发明授权

US10882160B2 Correction of fabricated shapes in additive manufacturing using sacrificial material 有权
公开(公告)号：US10882160B2
公开(公告)日：2021-01-05
申请号：US15873851
申请日：2018-01-17
申请人： Applied Materials, Inc.
发明人： Daniel Redfield , Jason Garcheung Fung , Mayu Felicia Yamamura
IPC分类号： B24D11/00 , B29C64/112 , B29C64/393 , B33Y10/00 , B33Y30/00 , B33Y50/02 , B33Y80/00 , B29C64/282 , B29C64/40 , C09G1/16 , B24B37/20 , B29L31/00
摘要： A method of fabricating a polishing pad using an additive manufacturing system includes depositing a first set of successive layers onto a support by droplet ejection. Depositing the first set of successive layers includes dispensing a polishing pad precursor to first regions corresponding to partitions of the polishing pad and dispensing a sacrificial material to second regions corresponding to grooves of the polishing pad. A second set of successive layers is deposited by droplet ejection over the first set of successive layers. The second set of successive layers corresponds to a lower portion of the polishing pad. The first set of successive layer and the second set of successive layers provide a body. The body is removed from the support. Removing the sacrificial material from the body provides the polishing pad with a polishing surface that has the partitions separated by the grooves.

6. 发明申请

US20190283208A1 Pad Conditioner Cut Rate Monitoring 审中-公开
公开(公告)号：US20190283208A1
公开(公告)日：2019-09-19
申请号：US16294604
申请日：2019-03-06
申请人： Applied Materials, Inc.
发明人： Sivakumar Dhandapani , Sameer Deshpande , Jason Garcheung Fung
IPC分类号： B24B49/10 , B24B37/013 , B24B37/04 , B24B53/017 , G01N27/90 , G01B7/06
摘要： An apparatus for chemical mechanical polishing includes a platen having a surface to support a polishing pad, a carrier head to hold a substrate against a polishing surface of the polishing pad, a pad conditioner to hold a conditioning disk against the polishing surface, an in-situ polishing pad thickness monitoring system, and a controller. The controller is configured to store data associating each of a plurality of conditioner disk products with a respective threshold value, receive an input selecting a conditioner disk product from the plurality of conditioner disk products, determine a particular threshold value associated with the selected conditioner disk product, receive a signal from the monitoring system, generate a measure of a pad cut rate from the signal, and generate an alert if the pad cut rate falls beyond the particular threshold value.

7. 发明申请

US20230009519A1 ACOUSTIC WINDOW IN PAD POLISHING AND BACKING LAYER FOR CHEMICAL MECHANICAL POLISHING 有权
公开(公告)号：US20230009519A1
公开(公告)日：2023-01-12
申请号：US17858000
申请日：2022-07-05
申请人： Applied Materials, Inc.
发明人： Nicholas A. Wiswell , Benjamin Cherian , Thomas H. Osterheld , Jason Garcheung Fung
IPC分类号： B24B37/20
摘要： A polishing pad includes a polishing layer, a backing layer, and an acoustic window extending through the backing layer and the polishing layer, wherein an upper surface of the acoustic window is coplanar with a polishing surface of the polishing layer.

8. 发明授权

US11154961B2 Correction of fabricated shapes in additive manufacturing 有权
公开(公告)号：US11154961B2
公开(公告)日：2021-10-26
申请号：US16737818
申请日：2020-01-08
申请人： Applied Materials, Inc.
发明人： Mayu Felicia Yamamura , Jason Garcheung Fung , Daniel Redfield , Rajeev Bajaj , Hou T. Ng
IPC分类号： B24B37/26 , B24D18/00 , B29C64/393 , B29C64/112 , B29C64/165 , B33Y10/00 , B33Y30/00 , B33Y50/02 , B33Y80/00 , B24B37/20 , B29L31/00
摘要： A method of fabricating a polishing pad using an additive manufacturing system includes receiving data indicative of a desired shape of the polishing pad to be fabricated by droplet ejection. The desired shape defines a profile including a polishing surface and one or more grooves on the polishing pad. Data indicative of a modified pattern of dispensing feed material is generated to at least partially compensate for distortions of the profile caused by the additive manufacturing system, and a plurality of layers of the feed material are dispensed by droplet ejection in accordance to the modified pattern.

9. 发明授权

US09308623B2 Multi-disk chemical mechanical polishing pad conditioners and methods 有权
标题翻译：多盘化学机械抛光垫调节剂及方法
公开(公告)号：US09308623B2
公开(公告)日：2016-04-12
申请号：US14256704
申请日：2014-04-18
申请人： Applied Materials, Inc.
发明人： Hung Chen , Shou-Sung Chang , Jason Garcheung Fung , Matthew A. Gallelli , Paul D. Butterfield , Kevin Chou
IPC分类号： B24B53/017
CPC分类号： B24B53/017
摘要： A pad conditioner may include multiple independently mounted conditioning elements configured to condition a polishing pad used in, e.g., a chemical mechanical polishing (CMP) process. In some embodiments, the pad conditioner may include a main assembly disk and a main assembly base plate attached to the main assembly disk via a gimbal connection. A plurality of pad conditioner assemblies may be attached to the main assembly base plate. In some embodiments, each pad conditioner assembly may include a pad conditioner disk attached to the main assembly base plate, a pad conditioner base attached to the pad conditioner disk via a gimbal connection, and a conditioning element attached to the pad conditioner base. Methods of conditioning a polishing pad are also provided, as are other aspects.
摘要翻译：衬垫调节器可以包括多个独立安装的调节元件，其被配置为调节在例如化学机械抛光（CMP）工艺中使用的抛光垫。在一些实施例中，垫调节器可以包括主组件盘和通过万向接头连接到主组件盘的主组件底板。多个垫调节器组件可以附接到主组件基板。在一些实施例中，每个垫调节器组件可以包括附接到主组件基板的垫调节器盘，通过万向接头连接到垫调节盘的垫调节器基座和附接到垫调节器基座的调节元件。还提供了调整抛光垫的方法，以及其它方面。

10. 发明申请

US20140315473A1 MULTI-DISK CHEMICAL MECHANICAL POLISHING PAD CONDITIONERS AND METHODS 有权
标题翻译：多盘化学机械抛光垫片调节器及方法
公开(公告)号：US20140315473A1
公开(公告)日：2014-10-23
申请号：US14256704
申请日：2014-04-18
申请人： Applied Materials, Inc.
发明人： Hung Chen , Shou-Sung Chang , Jason Garcheung Fung , Matthew A. Gallelli , Paul D. Butterfield , Kevin Chou
IPC分类号： B24B53/017
CPC分类号： B24B53/017
摘要： A pad conditioner may include multiple independently mounted conditioning elements configured to condition a polishing pad used in, e.g., a chemical mechanical polishing (CMP) process. In some embodiments, the pad conditioner may include a main assembly disk and a main assembly base plate attached to the main assembly disk via a gimbal connection. A plurality of pad conditioner assemblies may be attached to the main assembly base plate. In some embodiments, each pad conditioner assembly may include a pad conditioner disk attached to the main assembly base plate, a pad conditioner base attached to the pad conditioner disk via a gimbal connection, and a conditioning element attached to the pad conditioner base. Methods of conditioning a polishing pad are also provided, as are other aspects.
摘要翻译：衬垫调节器可以包括多个独立安装的调节元件，其被配置为调节在例如化学机械抛光（CMP）工艺中使用的抛光垫。在一些实施例中，垫调节器可以包括主组件盘和通过万向接头连接到主组件盘的主组件底板。多个垫调节器组件可以附接到主组件基板。在一些实施例中，每个垫调节器组件可以包括附接到主组件基板的垫调节器盘，通过万向接头连接到垫调节盘的垫调节器基座和附接到垫调节器基座的调节元件。还提供了调整抛光垫的方法，以及其它方面。

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