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    • 2. 发明申请
    • EXTREME EDGE AND SKEW CONTROL IN ICP PLASMA REACTOR
    • ICP等离子体反应器的极端边缘和轴流控制
    • US20150181684A1
    • 2015-06-25
    • US14543316
    • 2014-11-17
    • Applied Materials, Inc.
    • Samer BANNAVladimir KNYAZIKKyle TANTIWONG
    • H05H1/24H01L21/67H01L21/3065
    • H05H1/24H01J37/321H01J37/32174H01J37/32642H01J37/32697H01L21/6875
    • Embodiments of the present disclosure provide apparatus and methods for improving plasma uniformity around edge regions and/or reducing non-symmetry in a plasma processing chamber. One embodiment of the present disclosure provides a plasma tuning assembly having one or more conductive bodies disposed around an edge region of a substrate support in a plasma processing chamber. The one or more conductive bodies are isolated from other chamber components and electrically floating in the processing chamber near the edge region without connecting to active electrical potentials. During operation, when a plasma is maintained in the plasma processing chamber, the presence of the one or more conductive bodies affects the plasma distribution near the one or more conductive bodies.
    • 本公开的实施例提供了用于改善边缘区域周围的等离子体均匀性和/或降低等离子体处理室中的非对称性的装置和方法。 本公开的一个实施例提供了等离子体调谐组件,其具有设置在等离子体处理室中的衬底支撑件的边缘区域周围的一个或多个导电体。 一个或多个导电体与其它腔室部件隔离,并且在边缘区域附近电处理室中浮动,而不会连接到有源电位。 在操作期间,当在等离子体处理室中维持等离子体时,一个或多个导电体的存在影响一个或多个导电体附近的等离子体分布。
    • 6. 发明申请
    • MULTI-ZONE HEATED ESC WITH INDEPENDENT EDGE ZONES
    • 多区加热ESC与独立的边缘区域
    • US20150364354A1
    • 2015-12-17
    • US14762796
    • 2014-03-10
    • APPLIED MATERIALS, INC.
    • Kyle TANTIWONGVladimir KNYAZIKSamer BANNA
    • H01L21/683H01J37/32
    • H01L21/6833H01J37/3244H01L21/67109H01L21/67248H01L21/6831Y10T279/23
    • An electrostatic chuck (ESC) with a cooling base for plasma processing chambers, such as a plasma etch chamber. In embodiments, a plasma processing chuck includes a plurality of independent edge zones. In embodiments, the edge zones are segments spanning different azimuth angles of the chuck to permit independent edge temperature tuning, which may be used to compensate for other chamber related non-uniformities or incoming wafer non-uniformities. In embodiments, the chuck includes a center zone having a first heat transfer fluid supply and control loop, and a plurality of edge zones, together covering the remainder of the chuck area, and each having separate heat transfer fluid supply and control loops. In embodiments, the base includes a diffuser, which may have hundreds of small holes over the chuck area to provide a uniform distribution of heat transfer fluid.
    • 具有用于等离子体处理室的冷却基座的静电卡盘(ESC),例如等离子体蚀刻室。 在实施例中,等离子体处理卡盘包括多个独立的边缘区域。 在实施例中,边缘区域是跨越卡盘的不同方位角的区段,以允许独立的边缘温度调节,其可以用于补偿其它室相关的不均匀性或进入的晶片非均匀性。 在实施例中,卡盘包括具有第一传热流体供应和控制回路以及多个边缘区域的中心区域,其一起覆盖卡盘区域的其余部分,并且每个具有单独的传热流体供应和控制回路。 在实施例中,底座包括扩散器,其可以在卡盘区域上方具有数百个小孔以提供传热流体的均匀分布。
    • 7. 发明申请
    • ELECTROSTATIC CHUCK WITH CONCENTRIC COOLING BASE
    • 具有集中冷却基座的静电卡盘
    • US20140209596A1
    • 2014-07-31
    • US14162510
    • 2014-01-23
    • Applied Materials, Inc.
    • Dmitry LUBOMIRSKYKyle TANTIWONGSamer BANNA
    • H01L21/02
    • H01L21/6831H01L21/67H01L21/67098
    • Embodiments of the present disclosure generally provide apparatus and method for cooling a substrate support in a uniform manner. One embodiment of the present disclosure provides a cooling assembly for a substrate support. The cooling assembly includes a cooling base having a first side for contacting the substrate support and providing cooling to the substrate support, a diffuser disposed on a second side of the cooling base, wherein the diffuser defines a plurality of cooling paths for delivering a cooling fluid towards the cooling base in a parallel manner, and an inlet/outlet plate disposed under the diffuser, wherein the inlet/outlet plate is provides an interface between the diffuser and an inlet and outlet of a cooling fluid.
    • 本公开的实施例通常提供用于以均匀方式冷却衬底支撑件的装置和方法。 本公开的一个实施例提供了一种用于衬底支撑件的冷却组件。 所述冷却组件包括冷却基座,所述冷却基座具有用于接触所述基板支撑件并且向所述基板支撑件提供冷却的第一侧,设置在所述冷却基座的第二侧上的扩散器,其中所述扩散器限定多个用于输送冷却流体的冷却路径 以平行方式朝向冷却基座,以及设置在扩散器下方的入口/出口板,其中入口/出口板提供扩散器与冷却流体的入口和出口之间的界面。