专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

US20130088808A1 ELECTROSTATIC CHUCK 有权
标题翻译：静电卡
公开(公告)号：US20130088808A1
公开(公告)日：2013-04-11
申请号：US13630136
申请日：2012-09-28
申请人： APPLIED MATERIALS, INC.
发明人： VIJAY D. PARKHE , STEVEN V. SANSONI , CHENG-HSIUNG MATTHEW TSAI
IPC分类号： H02N13/00
CPC分类号： H02N13/00 , H01L21/6833
摘要： Embodiments of electrostatic chucks are provided herein. In some embodiments, an electrostatic chuck for retaining a substrate includes a base plate, a ceramic plate, supported by the base plate, having a substrate supporting surface, a first plurality of electrodes disposed within the ceramic plate having a first polarity, and a second plurality of electrodes disposed within the ceramic plate have a second polarity opposite from the first polarity, wherein the first and second plurality of electrodes are independently controllable to provide a desired chucking power and frequency.
摘要翻译：本文提供了静电卡盘的实施例。在一些实施例中，用于保持基板的静电卡盘包括基板，由基板支撑的陶瓷板，具有基板支撑表面，设置在具有第一极性的陶瓷板内的第一多个电极，设置在陶瓷板内的多个电极具有与第一极性相反的第二极性，其中第一和第二多个电极是独立可控的以提供期望的夹持功率和频率。

2. 发明申请

US20130319854A1 SUBSTRATE SUPPORT WITH RADIO FREQUENCY (RF) RETURN PATH 有权
标题翻译：基站支持无线射频（RF）返回路径
公开(公告)号：US20130319854A1
公开(公告)日：2013-12-05
申请号：US13899808
申请日：2013-05-22
申请人： APPLIED MATERIALS, INC.
发明人： VIJAY D. PARKHE , RYAN HANSON
IPC分类号： C23C14/50
CPC分类号： C23C14/50 , H01J37/32577 , H01J37/32697 , H01J37/32715 , H01J37/32724 , H01J37/34
摘要： Embodiments of substrate supports having a radio frequency (RF) return path are provided herein. In some embodiments, a substrate support may include a dielectric support body having a support surface to support a substrate thereon and an opposing second surface; a chucking electrode disposed within the support body proximate the support surface; and an RF return path electrode disposed on the second surface of the dielectric support body. In some embodiments, a substrate processing system may include a process chamber having an inner volume; a shield to separate the inner volume into a processing volume and a non-processing volume and extending toward a ceiling of the process chamber; and a substrate support disposed below the shield, wherein the substrate support is as described above.
摘要翻译：本文提供了具有射频（RF）返回路径的基板支架的实施例。在一些实施例中，衬底支撑件可以包括电介质支撑体，其具有支撑表面以支撑其上的衬底和相对的第二表面; 夹持电极，设置在所述支撑体内靠近所述支撑表面; 以及设置在电介质支撑体的第二表面上的RF返回路径电极。在一些实施例中，衬底处理系统可以包括具有内部容积的处理室; 将内部体积分离成处理体积和非处理体积并延伸到处理室的天花板的屏蔽件; 以及设置在所述屏蔽件下方的衬底支撑件，其中所述衬底支撑件如上所述。

3. 发明申请

US20230072594A1 HIGH POWER ELECTROSTATIC CHUCK DESIGN WITH RADIO FREQUENCY COUPLING 有权
公开(公告)号：US20230072594A1
公开(公告)日：2023-03-09
申请号：US17985764
申请日：2022-11-11
申请人： Applied Materials, Inc.
发明人： JAEYONG CHO , VIJAY D. PARKHE , HAITAO WANG , KARTIK RAMASWAMY , CHUNLEI ZHANG
IPC分类号： H01L21/683 , C23C16/458 , C23C16/46 , C23C16/505 , H01J37/32
摘要： An electrostatic chuck is described that has radio frequency coupling suitable for use in high power plasma environments. In some examples, the chuck includes a base plate, a top plate, a first electrode in the top plate proximate the top surface of the top plate to electrostatically grip a workpiece, and a second electrode in the top plate spaced apart from the first electrode, the first and second electrodes being coupled to a power supply to electrostatically charge the first electrode.

4. 发明申请

US20180012790A1 SUBSTRATE CARRIER 审中-公开
公开(公告)号：US20180012790A1
公开(公告)日：2018-01-11
申请号：US15643855
申请日：2017-07-07
申请人： APPLIED MATERIALS, INC.
发明人： VIJAY D. PARKHE
IPC分类号： H01L21/687
CPC分类号： H01L21/68728 , H01L21/68721 , H01L21/68757 , H01L21/68771 , H01L21/68785
摘要： Embodiments of substrate carriers and method of making the same are provided herein. In some embodiments, a substrate carrier includes a substantially planar body; and a plurality of holding elements arranged on a surface of the substantially planar body, wherein the plurality of holding elements are configured to hold a plurality of substrates on the surface of the substantially planar body, and wherein the plurality of holding elements includes at least three holding elements disposed around a corresponding position of each of the plurality of substrates.

5. 发明申请

US20130088809A1 ELECTROSTATIC CHUCK WITH TEMPERATURE CONTROL 有权
标题翻译：具有温度控制的静电卡盘
公开(公告)号：US20130088809A1
公开(公告)日：2013-04-11
申请号：US13630196
申请日：2012-09-28
申请人： APPLIED MATERIALS, INC.
发明人： VIJAY D. PARKHE , STEVEN V. SANSONI , CHENG-HSIUNG MATTHEW TSAI
IPC分类号： F28F3/00 , H02N13/00
CPC分类号： F28F3/00 , B23Q3/15 , B23Q3/1543 , H01L21/67109 , H01L21/683 , H01L21/6831 , H02N13/00
摘要： Embodiments of an apparatus for controlling a temperature of an electrostatic chuck in a process chamber are provided herein. In some embodiments, the apparatus includes an electrostatic chuck disposed in a process chamber, the electrostatic chuck including a ceramic plate having a substrate supporting surface, and a cooling assembly including a plurality of cooling plates disposed below the electrostatic chuck to adjust the cooling capacity of the electrostatic chuck. In some embodiments, the plurality of cooling plates includes an inner cooling plate configured to control a temperature of a center portion of the electrostatic chuck, and an outer cooling plate configured to control a temperature of an outer portion of the electrostatic chuck. In some embodiments, the plurality of cooling plates includes an upper cooling plate that contacts a bottom surface of the electrostatic chuck, and a lower cooling plate which contacts a bottom surface of the upper cooling plate.
摘要翻译：本文提供了用于控制处理室中的静电卡盘的温度的装置的实施例。在一些实施例中，该设备包括设置在处理室中的静电吸盘，静电吸盘包括具有基板支撑表面的陶瓷板，以及包括设置在静电卡盘下方的多个冷却板的冷却组件，以调节冷却能力静电吸盘。在一些实施例中，多个冷却板包括构造成控制静电卡盘的中心部分的温度的内部冷却板和被配置为控制静电卡盘的外部部分的温度的外部冷却板。在一些实施例中，多个冷却板包括接触静电卡盘的底表面的上部冷却板和接触上部冷却板底面的下部冷却板。

6. 发明申请

US20200234991A1 SUBSTRATE CARRIER 审中-公开
公开(公告)号：US20200234991A1
公开(公告)日：2020-07-23
申请号：US16746285
申请日：2020-01-17
申请人： APPLIED MATERIALS, INC.
发明人： FRED ERIC RUHLAND , SUMIT S. PATANKAR , VIJAY D. PARKHE , DANIEL LEE DIEHL , MINGWEI ZHU , HIROYUKI TAKAHAMA , RANDY D. SCHMIEDING
IPC分类号： H01L21/677
摘要： Embodiments of a substrate carrier are provided herein. In some embodiments, a substrate carrier includes a base plate, wherein the base plate is a thin, solid plate with no through holes or embedded components; and a plurality of raised portions extending from the base plate, wherein the plurality of raised portions include first raised portions and second raised portions, the first raised portions disposed radially inward from the second raised portions, wherein the base plate and the plurality of raised portions define pockets configured to retain a plurality of substrates, and wherein an upper surface of the second raised portions have a greater surface area than an upper surface of the first raised portions.

7. 发明申请

US20200066571A1 SUBSTRATE CARRIER 审中-公开
公开(公告)号：US20200066571A1
公开(公告)日：2020-02-27
申请号：US16675033
申请日：2019-11-05
申请人： APPLIED MATERIALS, INC.
发明人： VIJAY D. PARKHE
IPC分类号： H01L21/687
摘要： Embodiments of substrate carriers and method of making the same are provided herein. In some embodiments, a substrate carrier includes a substantially planar body formed of an upper layer stacked on a lower layer; and a plurality of pockets formed in the substantially planar body each of which includes a support surface surrounding the pocket for supporting a substrate.

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式