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    • 6. 发明授权
    • Stacked dual-band electromagnetic band gap waveguide aperture for an electronically scanned array
    • 用于电子扫描阵列的堆叠双频带电磁带隙波导孔径
    • US07639197B1
    • 2009-12-29
    • US11495381
    • 2006-07-28
    • Brian J. Herting
    • Brian J. Herting
    • H01Q3/36H01P1/18
    • H01P1/181H01P1/182H01P1/2005H01P3/12H01P3/20H01Q21/0018
    • A dual-band stacked electromagnetic band gap (EBG) electronically scanned array (ESA) has a first aperture with a waveguide element spacing of less than λ/2 and a length to provide about 360° of upper frequency phase shift. A second aperture is stacked on the first aperture and has an element spacing of less than λ/2 at a lower frequency and a length such that when summed with the first aperture length about 360° of lower-frequency phase shift is provided. The second aperture comprises metal slats perpendicular to EBG slats to form an equivalent waveguide element with a broadwall dimension to support a TE10 mode at the upper frequency. The second aperture may also comprise metal slats and alternating frequency selective surface (FSS) slats with perpendicular EBG slats lengthening the broadwall at the upper frequency. The EBG slats provide lower-frequency phase shifting in both embodiments.
    • 双带堆叠电磁带隙(EBG)电子扫描阵列(ESA)具有波导元件间隔小于λ/ 2的第一孔径,并具有提供约360°高频相移的长度。 第二孔被堆叠在第一孔上,并且在较低频率和长度处具有小于λ/ 2的元件间隔,使得当与第一孔径长度相加时,提供约360°的低频相移。 第二孔包括垂直于EBG板条的金属板条,以形成具有宽壁尺寸的等效波导元件,以支持在较高频率下的TE10模式。 第二孔还可以包括金属板条和具有垂直EBG板条的交替频率选择表面(FSS)板条,其在较高频率上延长了宽壁。 在两个实施例中,EBG板条提供较低频率的相移。
    • 8. 发明授权
    • Parasitic antenna array for microwave frequencies
    • 用于微波频率的寄生天线阵列
    • US08878728B1
    • 2014-11-04
    • US13350917
    • 2012-01-16
    • Matilda G. LivadaruLee M. PaulsenBrian J. HertingJames B. West
    • Matilda G. LivadaruLee M. PaulsenBrian J. HertingJames B. West
    • H01Q1/38
    • H01Q3/446
    • The present invention includes a substrate; a central monopole element configured to radiate electromagnetic energy, the central monopole element disposed within a central monopole element through-hole of the substrate and extending from the first to the second surface of the substrate, the central monopole element formed by plating the central monopole element through-hole; a plurality of parasitic elements surrounding the central monopole element, each of the parasitic elements disposed within a parasitic element through-hole of the substrate and extending from the first to the second surface of the substrate, each of the plurality of parasitic elements formed by plating a parasitic element through-hole; a ground plane disposed on the second surface of the substrate; and a plurality of load circuits, each load circuit being connected to a parasitic element of the plurality of parasitic elements, each load circuit further being connected to the ground plane.
    • 本发明包括基板; 配置成辐射电磁能的中央单极元件,中央单极元件设置在衬底的中心单极元件通孔内并从衬底的第一表面延伸到第二表面,中心单极元件通过电镀中心单极元件 通孔; 围绕中央单极元件的多个寄生元件,每个寄生元件设置在衬底的寄生元件通孔内并从衬底的第一表面延伸到第二表面,每个寄生元件由电镀形成 寄生元件通孔; 设置在所述基板的第二表面上的接地平面; 和多个负载电路,每个负载电路连接到多个寄生元件的寄生元件,每个负载电路还连接到接地层。