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    • 2. 发明授权
    • Memory cell device having vertical channel and double gate structure
    • 具有垂直沟道和双栅结构的存储单元器件
    • US07863643B2
    • 2011-01-04
    • US12309959
    • 2007-09-20
    • Byung Gook ParkIl Han Park
    • Byung Gook ParkIl Han Park
    • H01L29/66
    • H01L27/115H01L27/11568
    • A memory cell device having a vertical channel and a double gate structure is provided. More specifically, a memory cell device having a vertical channel and a double gate structure is characterized by having a pillar active region with a predetermined height, which is including a first semiconductor layer forming a first source/drain region, a second semiconductor layer being placed under the first semiconductor layer with a predetermined distance and forming a second source/drain region, and a third semiconductor layer forming a body region and a channel region between the first semiconductor layer and the second semiconductor layer, and therefore, there is no need for unnecessary contacts when it is used as a unit cell for any type of memory array, not to speak of NOR type flash memory array. And the present invention makes to program/erase more effectively and increase the read speed and the amount of sensing current.
    • 提供具有垂直通道和双栅极结构的存储单元器件。 更具体地说,具有垂直沟道和双栅极结构的存储单元器件的特征在于具有预定高度的柱状有源区,其包括形成第一源极/漏极区的第一半导体层,放置第二半导体层的第二半导体层 在第一半导体层之下具有预定距离并形成第二源极/漏极区域,以及形成第一半导体层和第二半导体层之间的体区域和沟道区域的第三半导体层,因此不需要 当它被用作任何类型的存储器阵列的单位单元时,不用说NOR型闪存阵列就是不必要的接触。 并且本发明使得更有效地编程/擦除并增加读取速度和感测电流的量。
    • 4. 发明授权
    • NAND flash memory array having pillar structure and fabricating method of the same
    • 具有柱结构的NAND闪存阵列及其制造方法
    • US08324060B2
    • 2012-12-04
    • US13222246
    • 2011-08-31
    • Byung Gook ParkSeong Jae Cho
    • Byung Gook ParkSeong Jae Cho
    • H01L21/336
    • H01L27/115H01L27/11521H01L27/11524
    • A method is provided for fabricating a NAND flash memory array having vertical channels and sidewall gate structure and a fabricating method of the same. The NAND flash memory array has insulator strip structure and one or more semiconductor strips are next to the both sides of the insulator strip. The NAND flash memory array allows for an improvement of the integrity by decreasing the memory cell area by half and less, and solves the problems of the conventional three-dimensional structure regarding isolation between not only channels but also source/drain regions at the bottom of trenches. The method for fabricating the NAND flash memory array having a pillar structure uses the conventional CMOS process and an etching process with minimum masks, enables to cut down costs.
    • 提供了一种用于制造具有垂直沟道和侧壁栅极结构的NAND快闪存储器阵列的方法及其制造方法。 NAND闪存阵列具有绝缘体带结构,并且一个或多个半导体条紧邻绝缘体条的两侧。 NAND闪存阵列允许通过将存储器单元面积减小一半或更少来提高整体性,并且解决了传统的三维结构关于不仅仅是通道之间的隔离的问题,而且解决了底部的源极/漏极区域 沟渠 制造具有柱状结构的NAND快闪存储器阵列的方法使用传统的CMOS工艺和具有最小掩模的蚀刻工艺,能够降低成本。
    • 6. 发明申请
    • NAND FLASH MEMORY ARRAY HAVING PILLAR STRUCTURE AND FABRICATING METHOD OF THE SAME
    • 具有支柱结构的NAND闪存阵列及其制造方法
    • US20120058619A1
    • 2012-03-08
    • US13222246
    • 2011-08-31
    • Byung Gook ParkSeong Jae Cho
    • Byung Gook ParkSeong Jae Cho
    • H01L21/336
    • H01L27/115H01L27/11521H01L27/11524
    • A method is provided for fabricating a NAND flash memory array having vertical channels and sidewall gate structure and a fabricating method of the same. The NAND flash memory array has insulator strip structure and one or more semiconductor strips are next to the both sides of the insulator strip. The NAND flash memory array allows for an improvement of the integrity by decreasing the memory cell area by half and less, and solves the problems of the conventional three-dimensional structure regarding isolation between not only channels but also source/drain regions at the bottom of trenches. The method for fabricating the NAND flash memory array having a pillar structure uses the conventional CMOS process and an etching process with minimum masks, enables to cut down costs.
    • 提供了一种用于制造具有垂直沟道和侧壁栅极结构的NAND快闪存储器阵列的方法及其制造方法。 NAND闪存阵列具有绝缘体带结构,并且一个或多个半导体条紧邻绝缘体条的两侧。 NAND闪存阵列允许通过将存储器单元面积减小一半或更少来提高整体性,并且解决了传统的三维结构关于不仅仅是通道之间的隔离的问题,而且解决了底部的源极/漏极区域 沟渠 制造具有柱状结构的NAND快闪存储器阵列的方法使用传统的CMOS工艺和具有最小掩模的蚀刻工艺,能够降低成本。