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1. 发明授权

US09147662B1 Integrated circuit packaging system with fiber-less substrate and method of manufacture thereof 有权
标题翻译：具有无纤维基板的集成电路封装系统及其制造方法
公开(公告)号：US09147662B1
公开(公告)日：2015-09-29
申请号：US14137755
申请日：2013-12-20
申请人： Byung Tai Do , Arnel Senosa Trasporto , Sung Soo Kim
发明人： Byung Tai Do , Arnel Senosa Trasporto , Sung Soo Kim
IPC分类号： H01L23/492 , H01L23/00
CPC分类号： H01L21/4857 , H01L23/3128 , H01L23/49816 , H01L23/49822 , H01L24/73 , H01L2224/16225 , H01L2224/16235 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73253 , H01L2224/73265 , H01L2225/0651 , H01L2225/06517 , H01L2225/06558 , H01L2924/15311 , H01L2924/181 , H01L2924/00012 , H01L2924/00
摘要： An integrated circuit packaging system including: a fiber-less organic substrate including: a first dielectric layer, a first metal layer on the first dielectric layer, a second dielectric layer on the first dielectric layer and the first metal layer, and an interconnect via plated on the first metal layer and the second dielectric layer; an integrated circuit mounted over the second dielectric layer; and an integrated circuit interconnect between the integrated circuit and the interconnect via.
摘要翻译：一种集成电路封装系统，包括：无纤维有机基底，包括：第一介电层，第一介电层上的第一金属层，第一介电层和第一金属层上的第二介电层，以及经电镀的互连在第一金属层和第二介电层上; 安装在所述第二电介质层上的集成电路; 以及集成电路和互连通孔之间的集成电路互连。

2. 发明申请

US20140284791A1 CORELESS INTEGRATED CIRCUIT PACKAGING SYSTEM AND METHOD OF MANUFACTURE THEREOF 有权
标题翻译：无线集成电路包装系统及其制造方法
公开(公告)号：US20140284791A1
公开(公告)日：2014-09-25
申请号：US14214765
申请日：2014-03-15
申请人： Byung Tai Do , Arnel Senosa Trasporto , Sung Soo Kim , Asri Yusof , In Sang Yoon
发明人： Byung Tai Do , Arnel Senosa Trasporto , Sung Soo Kim , Asri Yusof , In Sang Yoon
IPC分类号： H01L23/28 , H01L23/498 , H01L23/00
CPC分类号： H01L24/81 , H01L21/4846 , H01L21/486 , H01L21/561 , H01L21/683 , H01L21/6835 , H01L23/3121 , H01L23/3128 , H01L23/3142 , H01L23/49816 , H01L23/49827 , H01L24/13 , H01L24/16 , H01L24/27 , H01L24/32 , H01L24/48 , H01L24/73 , H01L24/83 , H01L24/85 , H01L24/92 , H01L24/97 , H01L25/0657 , H01L2221/68345 , H01L2221/68381 , H01L2224/131 , H01L2224/16225 , H01L2224/16227 , H01L2224/2732 , H01L2224/27334 , H01L2224/32145 , H01L2224/32225 , H01L2224/48227 , H01L2224/73253 , H01L2224/73265 , H01L2224/81411 , H01L2224/81444 , H01L2224/81447 , H01L2224/81455 , H01L2224/81464 , H01L2224/8385 , H01L2224/85444 , H01L2224/9202 , H01L2224/97 , H01L2225/0651 , H01L2225/06517 , H01L2225/06558 , H01L2924/00014 , H01L2924/12042 , H01L2924/15311 , H01L2924/181 , H01L2924/3511 , H01L2924/00012 , H01L2924/00 , H01L2924/014 , H01L2224/83 , H01L2224/85 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A system and method for manufacturing an integrated circuit packaging system includes: forming a base substrate including: providing a sacrificial carrier: mounting a metallic sheet on the sacrificial carrier, applying a top trace to the metallic sheet, forming a conductive stud on the top trace, forming a base encapsulation over the metallic sheet, the top trace, and the conductive stud, the top trace exposed from a top surface of the base encapsulation, and removing the sacrificial carrier and the metallic sheet; mounting an integrated circuit device on the base substrate; and encapsulating the integrated circuit device and the base substrate with a top encapsulation.
摘要翻译：一种用于制造集成电路封装系统的系统和方法，包括：形成基底基底，包括：提供牺牲载体：将金属片安装在牺牲载体上，向金属片施加顶部迹线，在顶部迹线上形成导电柱在所述金属片，所述顶部迹线和所述导电柱上形成基底封装，所述顶部迹线从所述基底封装的顶部表面露出，以及移除所述牺牲载体和所述金属片; 在基底基板上安装集成电路器件; 并用顶部封装封装集成电路器件和基底衬底。

3. 发明授权

US09142530B2 Coreless integrated circuit packaging system and method of manufacture thereof 有权
标题翻译：无芯集成电路封装系统及其制造方法
公开(公告)号：US09142530B2
公开(公告)日：2015-09-22
申请号：US14214765
申请日：2014-03-15
申请人： Byung Tai Do , Arnel Senosa Trasporto , Sung Soo Kim , Asri Yusof , In Sang Yoon
发明人： Byung Tai Do , Arnel Senosa Trasporto , Sung Soo Kim , Asri Yusof , In Sang Yoon
IPC分类号： H01L23/29 , H01L23/00 , H01L23/498 , H01L21/48 , H01L21/56 , H01L21/683 , H01L25/065 , H01L23/31
CPC分类号： H01L24/81 , H01L21/4846 , H01L21/486 , H01L21/561 , H01L21/683 , H01L21/6835 , H01L23/3121 , H01L23/3128 , H01L23/3142 , H01L23/49816 , H01L23/49827 , H01L24/13 , H01L24/16 , H01L24/27 , H01L24/32 , H01L24/48 , H01L24/73 , H01L24/83 , H01L24/85 , H01L24/92 , H01L24/97 , H01L25/0657 , H01L2221/68345 , H01L2221/68381 , H01L2224/131 , H01L2224/16225 , H01L2224/16227 , H01L2224/2732 , H01L2224/27334 , H01L2224/32145 , H01L2224/32225 , H01L2224/48227 , H01L2224/73253 , H01L2224/73265 , H01L2224/81411 , H01L2224/81444 , H01L2224/81447 , H01L2224/81455 , H01L2224/81464 , H01L2224/8385 , H01L2224/85444 , H01L2224/9202 , H01L2224/97 , H01L2225/0651 , H01L2225/06517 , H01L2225/06558 , H01L2924/00014 , H01L2924/12042 , H01L2924/15311 , H01L2924/181 , H01L2924/3511 , H01L2924/00012 , H01L2924/00 , H01L2924/014 , H01L2224/83 , H01L2224/85 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A system and method for manufacturing an integrated circuit packaging system includes: forming a base substrate including: providing a sacrificial carrier: mounting a metallic sheet on the sacrificial carrier, applying a top trace to the metallic sheet, forming a conductive stud on the top trace, forming a base encapsulation over the metallic sheet, the top trace, and the conductive stud, the top trace exposed from a top surface of the base encapsulation, and removing the sacrificial carrier and the metallic sheet; mounting an integrated circuit device on the base substrate; and encapsulating the integrated circuit device and the base substrate with a top encapsulation.
摘要翻译：一种用于制造集成电路封装系统的系统和方法，包括：形成基底基底，包括：提供牺牲载体：将金属片安装在牺牲载体上，向金属片施加顶部迹线，在顶部迹线上形成导电柱在所述金属片，所述顶部迹线和所述导电柱上形成基底封装，所述顶部迹线从所述基底封装的顶部表面露出，以及移除所述牺牲载体和所述金属片; 在基底基板上安装集成电路器件; 并用顶部封装封装集成电路器件和基底衬底。

4. 发明申请

US20150179555A1 INTEGRATED CIRCUIT PACKAGING SYSTEM WITH VIALESS SUBSTRATE AND METHOD OF MANUFACTURE THEREOF 审中-公开
标题翻译：具有无色基板的集成电路封装系统及其制造方法
公开(公告)号：US20150179555A1
公开(公告)日：2015-06-25
申请号：US14136513
申请日：2013-12-20
申请人： Sung Soo Kim , Byung Tai Do , Arnel Senosa Trasporto
发明人： Sung Soo Kim , Byung Tai Do , Arnel Senosa Trasporto
IPC分类号： H01L23/495 , H01L21/48
CPC分类号： H01L21/4857 , H01L21/486 , H01L23/3128 , H01L23/49822 , H01L23/49827 , H01L2224/16225 , H01L2224/48091 , H01L2224/73265 , H01L2224/92247 , H01L2924/00014
摘要： A system and method of manufacture of an integrated circuit packaging system includes: a trace layer; a stud directly on a portion of the trace layer for forming a metal-to-metal connection with the trace layer; a dielectric layer directly on the trace layer and the stud for forming a vialess substrate exposing the trace layer and the dielectric layer; an active device on the trace layer, the trace layer exposed from the vialess substrate; a die interconnect coupled between the active device to the trace layer for providing electrical connectivity; and an external interconnect connected to the stud for electrically coupling the active device, the trace layer, the studs, and the external interconnect.
摘要翻译：集成电路封装系统的制造和制造方法包括：迹线层; 直径在轨迹层的一部分上的螺柱，用于与迹线层形成金属对金属的连接; 直接在迹线层上的电介质层和用于形成暴露痕量层和电介质层的无小心衬底的螺柱; 痕量层上的有源器件，从无小孔衬底露出的迹线层; 耦合在有源器件与迹线层之间以提供电连接的芯片互连; 以及连接到螺柱的外部互连件，用于电耦合有源器件，迹线层，螺柱和外部互连。

5. 发明申请

US20140165389A1 INTEGRATED CIRCUIT PACKAGING SYSTEM WITH ROUTABLE GRID ARRAY LEAD FRAME 审中-公开
标题翻译：集成电路包装系统，具有不可变网格阵列引线框架
公开(公告)号：US20140165389A1
公开(公告)日：2014-06-19
申请号：US13714815
申请日：2012-12-14
申请人： Byung Tai DO , Arnel Senosa Trasporto , Linda Pei Ee Chua , Sung Soo Kim
发明人： Byung Tai DO , Arnel Senosa Trasporto , Linda Pei Ee Chua , Sung Soo Kim
IPC分类号： H01L21/48
CPC分类号： H01L21/4825 , H01L23/3128 , H01L23/49548 , H01L23/49582 , H01L23/49861 , H01L24/13 , H01L24/16 , H01L24/48 , H01L24/81 , H01L2224/10175 , H01L2224/131 , H01L2224/13111 , H01L2224/16225 , H01L2224/16227 , H01L2224/16237 , H01L2224/1624 , H01L2224/48227 , H01L2224/73204 , H01L2224/81395 , H01L2224/814 , H01L2224/81439 , H01L2224/81447 , H01L2224/81455 , H01L2224/81815 , H01L2224/83102 , H01L2924/00014 , H01L2924/181 , H01L2924/3511 , Y10T29/49117 , H01L2924/014 , H01L2224/45099 , H01L2924/01047 , H01L2924/00012
摘要： System and method of manufacturing an integrated circuit packaging system using routable grid array lead frame. Method includes providing a lead frame having top metal connector and bottom contact, and treating the top metal connector with an additive, or the bottom contact with an additive, or both. Concomitant to the treatment process, insulation cover or bottom encapsulation can be formed about the top metal connector or the bottom contact with respective openings. Upon coupling the interconnects to the lead frame the interconnects do not exceed the metal contacts by more than about 60% due to the treatment process.
摘要翻译：使用可布线网格阵列引线框架制造集成电路封装系统的系统和方法。方法包括提供具有顶部金属连接器和底部接触的引线框架，以及用添加剂处理顶部金属连接器，或者与添加剂的底部接触或两者。伴随处理过程，可以围绕顶部金属连接器或与相应开口的底部接触形成绝缘盖或底部封装。在将互连件耦合到引线框架时，由于处理过程，互连不超过约60％的金属触点。

6. 发明申请

US20100017822A1 METHOD OF DISPLAYING ELECTRONIC PROGRAM GUIDE AND APPARATUS USING THE SAME 审中-公开
标题翻译：显示电子节目指南的方法和使用该方法的装置
公开(公告)号：US20100017822A1
公开(公告)日：2010-01-21
申请号：US12307530
申请日：2007-03-23
申请人： Sung Soo Kim
发明人： Sung Soo Kim
IPC分类号： H04N5/445 , H04N7/173
CPC分类号： H04N5/76 , G11B27/034 , G11B27/105 , G11B27/329 , G11B27/34 , H04N5/44543 , H04N5/781 , H04N21/4147 , H04N21/4312 , H04N21/4314 , H04N21/4334 , H04N21/47214 , H04N21/482
摘要： A method and apparatus for displaying an electronic program guide in a television receiver provided with a PVR function enhance user convenience by providing information of a program recorded and stored in the television receiver as well as information of programs currently broadcast or scheduled to be broadcast. The method of controlling a receiver includes steps of extracting electronic program guide (EPG) information from a received broadcast signal, the EPG information indicating a broadcasting schedule for a plurality of broadcast programs; searching at least one broadcast program of the plurality of broadcast programs, the searched at least one broadcast program corresponding to a temporary storage of the received broadcast signal in a storage device enabling a time-shift function; and constructing an EPG in which the searched at least one broadcast program is visually distinguishable from other broadcast programs of the plurality of broadcast programs.
摘要翻译：用于在具有PVR功能的电视接收机中显示电子节目指南的方法和装置通过提供记录和存储在电视接收机中的节目的信息以及当前广播或预定播放的节目的信息来增强用户便利性。控制接收机的方法包括从接收到的广播信号中提取电子节目指南（EPG）信息的步骤，指示多个广播节目的广播时间表的EPG信息; 搜索所述多个广播节目中的至少一个广播节目，所搜索到的与所接收的广播信号的临时存储相对应的至少一个广播节目在能够进行时移功能的存储装置中; 以及构建一个EPG，其中搜索到的至少一个广播节目在视觉上与多个广播节目中的其他广播节目区分开。

7. 发明授权

US06596830B2 Silicon-containing polymer and bilayer resist composition based thereon 失效
标题翻译：含硅聚合物和双层抗蚀剂组合物
公开(公告)号：US06596830B2
公开(公告)日：2003-07-22
申请号：US10144110
申请日：2002-05-10
申请人： Haiwon Lee , Sung Soo Kim
发明人： Haiwon Lee , Sung Soo Kim
IPC分类号： C08F3402
CPC分类号： C08F230/08 , G03F7/0045 , G03F7/0758
摘要： Polymeric compounds for use in a chemically amplified resist are represented by the following chemical formulas 1 and 2: wherein R1 and R2, which may be identical or different, are each selected from the group consisting of —H and —CH3; R3 and R4, which may be identical or different, are each selected from the group consisting of —H, —CH3 and —CH2CH3; and 0.1≦m≦0.9 and 0.1≦n≦0.9, with the equation of m+n=1. wherein R3, R4, and R5, which may be identical or different, are each selected from the group consisting of —H and —CH3; R6 and R7, which may be identical or different, are each selected from the group consisting of —H, —CH3 and —CH2CH3; R8 is —CH3 or —CH2CH2OH; and 0.1≦p≦0.9, 0.05≦q≦0.8, and 0.05≦r≦0.5, with the equation of p+q+r=1.
摘要翻译：用于化学放大抗蚀剂的聚合化合物由以下化学式1和2表示：其中可以相同或不同的R 1和R 2各自选自-H和-CH 3; R 3和R 4可以相同或不同，各自选自-H，-CH 3和-CH 2 CH 3; 并且0.1 <= m <= 0.9且0.1 <= n <= 0.9，其中m + n = 1的方程式，其中可以相同或不同的R 3，R 4和R 5各自选自 -H和-CH 3; R 6和R 7可以相同或不同，各自选自-H，-CH 3和-CH 2 CH 3; R8是-CH3或-CH2CH2OH; 和0.1 <= p <= 0.9,0.05 <= q <= 0.8和0.05 <= r <= 0.5，其中p + q + r = 1。

8. 发明授权

US08502391B2 Semiconductor device and method of making single layer substrate with asymmetrical fibers and reduced warpage 有权
标题翻译：制造具有不对称纤维的单层基板并减少翘曲的半导体装置和方法
公开(公告)号：US08502391B2
公开(公告)日：2013-08-06
申请号：US13314984
申请日：2011-12-08
申请人： Hyung Sang Park , Sung Soo Kim , SungWon Cho
发明人： Hyung Sang Park , Sung Soo Kim , SungWon Cho
IPC分类号： H01L29/40 , H01L23/28
CPC分类号： H01L24/16 , H01L21/4846 , H01L21/486 , H01L23/145 , H01L2224/16225 , H01L2224/73265 , H01L2924/01322 , H01L2924/12041 , H01L2924/12042 , H01L2924/1306 , H01L2924/13091 , H01L2924/15311 , H01L2924/181 , H01L2924/00
摘要： A semiconductor device includes a first carrier having a first resin disposed over the first carrier. A fabric is disposed over the first resin. A second resin is formed over the first resin and around the fabric to form an asymmetrical pre-impregnated (PPG) substrate. The first carrier is removed. A second carrier is provided and a first conductive layer is formed over the second carrier. A portion of the first conductive layer is removed. The first conductive layer is transferred from the second carrier to the first resin. The first conductive layer is oriented asymmetrically such that the first conductive layer is offset with respect to the fabric to minimize warpage. The second carrier is removed. A via is formed through the second resin and fabric to expose the first conductive layer. A second conductive layer formed in the via over the first conductive layer.
摘要翻译：半导体器件包括具有设置在第一载体上的第一树脂的第一载体。织物布置在第一树脂上。在第一树脂上并围绕织物形成第二树脂以形成不对称的预浸渍（PPG）基材。第一个载体被移除。提供第二载体并且在第二载体上形成第一导电层。去除第一导电层的一部分。第一导电层从第二载体转移到第一树脂。第一导电层被取向为不对称，使得第一导电层相对于织物偏移以最小化翘曲。第二个载体被移除。通过第二树脂和织物形成通孔以露出第一导电层。在第一导电层上的通孔中形成的第二导电层。

9. 发明申请

US20130147053A1 Semiconductor Device and Method of Making Single Layer Substrate with Asymmetrical Fibers and Reduced Warpage 有权
标题翻译：制造具有不对称纤维的单层基板和减少翘曲的半导体器件和方法
公开(公告)号：US20130147053A1
公开(公告)日：2013-06-13
申请号：US13314984
申请日：2011-12-08
申请人： Hyung Sang Park , Sung Soo Kim , SungWon Cho
发明人： Hyung Sang Park , Sung Soo Kim , SungWon Cho
IPC分类号： H01L23/48 , H01L21/56
CPC分类号： H01L24/16 , H01L21/4846 , H01L21/486 , H01L23/145 , H01L2224/16225 , H01L2224/73265 , H01L2924/01322 , H01L2924/12041 , H01L2924/12042 , H01L2924/1306 , H01L2924/13091 , H01L2924/15311 , H01L2924/181 , H01L2924/00
摘要： A semiconductor device includes a first carrier having a first resin disposed over the first carrier. A fabric is disposed over the first resin. A second resin is formed over the first resin and around the fabric to form an asymmetrical pre-impregnated (PPG) substrate. The first carrier is removed. A second carrier is provided and a first conductive layer is formed over the second carrier. A portion of the first conductive layer is removed. The first conductive layer is transferred from the second carrier to the first resin. The first conductive layer is oriented asymmetrically such that the first conductive layer is offset with respect to the fabric to minimize warpage. The second carrier is removed. A via is formed through the second resin and fabric to expose the first conductive layer. A second conductive layer formed in the via over the first conductive layer.
摘要翻译：半导体器件包括具有设置在第一载体上的第一树脂的第一载体。织物布置在第一树脂上。在第一树脂上并围绕织物形成第二树脂以形成不对称的预浸渍（PPG）基材。第一个载体被移除。提供第二载体并且在第二载体上形成第一导电层。去除第一导电层的一部分。第一导电层从第二载体转移到第一树脂。第一导电层被取向为不对称，使得第一导电层相对于织物偏移以最小化翘曲。第二个载体被移除。通过第二树脂和织物形成通孔以露出第一导电层。在第一导电层上的通孔中形成的第二导电层。

10. 发明申请

US20100048570A1 THIAZOLIDINE DERIVATIVES AND METHODS FOR THE PREPARATION THEREOF 审中-公开
标题翻译：噻唑烷衍生物及其制备方法
公开(公告)号：US20100048570A1
公开(公告)日：2010-02-25
申请号：US12523285
申请日：2008-01-16
申请人： Sung Soo Kim , Jin Hee Ahn , Hyae Gyeong Cheon , Sang Dal Rhee , Nam Sook Kang , Ki Young Kim , Seung Kyu Kang , Won Hoon Jung , Sung Gyu Kim , Sun Young Kim , Jae Hong Kweon , Sang Kwon Sohn , Min Ki Shin , Ni Na Ha
发明人： Sung Soo Kim , Jin Hee Ahn , Hyae Gyeong Cheon , Sang Dal Rhee , Nam Sook Kang , Ki Young Kim , Seung Kyu Kang , Won Hoon Jung , Sung Gyu Kim , Sun Young Kim , Jae Hong Kweon , Sang Kwon Sohn , Min Ki Shin , Ni Na Ha
IPC分类号： A61K31/5377 , C07D277/00 , C07D415/00 , A61K31/426
CPC分类号： C07D277/06 , C07D417/12 , Y02P20/55
摘要： The present invention relates to novel 2-carbonyl-3-acyl-1,3-thiazolidines having a β-amino group on the acyl chain, in free, prodrug form or pharmaceutically acceptable salt thereof, including their enantiomers, diastereomers and racemates, as efficient inhibitors against DPP-IV. The invention further relates to the pharmaceutical compositions comprising the disclosed compounds. The present invention also relates to methods for preparing the disclosed compounds and for treating DPP-IV-mediated diseases.
摘要翻译：本发明涉及在酰基链上具有游离的前药形式或其药学上可接受的盐，包括它们的对映异构体，非对映异构体和外消旋体的具有“ - ” - 氨基的新的2-羰基-3-酰基-1,3-噻唑烷，作为DPP-IV的有效抑制剂。本发明还涉及包含所公开的化合物的药物组合物。本发明还涉及制备所公开的化合物和用于治疗DPP-IV介导的疾病的方法。

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