专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US11634927B2 Nonconductive, modular barrier assemblies and related methods 有权
公开(公告)号：US11634927B2
公开(公告)日：2023-04-25
申请号：US16856923
申请日：2020-04-23
申请人： CBM Non-Conductive Solutions LLC
发明人： Donald E. Moore
IPC分类号： E04H17/16 , E06B11/02
摘要： The present invention provides a modular, nonconductive barrier assembly for enclosing or partitioning an area. The modular, nonconductive barrier assembly includes a number of wall panels each having multiple nonconductive posts arranged in a common plane and separated by a gap. The nonconductive posts are connected by a number of connecting rods. Each wall panel is arranged in an upright orientation on a support surface. A number of support assemblies each having a base and at least one support arm support the wall panels in an upright orientation. The base of each support assembly is positioned on a support surface, a proximal end of the support arm is releasably connected to the base and a distal end of the support arm is releasably connected to a wall panel to support the same.

2. 发明申请

US20210108440A1 Non-Conductive Privacy Fence 有权
公开(公告)号：US20210108440A1
公开(公告)日：2021-04-15
申请号：US16942406
申请日：2020-07-29
申请人： CBM Non-Conductive Solutions LLC
发明人： Donald E. Moore
IPC分类号： E04H17/16
摘要： The invention as described herein includes a substantially nonconductive barrier assembly that includes at least one longitudinal support, a barrier and a hood. The barrier is non-exclusively composed of several barrier panels. Each panel has a planar member having a front surface and a back surface and a top edge and a bottom edge; at least one rib member extends from the back surface, and the top edge of a first panel and the bottom edge of a second panel are disposed adjacent to one another to form the barrier. The barrier may be attached to the longitudinal support to span a vertical plane. The hood has an inner surface that extends from a distal edge of the hood. The hood is disposed so that an angle formed by the inner surface of the hood and a front surface of the barrier measures about 10 degrees to about 80 degrees and a perforated ledge member extending substantially horizontally and inwardly from the distal edge of the hood to the front surface of the barrier. In an embodiment, each of the support, the barrier and the hood independently comprise a nonconductive material. Also included is an enclosure formed from at least two of the barrier assemblies as described herein, wherein a first vertical edge of the first barrier assembly is attached to a second vertical edge of a second barrier assembly.

3. 发明申请

US20210115698A1 Nonconductive Modular Barrier Assemblies 有权
公开(公告)号：US20210115698A1
公开(公告)日：2021-04-22
申请号：US16942374
申请日：2020-07-29
申请人： CBM Non-Conductive Solutions, LLC
发明人： Donald E. Moore
IPC分类号： E04H17/16
摘要： As described herein the invention includes a nonconductive barrier that has a first undulating panel and a second undulating panel each having an undulation profile, and each having a first vertical edge, a second vertical edge and a back surface, and at least one, preferably two, stabilizing members that extend from the back surface of the undulating panel. The first vertical edge of the second panel is capable of engaging with the second vertical edge of the first panel to form a nonconductive barrier. Each of the panels and member(s) independently comprises a nonconductive material. In an embodiment, the first vertical edge of the second panel includes a groove extending downwardly along the vertical edge from a top of the second panel to a bottom of the second panel. The groove is defined by a first loop and a second loop, each of which extends from the first vertical edge, the groove terminating in a groove aperture. The second vertical edge of the first panel terminated in a tongue member, wherein the tongue member is configured to be slidably insertable into the groove via the aperture. Also include are related methods and enclosures that employ and/or are formed by the barrier assemblies of the invention.

4. 发明申请

US20210040768A1 Nonconductive, Modular Barrier Assemblies and Related Methods 有权
公开(公告)号：US20210040768A1
公开(公告)日：2021-02-11
申请号：US16856923
申请日：2020-04-23
申请人： CBM Non-Conductive Solutions LLC
发明人： Donald E. Moore
IPC分类号： E04H17/16 , E06B11/02
摘要： The present invention provides a modular, nonconductive barrier assembly for enclosing or partitioning an area. The modular, nonconductive barrier assembly includes a number of wall panels each having multiple nonconductive posts arranged in a common plane and separated by a gap. The nonconductive posts are connected by a number of connecting rods. Each wall panel is arranged in an upright orientation on a support surface. A number of support assemblies each having a base and at least one support arm support the wall panels in an upright orientation. The base of each support assembly is positioned on a support surface, a proximal end of the support arm is releasably connected to the base and a distal end of the support arm is releasably connected to a wall panel to support the same.

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式