专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US11483929B2 Optical module 有权
公开(公告)号：US11483929B2
公开(公告)日：2022-10-25
申请号：US17375389
申请日：2021-07-14
申请人： CIG Photonics Japan Limited
发明人： Daisuke Noguchi
IPC分类号： H05K1/11 , H05K1/02
摘要： An optical module includes: an optical sub-assembly; and a flexible substrate including an insulating film, an interconnection pattern, and a spacer layer, the flexible substrate being connected to the optical sub-assembly. The insulating film has some projections, the projections protruding from a basic area in a first direction, the projections being arranged in a second direction perpendicular to the first direction, the insulating film having a flat shape with a recess between an adjacent pair of the projections. The interconnection pattern includes some pads in the basic area on a first surface of the insulating film, the pads being arranged in the second direction. The pads include some first pads adjacent to the respective projections, the pads including at least one second pad adjacent to the recess. The spacer layer is on the first surface and at each of the protrusions.

2. 发明授权

US11340412B2 Optical module 有权
公开(公告)号：US11340412B2
公开(公告)日：2022-05-24
申请号：US17137463
申请日：2020-12-30
申请人： CIG Photonics Japan Limited
发明人： Daisuke Noguchi , Hiroshi Yamamoto
IPC分类号： H04B10/00 , G02B6/42
摘要： The relay board includes a first end face opposed to and fixed to the first surface of the conductive block, a second end face opposite to the first end face, and a top and a bottom defining thickness of the relay board. The top has a slope at a position closer to the first end face than the second end face. The slope inclines such that the thickness decreases in a direction from the first end face to the second end face. The conductor layers include a signal pattern on the top with part of the signal pattern disposed on the slope, and a first ground pattern extending from the bottom to each of the first end face and the second end face. The signal wire has one end bonded to the signal lead pin and another end bonded to the signal pattern on the slope.

3. 发明授权

US11503715B2 Optical module 有权
公开(公告)号：US11503715B2
公开(公告)日：2022-11-15
申请号：US17506861
申请日：2021-10-21
申请人： CIG Photonics Japan Limited
发明人： Daisuke Noguchi , Hiroshi Yamamoto
IPC分类号： H01S5/026 , H05K1/18 , H05K1/11
摘要： The first capacitor is opposed to and electrically connected to the first back electrode. The second capacitor is opposed to and electrically connected to the second back electrode. Each of the first circuit and the second circuit has a main region that overlaps with a corresponding one of the first capacitor and the second capacitor. At least one circuit of the first circuit and the second circuit has an extension region extending from the main region toward another circuit of the first circuit and the second circuit. At least one of one of the pair of first wires and the second wire is bonded to the extension region.

4. 发明授权

US11129279B2 Optical subassembly and optical module 有权
公开(公告)号：US11129279B2
公开(公告)日：2021-09-21
申请号：US17010722
申请日：2020-09-02
申请人： CIG Photonics Japan Limited
发明人： Daisuke Noguchi , Hiroshi Yamamoto
IPC分类号： H05K1/18 , H05K1/14 , H05K1/03 , H05K1/09 , H05K1/11 , H04B10/40 , H04B10/50 , H04B10/60
摘要： An optical subassembly includes: a support block made of ceramic in front of the first surface, the support block having a substrate mounting surface, the support block having a first side opposite to a surface in front of the first surface; an element-mounted substrate on the substrate mounting surface, the element-mounted substrate having a first conductor pattern; a pedestal made of metal and configured to be the same potential as the eyelet, the pedestal situated in front of the first surface; and a lead pin in the through-hole and for transmitting the electric signal. The support block has a metallization pattern that is electrically connected to the pedestal and is continuous from at least a part of the substrate mounting surface to at least a part of the first side.

5. 发明授权

US11089683B2 Optical module 有权
公开(公告)号：US11089683B2
公开(公告)日：2021-08-10
申请号：US16944717
申请日：2020-07-31
申请人： CIG Photonics Japan Limited
发明人： Daisuke Noguchi , Hiroshi Yamamoto
IPC分类号： H05K1/18 , H05K1/02 , H05K1/11 , H04B10/50 , H01R12/67 , H01R12/62 , H01R12/63 , H04B10/60
摘要： An insulation film has a first surface and a second surface opposite to each other and has a first portion and a second portion extending in a direction opposite to each other from a central portion. The optical subassembly is connected to the flexible printed circuit board at the central portion with the stem opposed to the second surface. The flexible printed circuit board curves with the second surface at least the central portion facing outward. The printed circuit board intervenes between edges of the first portion and the second portion and is connected to the flexible printed circuit board. The first portion and the second portion of the flexible printed circuit board curves in a shape to avoid mutual contact and three-dimensionally intersect with each other, and the first portion and the second portion on the second surface are opposed to the printed circuit board.

6. 发明授权

US11641240B2 Optical module 有权
公开(公告)号：US11641240B2
公开(公告)日：2023-05-02
申请号：US17212295
申请日：2021-03-25
申请人： CIG Photonics Japan Limited
发明人： Daisuke Noguchi , Hiroshi Yamamoto
IPC分类号： H04B10/50 , H05K1/11 , H01L33/48 , H05K1/18 , H01L23/00
摘要： An optical module includes: a light source; an optical modulator capable of modulating light from the light source; a capacitor with an upper electrode and a lower electrode; and a resistor connected in series with and bonded face-to-face to the upper electrode of the capacitor. The resistor and the capacitor are connected in parallel with the optical modulator.

7. 发明授权

US11456393B2 Optical module 有权
公开(公告)号：US11456393B2
公开(公告)日：2022-09-27
申请号：US17113390
申请日：2020-12-07
申请人： CIG Photonics Japan Limited
发明人： Daisuke Noguchi , Hiroshi Yamamoto
IPC分类号： H04B10/00 , H01L31/024 , H01L31/02
摘要： An optical module includes: a thermoelectric cooler with an upper surface and a lower surface, the lower surface fixed to the first surface of the conductive block, the thermoelectric cooler having a Peltier device therein configured to transfer heat between the upper surface and the lower surface; a metal layer laminated on the upper surface of the thermoelectric cooler; a ground wire connecting the first surface of the conductive block and the metal layer; a photoelectric device adapted to convert an optical signal and an electrical signal at least from one to another; a mounting substrate on which the photoelectric device is mounted, the mounting substrate fixed to the upper surface of the thermoelectric cooler with at least the metal layer interposed therebetween, the mounting substrate having a first wiring pattern electrically connected to the photoelectric device.

8. 发明授权

US11317513B2 Optical module 有权
公开(公告)号：US11317513B2
公开(公告)日：2022-04-26
申请号：US17113414
申请日：2020-12-07
申请人： CIG Photonics Japan Limited
发明人： Daisuke Noguchi , Hiroshi Yamamoto
IPC分类号： H05K7/00 , H05K1/14 , H05K1/11 , H05K1/18 , H05K3/28
摘要： An optical module includes a photoelectric device and a flexible printed circuit board. The flexible printed circuit board includes an insulating substrate with a first surface and a second surface, a first wiring pattern on the first surface, and a second wiring pattern on the second surface. The first wiring pattern includes a signal line with a signal terminal portion at a tip and a signal-line portion narrower than the signal terminal portion, the first wiring pattern including a pair of ground pads at positions sandwiching the signal-line portion, at least part of the pair of ground pads avoiding being adjacent to the signal terminal portion. The second wiring pattern includes a ground plane overlapping with the signal-line portion and being connected to the pair of ground pads, the second wiring pattern including a signal pad connected to the signal terminal portion.

9. 发明授权

US11125957B2 Optical module 有权
公开(公告)号：US11125957B2
公开(公告)日：2021-09-21
申请号：US16936459
申请日：2020-07-23
申请人： CIG Photonics Japan Limited
发明人： Daisuke Noguchi , Hiroshi Yamamoto
IPC分类号： G02B6/42 , H01S5/02212
摘要： An optical module includes an eyelet having a first surface, a second surface opposite to the first surface, and a penetration hole penetrating from the second surface to the first surface; a lead pin in the penetration hole, for transmitting electric signals; a pedestal protruding from the first surface in an extension direction of the lead pin; and a relay board on the pedestal, the relay board having a transmission line for electrically connecting an optical element and the lead pin. The lead pin is in no contact with an inner surface of the penetration hole. The lead pin has a flat surface which is at least a part of a surface bonded to the transmission line.

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式