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    • 8. 发明授权
    • Method for producing a hermetically sealed casing intended for encapsulating an implantable device, and corresponding casing
    • 用于制造用于封装可植入装置的密封壳体的方法和相应的壳体
    • US09387336B2
    • 2016-07-12
    • US14674489
    • 2015-03-31
    • COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES
    • Simon PerraudNicolas Karst
    • A61N1/375B23K1/00B23K1/18B23K1/19B23K26/28B23K26/32A61N1/36
    • A61N1/375A61N1/3605A61N1/3754B23K1/0008B23K1/18B23K1/19B23K26/28B23K26/32B23K2103/14B23K2103/18B23K2103/52
    • Method for producing a hermetically sealed casing, comprising the following steps: a) supplying a ceramic substrate (20), b) supplying a metal surround (21) and placing it facing the said substrate (20), c) forming a first hermetically sealed joint (22) at the interface between the said substrate (20) and the said metal surround (21), in order to assemble them and form an assembly, d) superposing a cover (23) on the said assembly, e) forming a second hermetically sealed joint (24) between an upper face of the metal surround (21) which is the opposite face to the said interface, and the cover (23), in order to obtain the said casing, characterized in that, during step c), the first hermetically sealed joint (22) is formed on a portion of the said interface and in that prior to step c), the method involves an additional step consisting in placing a ceramic surround (25) on the upper face of the metal surround so as to partially cover the said face of the metal surround, the projected surface of the said ceramic surround in a plane of projection covering the projected surface of the said first joint in this same plane of projection.
    • 一种用于制造密封外壳的方法,包括以下步骤:a)供应陶瓷基板(20),b)供应金属围绕物(21)并将其放置在所述基板(20)的表面上,c)形成第一密封 在所述基板(20)和所述金属环绕(21)之间的界面处的接头(22),以便组装它们并形成组件,d)在所述组件上叠加盖(23),e)形成 第二密封接头(24),位于与所述接口相对的金属环绕(21)的上表面和盖(23)之间,以获得所述壳体,其特征在于,在步骤c ),第一密封接头(22)形成在所述界面的一部分上,并且在步骤c)之前,该方法包括另外的步骤,包括将陶瓷环绕(25)放置在金属的上表面上 围绕以部分地覆盖金属环绕的所述面部, 所述陶瓷的表面围绕着在相同的投影平面中覆盖所述第一接头的突出表面的突起平面。