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    • 1. 发明授权
    • Heat dissipating device
    • 散热装置
    • US08282345B2
    • 2012-10-09
    • US12482890
    • 2009-06-11
    • Chen-Lu FanLi-Ping ChenYi-Lung ChouHung-Chieh Chang
    • Chen-Lu FanLi-Ping ChenYi-Lung ChouHung-Chieh Chang
    • F04D29/66
    • H05K7/20172F16F1/3732G06F1/20
    • A heat dissipating device includes a receiving bracket adapted to be mounted in an electronic device enclosure and a fan module accommodated in the receiving bracket. The fan module includes a fan and a mounting bracket connected to the fan. The fan is secured to the mounting bracket via a plurality of fasteners. Each fastener has a securing head. A plurality of vibration absorbers is disposed between the fan and the fastener. Each vibration absorber includes two isolating walls. One of the isolating walls is sandwiched by the fan and the mounting bracket, and the other isolating wall is sandwiched by the mounting bracket and the fastener securing head, so as to isolate the mounting bracket, the fan, and the fastener.
    • 散热装置包括适于安装在电子设备外壳中的接收支架和容纳在接收支架中的风扇模块。 风扇模块包括风扇和连接到风扇的安装支架。 风扇通过多个紧固件固定到安装支架上。 每个紧固件都有一个固定头。 多个振动吸收器设置在风扇和紧固件之间。 每个振动吸收器包括两个隔离壁。 其中一个隔离壁被风扇和安装支架夹住,另一个隔离壁被安装支架和紧固件固定头夹在中间,以隔离安装支架,风扇和紧固件。
    • 2. 发明申请
    • HEAT DISSIPATING DEVICE
    • 热灭火装置
    • US20100172740A1
    • 2010-07-08
    • US12482890
    • 2009-06-11
    • Chen-Lu FanLi-Ping ChenYi-Lung ChouHung-Chieh Chang
    • Chen-Lu FanLi-Ping ChenYi-Lung ChouHung-Chieh Chang
    • F04D29/66F28F9/00
    • H05K7/20172F16F1/3732G06F1/20
    • A heat dissipating device includes a receiving bracket adapted to be mounted in an electronic device enclosure and a fan module accommodated in the receiving bracket. The fan module includes a fan and a mounting bracket connected to the fan. The fan is secured to the mounting bracket via a plurality of fasteners. Each fastener has a securing head. A plurality of vibration absorbers is disposed between the fan and the fastener. Each vibration absorber includes two isolating walls. One of the isolating walls is sandwiched by the fan and the mounting bracket, and the other isolating wall is sandwiched by the mounting bracket and the fastener securing head, so as to isolate the mounting bracket, the fan, and the fastener.
    • 散热装置包括适于安装在电子设备外壳中的接收支架和容纳在接收支架中的风扇模块。 风扇模块包括风扇和连接到风扇的安装支架。 风扇通过多个紧固件固定到安装支架上。 每个紧固件都有一个固定头。 多个振动吸收器设置在风扇和紧固件之间。 每个振动吸收器包括两个隔离壁。 其中一个隔离壁被风扇和安装支架夹住,另一个隔离壁被安装支架和紧固件固定头夹在中间,以隔离安装支架,风扇和紧固件。
    • 6. 发明授权
    • Computer system with heat sink
    • 带散热器的电脑系统
    • US08120920B2
    • 2012-02-21
    • US12712300
    • 2010-02-25
    • Chen-Lu FanLi-Ping ChenYi-Lung Chou
    • Chen-Lu FanLi-Ping ChenYi-Lung Chou
    • H05K7/20F28F7/00H01L23/34
    • H01L23/4006G06F1/20H01L2924/0002H01L2924/00
    • A computer system includes a chassis, a motherboard secured to the chassis, and a heat sink. A chip is mounted on the motherboard. A securing component secured to the motherboard adjacent the chip. The securing component defines an opening. Two positioning posts are located on the motherboard and adjoin two opposite edges of the opening. Each positioning post defines a fastener hole. A heat sink includes a main body and a fin portion located on the fin portion. The main body defines two through holes. The main body defines two recesses to expose the through holes. The heat sink is secured to the securing component, by two fasteners engaged in the through holes and the fastener holes.
    • 计算机系统包括底盘,固定到底盘的母板和散热器。 芯片安装在主板上。 固定在与芯片相邻的主板上的固定部件。 固定部件限定开口。 两个定位柱位于主板上并与开口的两个相对的边缘相邻。 每个定位柱限定一个紧固件孔。 散热器包括主体和位于翅片部分上的翅片部分。 主体定义了两个通孔。 主体限定了两个露出通孔的凹槽。 散热器通过接合在通孔和紧固件孔中的两个紧固件固定到固定部件上。
    • 7. 发明授权
    • Electronic device with expansion card
    • 带扩展卡的电子设备
    • US08077459B2
    • 2011-12-13
    • US12721406
    • 2010-03-10
    • Ya-Ni ZhangWen-Hu LuYi-Lung ChouLi-Ping Chen
    • Ya-Ni ZhangWen-Hu LuYi-Lung ChouLi-Ping Chen
    • H05K7/20H05K7/00
    • G06F1/20G06F1/186
    • An electronic device includes a chassis. The chassis has a bottom wall and a rear wall, substantially perpendicular to the bottom wall. A motherboard is disposed on the bottom wall, and a riser card is perpendicularly connected to the motherboard. An expansion card is substantially parallel to the motherboard and coupled to the riser card. The expansion card has a first end and a second end, and the first end is secured to the rear wall. An airflow duct is located on the bottom wall of the chassis. A supporting bar protrudes from the airflow duct. A securing member is pivotably mounted to the airflow duct. The securing member includes a pressing plate. The second end of the expansion card is clamped between the pressing plate and the supporting bar of the airflow duct.
    • 电子设备包括底盘。 底盘具有基本垂直于底壁的底壁和后壁。 主板设置在底壁上,并且转接卡垂直连接到主板。 扩展卡基本上平行于母板并且耦合到转接卡。 扩展卡具有第一端和第二端,并且第一端固定到后壁。 气流管道位于底盘的底壁上。 支撑杆从气流导管突出。 固定构件可枢转地安装到气流管道。 固定构件包括压板。 扩展卡的第二端夹在压板和气流管的支撑杆之间。
    • 8. 发明授权
    • Air conducting device
    • 导气装置
    • US08353746B2
    • 2013-01-15
    • US12463476
    • 2009-05-11
    • Ho-Chin TsaiLung-Sheng TsaiYi-Lung ChouLi-Ping Chen
    • Ho-Chin TsaiLung-Sheng TsaiYi-Lung ChouLi-Ping Chen
    • F24F7/00
    • G06F1/185G06F1/20
    • An air conducting device is used for removing heat from at least one component by directing airflow flowing along a first direction. The first direction is parallel to the at least one component. The air conducting device includes an airduct receiving the at least one component therein, and an air guiding member. The air guiding member is attached to an inner side of the airduct. The air guiding member includes a plurality of resilient legs. The legs extend diagonally relative to the first direction in a first state. The legs are able to accommodate the at least one component in a second state. Each leg in the first state is able to serve as a barrier to the airflow.
    • 空气传导装置用于通过引导沿着第一方向流动的气流来从至少一个部件移除热量。 第一方向平行于至少一个部件。 空气传导装置包括容纳其中的至少一个部件的空气传送部件和空气引导部件。 空气引导构件附接到该气体的内侧。 空气引导构件包括多个弹性腿。 腿在第一状态下相对于第一方向对角地延伸。 腿部能够在第二状态下容纳至少一个部件。 处于第一状态的每条腿都能够作为气流的屏障。
    • 10. 发明授权
    • Disk drive assembly with mounting bracket
    • 带安装支架的磁盘驱动器总成
    • US07580252B2
    • 2009-08-25
    • US11838243
    • 2007-08-14
    • Chia-Kang WuChieh YangYi-Lung ChouLi-Ping Chen
    • Chia-Kang WuChieh YangYi-Lung ChouLi-Ping Chen
    • H05K5/00H05K7/00
    • G06F1/187G11B33/124
    • A disk drive assembly is mounting in an enclosure (1). The enclosure has a bar (12). The disk drive includes a disk drive (4), a mounting bracket (2), and a converter card (3). The disk drive has a top surface (41), opposite side surfaces (43) and a back surface (45) perpendicular to the top surface. The disk drive has a first output connector on the back surface. The mounting bracket has a pair of feet (248) attached to the side surfaces of the disk drive and a mounting board (22) attached to the back surface of the disk drive. A resilient arm (5) with a protrusion (53) is formed on the resilient arm for engaging with the bar. The converter card is received in the mounting bracket, the converter card has a circuit board (31) parallel to the top surface of the disk drive.
    • 磁盘驱动器组件安装在外壳(1)中。 外壳有一个杆(12)。 磁盘驱动器包括磁盘驱动器(4),安装支架(2)和转换卡(3)。 磁盘驱动器具有顶表面(41),相对的侧表面(43)和垂直于顶表面的后表面(45)。 磁盘驱动器在后表面具有第一输出连接器。 安装支架具有附接到盘驱动器的侧表面的一对脚(248)和附接到盘驱动器的后表面的安装板(22)。 具有突起(53)的弹性臂(5)形成在弹性臂上以与杆接合。 转换器卡被接收在安装支架中,转换卡具有平行于磁盘驱动器顶表面的电路板(31)。