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1. 发明申请

US20120140512A1 Backlight Module and a Wire Positioning Device Thereof 有权
标题翻译：背光模块及其定位装置
公开(公告)号：US20120140512A1
公开(公告)日：2012-06-07
申请号：US13325345
申请日：2011-12-14
申请人： Chi-Chen Cheng , Chi-Chung Lo
发明人： Chi-Chen Cheng , Chi-Chung Lo
IPC分类号： G09F13/18
CPC分类号： G02B6/0083 , G02F1/133615
摘要： A backlight module and a wire positioning/holding device for the frame structure thereof are disclosed. The backlight module mainly includes a frame and a light source module. The light source module is disposed on the lateral side or on the bottom of the frame. The wire holding device mainly includes a main body and a winding pillar. A first guide slot is disposed on the main body, and the first guide slot has an inlet end and an outlet end. The winding pillar extends from the main body and is situated at one side of the first guide slot. The winding pillar and the main body together form a wire holding portion. The wire holding portion is disposed corresponding to the outlet end of the first guide slot to receive the wires of the light source module coming out of the outlet end.
摘要翻译：公开了一种用于其框架结构的背光模块和线定位/保持装置。背光模块主要包括框架和光源模块。光源模块设置在框架的侧面或底部。电线保持装置主要包括主体和卷绕支柱。第一引导槽设置在主体上，第一引导槽具有入口端和出口端。卷绕柱从主体延伸并位于第一导槽的一侧。绕线柱和主体一起形成电线保持部分。电线保持部分对应于第一引导槽的出口端设置，以接收从出口端出来的光源模块的电线。

2. 发明申请

US20070193773A1 FLEXIBLE PRINTED CIRCUIT BOARD AND ELECTRONIC COMPONENT ASSEMBLY 有权
标题翻译：柔性印刷电路板和电子元器件组件
公开(公告)号：US20070193773A1
公开(公告)日：2007-08-23
申请号：US11425442
申请日：2006-06-21
申请人： Chi-Chen Cheng , Chi-Chung Lo
发明人： Chi-Chen Cheng , Chi-Chung Lo
IPC分类号： H05K1/16
CPC分类号： H05K1/0204 , H05K1/189 , H05K3/281 , H05K3/305 , H05K2201/0209 , H05K2201/0989 , H05K2201/10106 , H05K2201/1025 , H05K2201/10689
摘要： A flexible printed circuit (FPC) and electronic component assembly. The FPC comprises a first protective layer having a first opening, a main layer on the first protective layer, and a second protective layer having a second opening exposing the main layer. The heat produced from the electronic component can be transmitted to the main layer by a heat-conductive medium between the electronic component and the main layer, and can be diffused via the first opening.
摘要翻译：柔性印刷电路（FPC）和电子部件组件。 FPC包括具有第一开口的第一保护层，第一保护层上的主层，以及具有暴露主层的第二开口的第二保护层。由电子部件产生的热量可以通过电子部件和主体层之间的导热介质传输到主层，并且可以经由第一开口扩散。

3. 发明授权

US08393778B2 Backlight module and a wire positioning device thereof 有权
标题翻译：背光模块及其定线装置
公开(公告)号：US08393778B2
公开(公告)日：2013-03-12
申请号：US13325345
申请日：2011-12-14
申请人： Chi-Chen Cheng , Chi-Chung Lo
发明人： Chi-Chen Cheng , Chi-Chung Lo
IPC分类号： F21V7/04
CPC分类号： G02B6/0083 , G02F1/133615
摘要： A backlight module and a wire positioning/holding device for the frame structure thereof are disclosed. The backlight module mainly includes a frame and a light source module. The light source module is disposed on the lateral side or on the bottom of the frame. The wire holding device mainly includes a main body and a winding pillar. A first guide slot is disposed on the main body, and the first guide slot has an inlet end and an outlet end. The winding pillar extends from the main body and is situated at one side of the first guide slot. The winding pillar and the main body together form a wire holding portion. The wire holding portion is disposed corresponding to the outlet end of the first guide slot to receive the wires of the light source module coming out of the outlet end.
摘要翻译：公开了一种用于其框架结构的背光模块和线定位/保持装置。背光模块主要包括框架和光源模块。光源模块设置在框架的侧面或底部。电线保持装置主要包括主体和卷绕支柱。第一引导槽设置在主体上，第一引导槽具有入口端和出口端。卷绕柱从主体延伸并位于第一导槽的一侧。绕线柱和主体一起形成电线保持部分。电线保持部分对应于第一引导槽的出口端设置，以接收从出口端出来的光源模块的电线。

4. 发明申请

US20080198601A1 Backlight Module and a Wire Positioning Device Thereof 有权
标题翻译：背光模块及其定位装置
公开(公告)号：US20080198601A1
公开(公告)日：2008-08-21
申请号：US11943752
申请日：2007-11-21
申请人： Chi-Chen Cheng , Chi-Chung Lo
发明人： Chi-Chen Cheng , Chi-Chung Lo
IPC分类号： F16L3/22 , F21V33/00
CPC分类号： G02B6/0083 , G02F1/133615
摘要： A backlight module and a wire positioning/holding device for the frame structure thereof are disclosed. The backlight module mainly includes a frame and a light source module. The light source module is disposed on the lateral side or on the bottom of the frame. The wire holding device mainly includes a main body and a winding pillar. A first guide slot is disposed on the main body, and the first guide slot has an inlet end and an outlet end. The winding pillar extends from the main body and is situated at one side of the first guide slot. The winding pillar and the main body together form a wire holding portion. The wire holding portion is disposed corresponding to the outlet end of the first guide slot to receive the wires of the light source module coming out of the outlet end. Moreover, the wire holding portion and the outlet end of the first guide slot are situated on opposite sides of the winding pillar.
摘要翻译：公开了一种用于其框架结构的背光模块和线定位/保持装置。背光模块主要包括框架和光源模块。光源模块设置在框架的侧面或底部。电线保持装置主要包括主体和卷绕支柱。第一引导槽设置在主体上，第一引导槽具有入口端和出口端。卷绕柱从主体延伸并位于第一导槽的一侧。绕线柱和主体一起形成电线保持部分。电线保持部分对应于第一引导槽的出口端设置，以接收从出口端出来的光源模块的电线。此外，第一引导槽的线保持部分和出口端位于缠绕柱的相对侧上。

5. 发明授权

US08096697B2 Backlight module and a wire positioning device thereof 有权
标题翻译：背光模块及其定线装置
公开(公告)号：US08096697B2
公开(公告)日：2012-01-17
申请号：US11943752
申请日：2007-11-21
申请人： Chi-Chen Cheng , Chi-Chung Lo
发明人： Chi-Chen Cheng , Chi-Chung Lo
IPC分类号： F21V7/04
CPC分类号： G02B6/0083 , G02F1/133615
摘要： A backlight module and a wire positioning/holding device for the frame structure thereof are disclosed. The backlight module mainly includes a frame and a light source module. The light source module is disposed on the lateral side or on the bottom of the frame. The wire holding device mainly includes a main body and a winding pillar. A first guide slot is disposed on the main body, and the first guide slot has an inlet end and an outlet end. The winding pillar extends from the main body and is situated at one side of the first guide slot. The winding pillar and the main body together form a wire holding portion. The wire holding portion is disposed corresponding to the outlet end of the first guide slot to receive the wires of the light source module coming out of the outlet end. Moreover, the wire holding portion and the outlet end of the first guide slot are situated on opposite sides of the winding pillar.
摘要翻译：公开了一种用于其框架结构的背光模块和线定位/保持装置。背光模块主要包括框架和光源模块。光源模块设置在框架的侧面或底部。电线保持装置主要包括主体和卷绕支柱。第一引导槽设置在主体上，第一引导槽具有入口端和出口端。卷绕柱从主体延伸并位于第一导槽的一侧。绕线柱和主体一起形成电线保持部分。电线保持部分对应于第一引导槽的出口端设置，以接收从出口端出来的光源模块的电线。此外，第一引导槽的线保持部分和出口端位于缠绕柱的相对侧上。

6. 发明授权

US07943855B2 Flexible printed circuit board and electronic component assembly 有权
标题翻译：柔性印刷电路板和电子元器件组装
公开(公告)号：US07943855B2
公开(公告)日：2011-05-17
申请号：US11425442
申请日：2006-06-21
申请人： Chi-Chen Cheng , Chi-Chung Lo
发明人： Chi-Chen Cheng , Chi-Chung Lo
IPC分类号： H05K1/00
CPC分类号： H05K1/0204 , H05K1/189 , H05K3/281 , H05K3/305 , H05K2201/0209 , H05K2201/0989 , H05K2201/10106 , H05K2201/1025 , H05K2201/10689
摘要： A flexible printed circuit (FPC) and electronic component assembly. The FPC comprises a first protective layer having a first opening, a main layer on the first protective layer, and a second protective layer having a second opening exposing the main layer. The heat produced from the electronic component can be transmitted to the main layer by a heat-conductive medium between the electronic component and the main layer, and can be diffused via the first opening.
摘要翻译：柔性印刷电路（FPC）和电子部件组件。 FPC包括具有第一开口的第一保护层，第一保护层上的主层，以及具有暴露主层的第二开口的第二保护层。由电子部件产生的热量可以通过电子部件和主体层之间的导热介质传输到主层，并且可以经由第一开口扩散。

7. 发明授权

US07949808B2 Auto-execution signal processing method and apparatus performing the method 有权
标题翻译：执行该方法的自动执行信号处理方法和装置
公开(公告)号：US07949808B2
公开(公告)日：2011-05-24
申请号：US12493695
申请日：2009-06-29
申请人： Yi-Chen Ho , Chi-Chen Cheng , Min-Chi Ko
发明人： Yi-Chen Ho , Chi-Chen Cheng , Min-Chi Ko
IPC分类号： G06F13/10
CPC分类号： G06F3/0238 , G06F3/0219
摘要： An auto-execution signal processing method and an apparatus performing the method are provided. That method is particularly applied to the apparatus supporting recognition of a human interface device standard. The apparatus preferably has an activation element such as a button, and it is to execute an automatic execution process by a key-activation manually or automatically as in connection with a computer system. Therefore, a predetermined purpose is met. According to a preferred embodiment, the apparatus having the auto-execution function is firstly initialized. Next, the activation element thereon is used to launch the automatic execution process. The process includes a step of driving a Finite State Machine to transfer an executable string of code to a computer system via a connection interface. After that, the executable string is compiled by an operating system in order to launch an application, such as entering a proprietary webpage.
摘要翻译：提供一种自动执行信号处理方法和执行该方法的装置。该方法特别适用于支持人机接口装置标准识别的装置。该装置优选地具有诸如按钮的激活元件，并且通过与计算机系统相关联的手动或自动地执行按键激活来执行自动执行处理。因此，满足预定目的。根据优选实施例，首先初始化具有自动执行功能的装置。接下来，其上的激活元件用于启动自动执行过程。该过程包括驱动有限状态机以通过连接接口将可执行代码字符串传送到计算机系统的步骤。之后，可执行字符串由操作系统编译以启动应用程序，例如输入专有网页。

8. 发明申请

US20090153251A1 VOLTAGE DETECTION TYPE OVERCURRENT PROTECTION DEVICE FOR CLASS-D AMPLIFIER 失效
标题翻译：用于D类放大器的电压检测型过流保护装置
公开(公告)号：US20090153251A1
公开(公告)日：2009-06-18
申请号：US12137701
申请日：2008-06-12
申请人： Chi-Chen Cheng , Chih-Ying Huang
发明人： Chi-Chen Cheng , Chih-Ying Huang
IPC分类号： H03F1/52 , H03F3/217
CPC分类号： H03F1/523 , H03F3/2171 , H03F3/2173
摘要： The present invention discloses a voltage detection type overcurrent protection device, which applies to the output stage of a CMOS Class-D audio amplifier. Generally, a Class-D audio amplifier is used to drive a high-load loudspeaker; therefore, it needs a high-current driver. When there is a short circuit in the load, the high current will burn out the driver stage. The present invention detects the output voltage to indirectly monitor whether the output current is too large. Once an overcurrent is detected, the output-stage transistor is turned off to stop high current lest the circuit be burned out.
摘要翻译：本发明公开了一种适用于CMOS D类音频放大器的输出级的电压检测型过电流保护装置。通常，D类音频放大器用于驱动高负载扬声器; 因此，它需要一个大电流驱动器。当负载短路时，高电流将烧坏驱动级。本发明检测输出电压以间接监视输出电流是否过大。一旦检测到过电流，则输出级晶体管被截止以停止高电流，以免电路烧坏。

9. 发明申请

US20060292352A1 Optical film assembly and manufacturing method and manufacturing apparatus for producing the same 审中-公开
标题翻译：光学膜组装及其制造方法和制造方法
公开(公告)号：US20060292352A1
公开(公告)日：2006-12-28
申请号：US11473264
申请日：2006-06-23
申请人： Chi-Chen Cheng
发明人： Chi-Chen Cheng
IPC分类号： B32B23/02
CPC分类号： G02B5/045 , B29D11/0073 , G02B5/02 , G02B5/0278 , G02F1/133606 , Y10T428/24777 , Y10T428/24826
摘要： An optical film assembly comprises a plurality of optical films and a merging region. The optical films can be chosen arbitrarily and are superposed layer by layer. The merging region is formed by hot pressingand merging the optical films together so as to integrate them into an optical film assembly which is advantageous to the fabrication process of the backlight module. Also, a method and an apparatus for manufacturing the optical film assembly are also provided to produce the optical film assembly.
摘要翻译：光学膜组件包括多个光学膜和合并区域。光学膜可以任意选择并逐层叠加。通过热压并将光学膜合并在一起形成合并区域，以便将它们集成到有利于背光模块的制造工艺的光学膜组件中。而且，还提供了用于制造光学膜组件的方法和装置以制造光学膜组件。

10. 发明申请

US20070229753A1 Heat dissipation structure of backlight module 有权
标题翻译：背光模组的散热结构
公开(公告)号：US20070229753A1
公开(公告)日：2007-10-04
申请号：US11476484
申请日：2006-06-28
申请人： Chi-Chen Cheng , Ya-Ting Ho , Meng-Chai Wu
发明人： Chi-Chen Cheng , Ya-Ting Ho , Meng-Chai Wu
IPC分类号： G02F1/1333
CPC分类号： G02B6/0085 , F21K9/00 , F21V29/70 , F21V29/83 , G02B6/0073 , H05K1/0206 , H05K3/0061 , H05K3/386 , H05K2201/0209 , H05K2201/10106
摘要： The heat dissipation structure of the backlight module of the present invention comprises a circuit board, a heat-conductive element (such as thermally conductive glue) and a light-emitting diode (LED) chip, wherein the circuit board has an electric circuit layer and a heat conductive layer respectively formed on two opposite surfaces thereof. The circuit board has a plurality of through holes penetrating through the electric circuit layer and the heat-conductive layer of the circuit board, wherein each of the through holes is filled with heat-conductive material. The heat-conductive element is placed on the circuit layer and covers the through holes, and the LED chip is disposed on the heat-conductive element and is electrically connected to the electric circuit layer.
摘要翻译：本发明的背光模块的散热结构包括电路板，导热性胶（例如导热胶）和发光二极管（LED）芯片，其中电路板具有电路层和分别形成在其两个相对表面上的导热层。电路板具有穿过电路层和电路板的导热层的多个通孔，其中每个通孔填充有导热材料。导热元件放置在电路层上并覆盖通孔，LED芯片设置在导热元件上并与电路层电连接。

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