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1. 发明授权

US07986530B2 Fixing structure for battery 失效
标题翻译：电池固定结构
公开(公告)号：US07986530B2
公开(公告)日：2011-07-26
申请号：US12603618
申请日：2009-10-22
申请人： Ching-Hui Chang , Ching-Feng Hsieh , Ko-Hsien Lee
发明人： Ching-Hui Chang , Ching-Feng Hsieh , Ko-Hsien Lee
IPC分类号： H05K7/00
CPC分类号： H01M2/1066 , H04M1/0262 , H04M1/18
摘要： A fixing structure for a battery positions the battery in a casing of an electronic device. The fixing structure includes at least a connecting portion, at least a locking portion, and a receiving portion. The connecting portion is on one side of the battery and with a waterproof element. The locking portion is on the other side of the battery and is opposite to the connecting portion. The receiving portion is on the casing and with a first inserting portion and a plurality of second inserting portions. The first inserting portion and the second inserting portions correspond in position to the connecting portion and the locking portion respectively. Hence, the fixing structure protects the electronic device against permeation of water and ensures secure positioning of the battery.
摘要翻译：电池的固定结构将电池定位在电子设备的外壳中。固定结构至少包括连接部分，至少锁定部分和接收部分。连接部分位于电池的一侧并具有防水元件。锁定部位于电池的另一侧，与连接部相对。接收部分在壳体上并且具有第一插入部分和多个第二插入部分。第一插入部分和第二插入部分分别对应于连接部分和锁定部分的位置。因此，固定结构保护电子装置免受水的渗透并确保电池的牢固定位。

2. 发明授权

US08274002B2 Modular keyboard and manufacturing method thereof 失效
标题翻译：模块化键盘及其制造方法
公开(公告)号：US08274002B2
公开(公告)日：2012-09-25
申请号：US12579522
申请日：2009-10-15
申请人： Ching-Hui Chang , Ching-Feng Hsieh , Ko-Hsien Lee
发明人： Ching-Hui Chang , Ching-Feng Hsieh , Ko-Hsien Lee
IPC分类号： H01H13/70
CPC分类号： H01H13/86 , G06F3/0202 , G06F3/0219 , H01H2223/002 , H01H2229/036 , Y10T29/49105
摘要： A modular keyboard includes an upper casing, a lower casing corresponding to the upper casing, an electric conduction element and a circuit board. The upper casing includes a first side and a second side opposite to each other, and a plurality of press keys disposed on the first side. The lower casing is set for sealing the second side, and an enclosure space is formed between the upper casing and the lower casing. The electric conduction element is installed on the second side in the enclosure space, and the circuit board is installed between the electric conduction element and the lower casing. With a supersonic welding technique, the upper casing and the lower casing are engaged with each other to seal the enclosure space and isolate the electric conduction element in the enclosure space and the circuit board from the exterior.
摘要翻译：模块化键盘包括上壳体，对应于上壳体的下壳体，导电元件和电路板。上壳体包括彼此相对的第一侧和第二侧，以及设置在第一侧上的多个按键。下壳体设置为密封第二侧，并且在上壳体和下壳体之间形成封闭空间。导电元件安装在封闭空间的第二侧，电路板安装在导电元件和下壳体之间。通过超音速焊接技术，上壳体和下壳体彼此接合以密封外壳空间，并将外壳空间中的导电元件和电路板与外部隔离。

3. 发明申请

US20100245721A1 LIQUID CRYSTAL ANTI-FREEZE METHOD AND LIQUID CRYSTAL MODULE USING THE SAME 审中-公开
标题翻译：液晶防冻方法和液晶模块
公开(公告)号：US20100245721A1
公开(公告)日：2010-09-30
申请号：US12564106
申请日：2009-09-22
申请人： Ching-Hui Chang , Ching-Feng Hsieh , Ko-Hsien Lee
发明人： Ching-Hui Chang , Ching-Feng Hsieh , Ko-Hsien Lee
IPC分类号： G02F1/133 , G02F1/1333
CPC分类号： G02F1/133382 , G02F2001/133334 , G09G3/36 , G09G2320/041
摘要： A liquid crystal module comprises at least a liquid crystal panel with a display side and a liquid crystal side corresponding to each other, wherein at least one portion of the liquid crystal side is a heating portion, such that the heating portion can be driven to heat the liquid crystal side when the temperature of the environmental is under a liquid crystal working temperature. In addition, a liquid crystal anti-freeze method for the liquid crystal module is disclosed.
摘要翻译：液晶模块至少包括具有显示侧和相互对应的液晶侧的液晶面板，其中液晶侧的至少一部分为加热部，使得加热部能够被驱动加热当环境温度处于液晶工作温度时液晶面。此外，公开了一种液晶模块的液晶防冻方法。

4. 发明授权

US08325476B2 Electronic device carrier 失效
标题翻译：电子设备载体
公开(公告)号：US08325476B2
公开(公告)日：2012-12-04
申请号：US12703214
申请日：2010-02-10
申请人： Chih-Hua Huang , Ching-Hui Chang , Ko-Hsien Lee , Ching-Feng Hsieh
发明人： Chih-Hua Huang , Ching-Hui Chang , Ko-Hsien Lee , Ching-Feng Hsieh
IPC分类号： G06F1/16
CPC分类号： H04M1/04 , G06F1/1626 , G06F1/1632
摘要： An electronic device carrier comprising a base and rolling devices. When an electronic device is removed from a receiving chamber of the base, the rolling devices can reduce friction effectively and resilient force of the rolling device can fix the electronic device in the receiving chamber. The electronic device carrier further includes a transmission unit for transmitting data whenever the electronic device is positioned in the receiving chamber.
摘要翻译：一种包括基座和滚动装置的电子装置载体。当电子设备从基座的接收室移除时，滚动装置可以有效地降低摩擦力，并且滚动装置的弹性力可将电子装置固定在接收室中。电子设备载体还包括传输单元，用于每当电子设备定位在接收室中时传送数据。

5. 发明申请

US20110075381A1 FIXING STRUCTURE FOR BATTERY 失效
标题翻译：电池固定结构
公开(公告)号：US20110075381A1
公开(公告)日：2011-03-31
申请号：US12603618
申请日：2009-10-22
申请人： Ching-Hui Chang , Ching-Feng Hsieh , Ko-Hsien Lee
发明人： Ching-Hui Chang , Ching-Feng Hsieh , Ko-Hsien Lee
IPC分类号： H05K7/00
CPC分类号： H01M2/1066 , H04M1/0262 , H04M1/18
摘要： A fixing structure for a battery positions the battery in a casing of an electronic device. The fixing structure includes at least a connecting portion, at least a locking portion, and a receiving portion. The connecting portion is on one side of the battery and with a waterproof element. The locking portion is on the other side of the battery and is opposite to the connecting portion. The receiving portion is on the casing and with a first inserting portion and a plurality of second inserting portions. The first inserting portion and the second inserting portions correspond in position to the connecting portion and the locking portion respectively. Hence, the fixing structure protects the electronic device against permeation of water and ensures secure positioning of the battery.
摘要翻译：电池的固定结构将电池定位在电子设备的外壳中。固定结构至少包括连接部分，至少锁定部分和接收部分。连接部分位于电池的一侧并具有防水元件。锁定部位于电池的另一侧，与连接部相对。接收部分在壳体上并且具有第一插入部分和多个第二插入部分。第一插入部分和第二插入部分分别对应于连接部分和锁定部分的位置。因此，固定结构保护电子装置免受水的渗透并确保电池的牢固定位。

6. 发明申请

US20100258417A1 MODULAR KEYBOARD AND MANUFACTURING METHOD THEREOF 失效
标题翻译：模块化键盘及其制造方法
公开(公告)号：US20100258417A1
公开(公告)日：2010-10-14
申请号：US12579522
申请日：2009-10-15
申请人： Ching-Hui Chang , Ching-Feng Hsieh , Ko-Hsien Lee
发明人： Ching-Hui Chang , Ching-Feng Hsieh , Ko-Hsien Lee
IPC分类号： H01H9/04 , B29C65/06
CPC分类号： H01H13/86 , G06F3/0202 , G06F3/0219 , H01H2223/002 , H01H2229/036 , Y10T29/49105
摘要： A modular keyboard includes an upper casing, a lower casing corresponding to the upper casing, an electric conduction element and a circuit board. The upper casing includes a first side and a second side opposite to each other, and a plurality of press keys disposed on the first side. The lower casing is set for sealing the second side, and an enclosure space is formed between the upper casing and the lower casing. The electric conduction element is installed on the second side in the enclosure space, and the circuit board is installed between the electric conduction element and the lower casing. With a supersonic welding technique, the upper casing and the lower casing are engaged with each other to seal the enclosure space and isolate the electric conduction element in the enclosure space and the circuit board from the exterior.
摘要翻译：模块化键盘包括上壳体，对应于上壳体的下壳体，导电元件和电路板。上壳体包括彼此相对的第一侧和第二侧，以及设置在第一侧上的多个按键。下壳体设置为密封第二侧，并且在上壳体和下壳体之间形成封闭空间。导电元件安装在封闭空间的第二侧，电路板安装在导电元件和下壳体之间。通过超音速焊接技术，上壳体和下壳体彼此接合以密封外壳空间，并将外壳空间中的导电元件和电路板与外部隔离。

7. 发明授权

US5873263A Equipment and process for fluid purification and recovery 失效
标题翻译：流体净化和回收的设备和工艺
公开(公告)号：US5873263A
公开(公告)日：1999-02-23
申请号：US840849
申请日：1997-04-17
申请人： Ching-Hui Chang
发明人： Ching-Hui Chang
IPC分类号： F25J3/00 , F25J3/06 , F25J1/00
CPC分类号： F25J3/06 , F25J2205/84
摘要： Equipment and process for fluid purification and recovery for separating at least two matters contained in a gas or fluid including cooling a fluid to a low temperature range by use of a cooling system so that the matters in the fluid exhibit at least two phases, and filtering at least one of the matters using a filter device. The fluid may be distilled using a heating system prior to its entrance into the cooling system so as to help separate and purify the matters.
摘要翻译：用于分离包含在气体或流体中的至少两种物质的流体净化和回收的设备和方法，包括通过使用冷却系统将流体冷却至低温范围，使得流体中的物质呈现至少两相，并且过滤使用过滤装置的至少一个事项。流体可以在进入冷却系统之前使用加热系统进行蒸馏，以帮助分离和净化物质。

8. 发明授权

US07122893B2 Semiconductor package structure 有权
标题翻译：半导体封装结构
公开(公告)号：US07122893B2
公开(公告)日：2006-10-17
申请号：US10920077
申请日：2004-08-17
申请人： Gwo-Liang Weng , Ching-Hui Chang , Yung-Li Lu , Yu-Wen Chen
发明人： Gwo-Liang Weng , Ching-Hui Chang , Yung-Li Lu , Yu-Wen Chen
IPC分类号： H01L23/04
CPC分类号： H01L24/32 , H01L21/563 , H01L29/0657 , H01L2224/16225 , H01L2224/26145 , H01L2224/27013 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2224/83051 , H01L2224/83365 , H01L2224/83385 , H01L2924/01033 , H01L2924/15311 , H01L2924/00012 , H01L2924/10155
摘要： A semiconductor package structure includes a semiconductor component, a substrate, solder bumps, underfill, a buffer means, and solder balls. The substrate is under the semiconductor component. A joint area is formed between the first surface of the semiconductor and the upper surface of the substrate. Several solder bumps are disposed in the joint area, for electrically connecting the semiconductor component and the substrate. The underfill is filled in the joint area, for coating the solder bumps and tightly jointing the semiconductor component and the substrate. The buffer means is situated in the jointing area, for buffering the underfill to be confined in the joint area. Several solder balls are disposed on the lower surface of the substrate.
摘要翻译：半导体封装结构包括半导体部件，衬底，焊料凸块，底部填充物，缓冲装置和焊球。衬底在半导体部件下。在半导体的第一表面和基板的上表面之间形成接合区域。在接合区域设置有几个焊料凸块，用于电连接半导体部件和基板。底部填充物填充在接合区域中，用于涂覆焊料凸块并紧密接合半导体部件和基板。缓冲装置位于接合区域中，用于缓冲封闭在接合区域中的底部填充物。几个焊球设置在基板的下表面上。

9. 发明申请

US20050051885A1 Semiconductor package structure 有权
标题翻译：半导体封装结构
公开(公告)号：US20050051885A1
公开(公告)日：2005-03-10
申请号：US10920077
申请日：2004-08-17
申请人： Gwo-Liang Weng , Ching-Hui Chang , Yung-Li Lu , Yu-Wen Chen
发明人： Gwo-Liang Weng , Ching-Hui Chang , Yung-Li Lu , Yu-Wen Chen
IPC分类号： H01L21/56 , H01L29/06 , H01L23/22
CPC分类号： H01L24/32 , H01L21/563 , H01L29/0657 , H01L2224/16225 , H01L2224/26145 , H01L2224/27013 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2224/83051 , H01L2224/83365 , H01L2224/83385 , H01L2924/01033 , H01L2924/15311 , H01L2924/00012 , H01L2924/10155
摘要： A semiconductor package structure includes a semiconductor component, a substrate, solder bumps, underfill, a buffer means, and solder balls. The substrate is under the semiconductor component. A joint area is formed between the first surface of the semiconductor and the upper surface of the substrate. Several solder bumps are disposed in the joint area, for electrically connecting the semiconductor component and the substrate. The underfill is filled in the joint area, for coating the solder bumps and tightly jointing the semiconductor component and the substrate. The buffer means is situated in the jointing area, for buffering the underfill to be confined in the joint area. Several solder balls are disposed on the lower surface of the substrate.
摘要翻译：半导体封装结构包括半导体部件，衬底，焊料凸块，底部填充物，缓冲装置和焊球。衬底在半导体部件下。在半导体的第一表面和基板的上表面之间形成接合区域。在接合区域设置有几个焊料凸块，用于电连接半导体部件和基板。底部填充物填充在接合区域中，用于涂覆焊料凸块并紧密接合半导体部件和基板。缓冲装置位于接合区域中，用于缓冲封闭在接合区域中的底部填充物。几个焊球设置在基板的下表面上。

10. 发明授权

US08673324B2 Method for producing gamma-aminobutyric acid and food produced thereby 有权
标题翻译：生产γ-氨基丁酸的方法及由此生产的食品
公开(公告)号：US08673324B2
公开(公告)日：2014-03-18
申请号：US13353516
申请日：2012-01-19
申请人： Ching-Hui Chang , Tsai-Mei Wu
发明人： Ching-Hui Chang , Tsai-Mei Wu
IPC分类号： A61K9/00 , A01N65/00 , A01N63/02 , A61K35/00 , A61K8/66 , A61K8/96 , A61Q11/00
CPC分类号： A61K31/197 , A23L33/105 , A23V2002/00 , C12N1/18 , C12N1/38 , C12P13/005 , A23V2200/322 , A23V2200/326 , A23V2250/038
摘要： The embodiment of invention provides a method for producing γ-aminobutyric acid, including the steps of providing a medium including Saccharomyces cerevisiae, adding an extract of Rhinacanthus nasutus into the medium and fermentating Saccharomyces cerevisiae in the medium added with the extract of Rhinacanthus nasutus to produce γ-aminobutyric acid.
摘要翻译：本发明的实施方式提供了γ-氨基丁酸的制造方法，其特征在于，包括提供包含酿酒酵母的培养基的步骤，向所述培养基中加入犀牛提取物，并在加入犀牛提取物的培养基中发酵酿酒酵母 γ-氨基丁酸。

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