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    • 4. 发明授权
    • Architecture and method of a cellular phone embedded system
    • 手机嵌入式系统的架构与方法
    • US07562354B2
    • 2009-07-14
    • US11179005
    • 2005-06-27
    • Chung-Chuan WangChun-Ta Huang
    • Chung-Chuan WangChun-Ta Huang
    • G06F9/44G06F9/45G06F15/16
    • G06F13/4243G06F9/44521H04M1/72525
    • A new architecture and method of a cellular phone embedded system consists of an application system interface sector and an execution system interface sector. The application system interface sector includes an application program executed on a cellular phone platform system, and a conversion to a PIFF format is performed by a program compiling software and an MVM application program code. The converted PIFF format is downloaded to the execution system interface sector, so as to enable an internal OS management system to be an open system program sector. The execution system interface sector contains an MVM subsystem, and the converted PIFF format is linked to an MVM system program code (ORGAN.lib) by an MVM internal system program operating platform and the application system interface sector. Moreover, an active fast dynamic address linking and static address linking is used to constitute a new architecture of system platform.
    • 蜂窝电话嵌入式系统的新架构和方法由应用系统接口部分和执行系统接口部分组成。 应用系统接口扇区包括在蜂窝电话平台系统上执行的应用程序,并且通过程序编译软件和MVM应用程序代码执行到PIFF格式的转换。 转换的PIFF格式被下载到执行系统接口部分,以便使内部OS管理系统成为开放的系统程序扇区。 执行系统接口扇区包含一个MVM子系统,转换的PIFF格式由MVM内部系统程序操作平台和应用系统接口部分链接到MVM系统程序代码(ORGAN.lib)。 此外,主动快速动态地址链接和静态地址链接用于构成系统平台的新架构。
    • 5. 发明申请
    • Virtual memory device including a bridge circuit
    • 包括桥接电路的虚拟存储器件
    • US20060015678A1
    • 2006-01-19
    • US11179006
    • 2005-06-27
    • Chung-Chuan WangChun-Ta Huang
    • Chung-Chuan WangChun-Ta Huang
    • G06F12/00
    • G06F13/4243G06F9/44521H04M1/72525
    • A virtual memory device includes a bridge circuit wherein in an integrated SOC device, a bridge circuit with less than 10% die size and a non-volatile XIP random access memory is used to connect to a high efficiency memory bridge circuit, so as to facilitate an improvement of boot-up speed and MMI initialization of a portable mobile device, and performance of network searching and network protocol of a wireless station, as well as a reduction of cost of the entire memory, upon applying inside the portable wireless mobile device. The invention includes an integrated SOC application system interface, incorporating a NAND flash memory, an XIP non-volatile random access memory, a programmable MIF bridge, and a volatile XIP random access memory, is used to perform a virtual memory without an MCU system control interface being a new architecture of MCU system control interface, by means of software simulation.
    • 虚拟存储器件包括桥接电路,其中在集成的SOC器件中,使用具有小于10%管芯尺寸的桥式电路和非易失性XIP随机存取存储器来连接到高效率存储器桥式电路,以便于 便携式移动设备的启动速度和MMI初始化的提高以及无线站的网络搜索和网络协议的性能以及整个存储器的成本的降低。 本发明包括集成了NAND​​闪存,XIP非易失性随机存取存储器,可编程MIF桥和易失性XIP随机存取存储器的集成SOC应用系统接口,用于在没有MCU系统控制的情况下执行虚拟存储器 接口是通过软件仿真的MCU系统控制接口的新架构。
    • 7. 发明授权
    • Method for manufacturing printed circuit boards using legend printing stencil
    • 使用传说印刷模板制造印刷电路板的方法
    • US07854197B2
    • 2010-12-21
    • US11940910
    • 2007-11-15
    • Tso-Hung YehHsiao-Chun HuangChun-Ta HuangMeng-Hung Wu
    • Tso-Hung YehHsiao-Chun HuangChun-Ta HuangMeng-Hung Wu
    • B41M1/12
    • H05K1/0266B05C17/06H05K3/0052H05K3/1225H05K2201/09936H05K2203/0557Y10T29/49155
    • An exemplary legend printing stencil for printing a circuit substrate for manufacturing a number of printed circuit board is provided. The stencil includes at least a first printing portion, at least a second printing portion and a junction portion between the first printing portion and the second printing portion. The first printing portion and the second printing portion each define a number of legend holes therein. The first printing portion and the second portion are configured for attaching on and covering the corresponding circuit board unit of the circuit substrate to print legends on the circuit board unit. The junction portion defines a slot therein and is configured for attaching on and covering the corresponding connection portion of the circuit substrate to print a legend ink layer on the connection portion. A method for manufacturing a number of printed circuit boards using the stencil is also provided.
    • 提供了用于印刷用于制造多个印刷电路板的电路基板的示例性图案印刷模版。 模板包括至少第一印刷部分,至少第二印刷部分和第一印刷部分和第二印刷部分之间的连接部分。 第一印刷部分和第二印刷部分各自在其中限定多个图例孔。 第一印刷部分和第二部分被配置为附接在电路基板的相应的电路板单元上并覆盖其上,以在电路板单元上打印图例。 接合部分在其中限定槽,并且被配置用于附接在电路基板的对应连接部分上并覆盖其上,以在连接部分上印刷图例油墨层。 还提供了使用该模板制造多个印刷电路板的方法。