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    • 7. 发明授权
    • Camera module and method for the production thereof
    • 相机模块及其制作方法
    • US09485400B2
    • 2016-11-01
    • US14769941
    • 2014-02-11
    • Conti Temic Microelectronic GmbH
    • Gerhard MüllerDieter Krökel
    • H04N3/14H04N5/335H04N5/225
    • H04N5/2257H01L2924/0002H04N5/2253H04N5/2254H01L2924/00
    • A camera module including an objective lens housing with an optical system, an image sensor chip with wire bonding connections, and a printed circuit board for contacting the image sensor chip. The printed circuit board is designed with wire bonding areas to which the wire bonding connections of the image sensor chip are connected, and the assembly made up of the image sensor chip and the printed circuit board is designed in such a manner that the image sensor chip is focus-adjusted to the optical system by changing its position relative to the printed circuit board taking advantage of the flexibility of the wire bonding connections of the image sensor chip. The invention further relates to a method of manufacturing the camera module.
    • 包括具有光学系统的物镜壳体,具有引线接合连接的图像传感器芯片以及用于接触图像传感器芯片的印刷电路板的相机模块。 印刷电路板设计有连接图像传感器芯片的引线接合连接的引线接合区域,并且由图像传感器芯片和印刷电路板组成的组件被设计成使得图像传感器芯片 通过利用图像传感器芯片的引线键合连接的灵活性,通过改变其相对于印刷电路板的位置来对光学系统进行焦点调整。 本发明还涉及制造相机模块的方法。
    • 8. 发明申请
    • CAMERA MODULE AND METHOD FOR THE PRODUCTION THEREOF
    • 相机模块及其制作方法
    • US20160014313A1
    • 2016-01-14
    • US14769941
    • 2014-02-11
    • CONTI TEMIC MICROELECTRONIC GMBH
    • Gerhard MüllerDieter Krökel
    • H04N5/225
    • H04N5/2257H01L2924/0002H04N5/2253H04N5/2254H01L2924/00
    • A camera module including an objective lens housing with an optical system, an image sensor chip with wire bonding connections, and a printed circuit board for contacting the image sensor chip. The printed circuit board is designed with wire bonding areas to which the wire bonding connections of the image sensor chip are connected, and the assembly made up of the image sensor chip and the printed circuit board is designed in such a manner that the image sensor chip is focus-adjusted to the optical system by changing its position relative to the printed circuit board taking advantage of the flexibility of the wire bonding connections of the image sensor chip. The invention further relates to a method of manufacturing the camera module.
    • 包括具有光学系统的物镜壳体,具有引线接合连接的图像传感器芯片以及用于接触图像传感器芯片的印刷电路板的相机模块。 印刷电路板设计有连接图像传感器芯片的引线接合连接的引线接合区域,并且由图像传感器芯片和印刷电路板组成的组件被设计成使得图像传感器芯片 通过利用图像传感器芯片的引线键合连接的灵活性,通过改变其相对于印刷电路板的位置来对光学系统进行焦点调整。 本发明还涉及制造相机模块的方法。