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1. 发明申请

US20160148856A1 ELECTRONIC DEVICE HAVING HEAT CONDUCTING MEMBER 有权
标题翻译：具有导热构件的电子设备
公开(公告)号：US20160148856A1
公开(公告)日：2016-05-26
申请号：US14947924
申请日：2015-11-20
申请人： DENSO CORPORATION
发明人： Seiji Morino
IPC分类号： H01L23/367 , H01L23/04 , H01L23/498
CPC分类号： H01L23/3672 , H01L23/04 , H01L23/3107 , H01L23/367 , H01L23/49844 , H01L24/40 , H01L2224/40095 , H01L2224/40245 , H01L2224/83801 , H01L2924/181 , H01L2924/00012 , H01L2924/00014
摘要： An electronic device includes a semiconductor module, a wiring substrate, a case member and a heat conducting member. The heat conducting member thermally connects predetermined portions of wiring patterns and a heat conducting pattern of the wiring substrate to a predetermined heat conduction region of a surface of the case member opposing to the wiring substrate. The predetermined heat conduction region is located further from the wiring substrate than a surface of a body portion opposing to the case member. The heat conducting pattern is disposed adjacent to at least one of non-terminal projecting surfaces of the body portion on a surface of the wiring substrate. The heat conducting pattern has a surface that is not covered with solder resist at least at a part. As a result, an area of a heat conducting passage increases and heat radiation performance can be increased.
摘要翻译：电子设备包括半导体模块，布线基板，壳体构件和导热构件。导热构件将布线图案的预定部分和布线基板的导热图案热连接到与布线基板相对的壳体部件的表面的预定导热区域。预定的导热区域比布线基板更靠近与壳体部件相对的主体部分的表面。导热图案被布置成与布线基板的表面上的主体部分的非端子突出表面中的至少一个相邻。导热图案至少在一部分具有未被阻焊剂覆盖的表面。结果，导热通道的面积增加，并且可以提高散热性能。

2. 发明授权

US09425123B2 Electronic device having heat conducting member 有权
标题翻译：具有导热构件的电子装置
公开(公告)号：US09425123B2
公开(公告)日：2016-08-23
申请号：US14947924
申请日：2015-11-20
申请人： DENSO CORPORATION
发明人： Seiji Morino
IPC分类号： H01L23/367 , H01L23/498 , H01L23/04
CPC分类号： H01L23/3672 , H01L23/04 , H01L23/3107 , H01L23/367 , H01L23/49844 , H01L24/40 , H01L2224/40095 , H01L2224/40245 , H01L2224/83801 , H01L2924/181 , H01L2924/00012 , H01L2924/00014
摘要： An electronic device includes a semiconductor module, a wiring substrate, a case member and a heat conducting member. The heat conducting member thermally connects predetermined portions of wiring patterns and a heat conducting pattern of the wiring substrate to a predetermined heat conduction region of a surface of the case member opposing to the wiring substrate. The predetermined heat conduction region is located further from the wiring substrate than a surface of a body portion opposing to the case member. The heat conducting pattern is disposed adjacent to at least one of non-terminal projecting surfaces of the body portion on a surface of the wiring substrate. The heat conducting pattern has a surface that is not covered with solder resist at least at a part. As a result, an area of a heat conducting passage increases and heat radiation performance can be increased.
摘要翻译：电子设备包括半导体模块，布线基板，壳体构件和导热构件。导热构件将布线图案的预定部分和布线基板的导热图案热连接到与布线基板相对的壳体部件的表面的预定导热区域。预定的导热区域比布线基板更靠近与壳体部件相对的主体部分的表面。导热图案被布置成与布线基板的表面上的主体部分的非端子突出表面中的至少一个相邻。导热图案至少在一部分具有未被阻焊剂覆盖的表面。结果，导热通道的面积增加，并且可以提高散热性能。

3. 发明授权

US09581634B2 Power supply current monitoring device 有权
标题翻译：电源电流监控装置
公开(公告)号：US09581634B2
公开(公告)日：2017-02-28
申请号：US14515873
申请日：2014-10-16
申请人： DENSO CORPORATION
发明人： Seiji Morino
IPC分类号： G06F11/30 , G07C5/00 , G01M17/00 , G06F7/00 , G06F19/00 , G01R31/02 , G01R19/00 , G01R19/165 , G01R31/00 , G01R31/42 , G01R31/34
CPC分类号： G01R31/025 , G01R19/0092 , G01R19/16538 , G01R31/006 , G01R31/343 , G01R31/42
摘要： A power supply current monitoring apparatus is used for a load drive apparatus with two systems to drive a load. Each system includes a drive circuit connected in parallel with a battery and a relay connected between the drive circuit and a point at which power of the battery is divided between the systems. When overcurrent is detected once in one system, a repetitive monitoring process is performed. The monitoring process determines whether the overcurrent occurs by repeating a monitoring cycle. The monitoring cycle turns OFF the relay of one system and then monitors currents by turning ON the relay of one system when a predetermined cycle time elapses since the overcurrent detection. The monitoring process includes a mask procedure to stop monitoring the current in the other system. The mask procedure is performed after the relay of one system is turned OFF in each monitoring cycle.
摘要翻译：电源电流监视装置用于具有驱动负载的两个系统的负载驱动装置。每个系统包括与电池并联连接的驱动电路和连接在驱动电路与电池的电源在系统之间分配的点之间的继电器。当在一个系统中检测到一次过电流时，执行重复监视处理。监视过程通过重复监视周期来确定是否发生过电流。监控周期关闭一个系统的继电器，然后在从过电流检测起经过预定的周期时间后，通过接通一个系统的继电器来监控电流。监视过程包括一个屏蔽程序来停止监视另一个系统中的电流。在每个监控周期中关闭一个系统的继电器之后执行屏蔽程序。

4. 发明授权

US09431318B2 Electronic device 有权
标题翻译：电子设备
公开(公告)号：US09431318B2
公开(公告)日：2016-08-30
申请号：US14306536
申请日：2014-06-17
申请人： DENSO CORPORATION
发明人： Seiji Morino
IPC分类号： H05K7/20 , H01L23/367 , H01L23/42 , H01L23/498 , H01L23/00 , H01L23/40 , H01L23/495
CPC分类号： H01L23/3675 , H01L23/4006 , H01L23/42 , H01L23/49562 , H01L23/49844 , H01L23/49861 , H01L24/29 , H01L24/32 , H01L24/33 , H01L2023/4062 , H01L2224/291 , H01L2224/32245 , H01L2224/33181 , H01L2924/13055 , H01L2924/13091 , H05K7/209 , H01L2924/014 , H01L2924/00
摘要： In an electronic device, a one-side heat radiation element and a two-side heat radiation element are disposed on a surface of a substrate adjacent to a heat sink. The one-side heat radiation element has a rear-side covered conductive portion and a rear-surface molded portion on the rear-side covered conductive portion adjacent to the heat sink, and radiates heat to the substrate. A surface of a rear-side exposed conductive portion of the two-side heat radiation element adjacent to the heat sink is exposed and the two-side heat radiation element radiates heat to the substrate and the heat sink. The rear-surface molded portion controls a limit position of the one-side heat radiation element toward the heat sink due to deformation of the substrate. A heat radiation gel is filled in between the rear-side exposed conductive portion and the heat sink to radiate heat from the two-side heat radiation element toward the heat sink.
摘要翻译：在电子设备中，单面散热元件和双面散热元件设置在与散热器相邻的基板的表面上。单侧散热元件具有背面覆盖的导电部分和与散热器相邻的后侧被覆导电部分的后表面模制部分，并将热量辐射到基板。暴露出与散热器相邻的两侧放热元件的背面暴露的导电部分的表面，并且两侧散热元件将热量散发到衬底和散热片。后表面模制部分由于基板的变形而控制单侧散热元件朝向散热器的极限位置。在背面暴露的导电部分和散热器之间填充有热辐射凝胶，以将热量从两侧散热元件辐射到散热器。

5. 发明申请

US20160141221A1 ELECTRONIC DEVICE HAVING HEAT CONDUCTING MEMBER 有权
标题翻译：具有导热构件的电子设备
公开(公告)号：US20160141221A1
公开(公告)日：2016-05-19
申请号：US14945095
申请日：2015-11-18
申请人： DENSO CORPORATION
发明人： Seiji Morino
IPC分类号： H01L23/36 , H01L23/053 , H01L23/498
CPC分类号： H01L23/36 , H01L23/053 , H01L23/3107 , H01L23/492 , H01L23/49844 , H01L24/40 , H01L2224/40095 , H01L2224/40245 , H01L2224/48247 , H01L2224/83801 , H01L2924/181 , H01L2924/00012 , H01L2924/00014
摘要： An electronic device includes a semiconductor module, a wiring substrate, a case member and a heat conducting member. The heat conducting member thermally connects predetermined portions of wiring patterns and a heat conducting pattern of the wiring substrate to a predetermined heat conduction region of a surface of the case member opposing to the wiring substrate. The predetermined heat conduction region is located further from the wiring substrate than a surface of a body portion opposing to the case member. As a result, heat can be radiated and a short can be restricted with the case member having a simple shape. The heat conducting pattern is disposed adjacent to at least one of non-terminal projecting surfaces of the body portion on a surface of the wiring substrate. As a result, an area of a heat conducting passage increases and heat radiation performance can be increased.
摘要翻译：电子设备包括半导体模块，布线基板，壳体构件和导热构件。导热构件将布线图案的预定部分和布线基板的导热图案热连接到与布线基板相对的壳体部件的表面的预定导热区域。预定的导热区域比布线基板更靠近与壳体部件相对的主体部分的表面。结果，可以辐射热量，并且可以通过壳体构件具有简单的形状来限制短路。导热图案被布置成与布线基板的表面上的主体部分的非端子突出表面中的至少一个相邻。结果，导热通道的面积增加，并且可以提高散热性能。

6. 发明授权

US09570902B2 Power supply current monitoring device 有权
标题翻译：电源电流监控装置
公开(公告)号：US09570902B2
公开(公告)日：2017-02-14
申请号：US14516109
申请日：2014-10-16
申请人： DENSO CORPORATION
发明人： Seiji Morino
IPC分类号： H02H7/085 , H02H3/093 , B62D5/04 , H02H7/122
CPC分类号： H02H7/0856 , B62D5/0481 , B62D5/0487 , H02H3/093 , H02H7/1225
摘要： A power supply current monitoring device is used for a load drive apparatus with two systems to drive a load. Each system includes a drive circuit connected in parallel with a battery, a capacitor connected between the battery and the drive circuit, and a relay connected between the drive circuit and a point at which power of the battery is divided between the systems. When overcurrent is detected once in one system, a repetitive monitoring process is performed. The monitoring process finally determines that the overcurrent actually occurs when a predetermined condition is satisfied after repeating a monitoring cycle in which an overcurrent time during which the overcurrent continues after the relay is turned ON is accumulated. The condition is satisfied when the monitoring cycle in which the overcurrent time reaches a predetermined threshold is repeated a predetermined consecutive number of times.
摘要翻译：电源电流监测装置用于具有两个驱动负载的系统的负载驱动装置。每个系统包括与电池并联连接的驱动电路，连接在电池和驱动电路之间的电容器，以及连接在驱动电路和电池的电源在系统之间分配的点的继电器。当在一个系统中检测到一次过电流时，执行重复监视处理。监视过程最终确定在重复在继电器接通之后过电流持续的过电流时间被累积的监视周期之后，当满足预定条件时，实际发生过电流。当过电流时间达到预定阈值的监视周期重复预定的连续次数时，满足条件。

7. 发明授权

US09460979B2 Electronic device having heat conducting member 有权
标题翻译：具有导热构件的电子装置
公开(公告)号：US09460979B2
公开(公告)日：2016-10-04
申请号：US14945095
申请日：2015-11-18
申请人： DENSO CORPORATION
发明人： Seiji Morino
IPC分类号： H01L23/34 , H01L23/36 , H01L23/498 , H01L23/053
CPC分类号： H01L23/36 , H01L23/053 , H01L23/3107 , H01L23/492 , H01L23/49844 , H01L24/40 , H01L2224/40095 , H01L2224/40245 , H01L2224/48247 , H01L2224/83801 , H01L2924/181 , H01L2924/00012 , H01L2924/00014
摘要： An electronic device includes a semiconductor module, a wiring substrate, a case member and a heat conducting member. The heat conducting member thermally connects predetermined portions of wiring patterns and a heat conducting pattern of the wiring substrate to a predetermined heat conduction region of a surface of the case member opposing to the wiring substrate. The predetermined heat conduction region is located further from the wiring substrate than a surface of a body portion opposing to the case member. As a result, heat can be radiated and a short can be restricted with the case member having a simple shape. The heat conducting pattern is disposed adjacent to at least one of non-terminal projecting surfaces of the body portion on a surface of the wiring substrate. As a result, an area of a heat conducting passage increases and heat radiation performance can be increased.
摘要翻译：电子设备包括半导体模块，布线基板，壳体构件和导热构件。导热构件将布线图案的预定部分和布线基板的导热图案热连接到与布线基板相对的壳体部件的表面的预定导热区域。预定的导热区域比布线基板更靠近与壳体部件相对的主体部分的表面。结果，可以辐射热量，并且可以通过壳体构件具有简单的形状来限制短路。导热图案被布置成与布线基板的表面上的主体部分的非端子突出表面中的至少一个相邻。结果，导热通道的面积增加，并且可以提高散热性能。

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