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1. 发明授权

US09382414B2 Flame retardant thermoplastic resin composition 有权
标题翻译：阻燃热塑性树脂组合物
公开(公告)号：US09382414B2
公开(公告)日：2016-07-05
申请号：US14424886
申请日：2013-08-21
申请人： Daicel-Evonik Ltd. , Daikin Industries, Ltd.
发明人： Mitsuteru Mutsuda , Tatsuki Akashi , Yuki Adachi , Haruhisa Masuda
IPC分类号： C08L61/00 , C08L61/16 , B29C69/00 , C08L71/00 , B29L31/00
CPC分类号： C08L61/16 , B29C69/00 , B29L2031/772 , C08G2650/40 , C08L71/00 , C08L2201/02 , C08L2207/04 , C08L27/12
摘要： A thermoplastic resin composition having a high flame retardancy in a thin-wall molded product and a molded article thereof are provided. The thermoplastic resin composition comprises (A) a thermoplastic resin containing a repeating unit having an arylene group, an ether group, and a carbonyl group and (B) a thermoplastic fluorine-containing resin. The weight ratio of the thermoplastic resin (A) and the thermoplastic fluorine-containing resin (B) in the former/the latter is 80/20 to 99/1. The thermoplastic fluorine-containing resin (B) is dispersed in the form of a particle in the thermoplastic resin (A) to form a dispersed phase, and the dispersed phase has an average particle diameter of not more than 3 μm. The thermoplastic resin composition is suitable for forming a molded article having a thin-wall portion with a thickness of not more than 1.5 mm.
摘要翻译：提供了在薄壁成型体中具有高阻燃性的热塑性树脂组合物及其成型品。热塑性树脂组合物包含（A）含有具有亚芳基，醚基和羰基的重复单元的热塑性树脂和（B）热塑性含氟树脂。前者/后者中的热塑性树脂（A）和热塑性含氟树脂（B）的重量比为80/20〜99/1。热塑性含氟树脂（B）以热塑性树脂（A）中的颗粒形式分散形成分散相，分散相的平均粒径不大于3μm。热塑性树脂组合物适用于形成具有不大于1.5mm厚度的薄壁部分的模塑制品。

2. 发明申请

US20150259525A1 FLAME RETARDANT THERMOPLASTIC RESIN COMPOSITION 有权
标题翻译：阻燃热塑性树脂组合物
公开(公告)号：US20150259525A1
公开(公告)日：2015-09-17
申请号：US14424886
申请日：2013-08-21
申请人： Daicel-Evonik Ltd. , Daikin Industries, Ltd.
发明人： Mitsuteru Mutsuda , Tatsuki Akashi , Yuki Adachi , Haruhisa Masuda
IPC分类号： C08L61/16 , B29C69/00
CPC分类号： C08L61/16 , B29C69/00 , B29L2031/772 , C08G2650/40 , C08L71/00 , C08L2201/02 , C08L2207/04 , C08L27/12
摘要： A thermoplastic resin composition having a high flame retardancy in a thin-wall molded product and a molded article thereof are provided. The thermoplastic resin composition comprises (A) a thermoplastic resin containing a repeating unit having an arylene group, an ether group, and a carbonyl group and (B) a thermoplastic fluorine-containing resin. The weight ratio of the thermoplastic resin (A) and the thermoplastic fluorine-containing resin (B) in the former/the latter is 80/20 to 99/1. The thermoplastic fluorine-containing resin (B) is dispersed in the form of a particle in the thermoplastic resin (A) to form a dispersed phase, and the dispersed phase has an average particle diameter of not more than 3 μm. The thermoplastic resin composition is suitable for forming a molded article having a thin-wall portion with a thickness of not more than 1.5 mm.
摘要翻译：提供了在薄壁成型体中具有高阻燃性的热塑性树脂组合物及其成型品。热塑性树脂组合物包含（A）含有具有亚芳基，醚基和羰基的重复单元的热塑性树脂和（B）热塑性含氟树脂。前者/后者中的热塑性树脂（A）和热塑性含氟树脂（B）的重量比为80/20〜99/1。热塑性含氟树脂（B）以热塑性树脂（A）中的颗粒形式分散形成分散相，分散相的平均粒径不大于3μm。热塑性树脂组合物适用于形成具有不大于1.5mm厚度的薄壁部分的模塑制品。

3. 发明授权

US11407864B2 Fiber-reinforced resin, process for producing same, and molded article 有权
公开(公告)号：US11407864B2
公开(公告)日：2022-08-09
申请号：US16143847
申请日：2018-09-27
申请人： DAICEL-EVONIK LTD.
发明人： Mitsuteru Mutsuda , Yoshiki Nakaie , Takayuki Uno
IPC分类号： C08J5/04 , C08J5/24 , C08J3/12 , C08J5/10 , C08G59/16 , C08K7/04 , C08L63/00 , C08L77/00 , C08G69/14 , C08G69/26 , C08K7/02 , C08K3/04 , B29B11/16 , C08L71/02
摘要： (A) A reinforcing fiber, (B) a resin particle, and (C) a matrix resin are combined to prepare a resin composition which improves a reinforcing effect by the reinforcing fiber. The reinforcing fiber (A) contains a carbon fiber. The resin particle (B) contains a semicrystalline thermoplastic resin, the semicrystalline thermoplastic resin in the resin particle (B) has an exothermic peak in a temperature range between a glass transition temperature of the semicrystalline thermoplastic resin and a melting point of the semicrystalline thermoplastic resin, the peak being determined by heating the resin particle (B) at a rate of 10° C./min. by differential scanning calorimetry (DSC), and the resin particle (B) has an average particle size of 3 to 40 μm. The semicrystalline thermoplastic resin may be a polyamide resin having a melting point of not lower than 150° C. (particularly, a polyamide resin having an alicyclic structure and a glass transition temperature of not lower than 100° C., or a polyamide resin having a γ-type crystal structure or a degree of crystallinity of not more than 50%). The matrix resin (C) may be a thermosetting resin.

4. 发明授权

US09644080B2 Light-resistant resin composition, and moulded body thereof 有权
公开(公告)号：US09644080B2
公开(公告)日：2017-05-09
申请号：US14779218
申请日：2013-10-17
申请人： DAICEL-EVONIK LTD.
发明人： Tatsuki Akashi , Mitsuteru Mutsuda
IPC分类号： C08K3/22 , C08L27/12 , C08L71/10 , C08L101/12 , C08L27/18 , C08J3/22 , C08L71/00 , C08L77/00
CPC分类号： C08K3/22 , C08J3/226 , C08J2427/18 , C08K2003/2241 , C08L27/12 , C08L27/18 , C08L67/03 , C08L71/00 , C08L71/10 , C08L71/12 , C08L77/00 , C08L79/08 , C08L101/12 , C08L2201/08
摘要： Provided is an additive that increases or improves a light resistance (or whiteness) of a non-fluorinated thermoplastic resin (e.g., a super engineering plastic, such as an aromatic polyamide, a liquid crystal polyester, or an aromatic polyetherketone resin). The additive comprises a fluorine-containing resin and an inorganic white pigment (e.g., titanium oxide). The fluorine-containing resin may be, for example, a fluorine-containing resin comprising a tetrafluoroethylene unit as a monomer unit, in particular, may be a tetrafluoroethylene copolymer (e.g., at least one member selected from the group consisting of a copolymer of tetrafluoroethylene and another fluorinated olefin, a copolymer of tetrafluoroethylene and a fluorinated vinyl ether, and a copolymer of tetrafluoroethylene, another fluorinated olefin and a fluorinated vinyl ether).

5. 发明申请

US20150024130A1 POWDERY SEALANT AND SEALING METHOD 审中-公开
标题翻译：粉末密封和密封方法
公开(公告)号：US20150024130A1
公开(公告)日：2015-01-22
申请号：US14371918
申请日：2013-02-08
申请人： Daicel-Evonik Ltd.
发明人： Hiroaki Arita , Yoshiki Nakaie , Mitsuteru Mutsuda
IPC分类号： C09J177/06 , C08K5/13 , C08K5/20 , C08K5/3475 , C08K5/17 , C08K5/12
CPC分类号： C09J177/06 , C08G69/36 , C08K5/12 , C08K5/13 , C08K5/17 , C08K5/20 , C08K5/3475 , C08L77/02 , C08L77/06 , C08L2205/02 , C09J177/02 , C09K3/1006 , C09K2200/0667 , H01L21/56 , H01L23/293 , H01L2924/0002 , Y10T428/2982 , H01L2924/00
摘要： A sealant capable of tightly sealing an electric device at a low temperature and a sealing method of using the sealant are provided.The sealant for sealing a device comprises a copolyamide-series resin powder having a particle diameter of not more than 1 mm. The copolyamide-series resin powder contains at least a fine particle (e.g., a copolyamide-series resin particle having an average particle diameter of 20 to 400 μm), or may contain the fine particle in combination with a coarse particle (e.g., a copolyamide-series resin particle having an average particle diameter of 450 to 800 μm). The copolyamide-series resin may be a crystalline resin. The copolyamide-series resin may have a melting point or softening point of 75 to 160° C. The copolyamide-series resin may be, e.g., a binary or ternary copolymer. Further, the copolyamide-series resin may contain a unit derived from a long-chain component having a C8-16alkylene group (at least one component selected from the group consisting of a C9-17lactam and an aminoC9-17alkanecarboxylic acid).
摘要翻译：提供了能够在低温下紧密地密封电子装置的密封剂和使用密封剂的密封方法。用于密封装置的密封剂包括粒径不大于1mm的共聚酰胺系树脂粉末。共聚酰胺系树脂粉末至少含有微粒（例如，平均粒径为20〜400μm的共聚酰胺系树脂粒子），或者可以含有与粗粒子（例如共聚酰胺）组合的微粒子 - 平均粒径为450〜800μm的系列树脂粒子）。共聚酰胺系树脂可以是结晶性树脂。共聚酰胺系树脂的熔点或软化点可以为75〜160℃。共聚酰胺类树脂可以是例如二元或三元共聚物。此外，共聚酰胺类树脂可以含有源自具有C8-16亚烷基的长链成分的单元（至少一种选自C 9-17内酰胺和氨基C 17-17烷羧酸的成分）。

6. 发明授权

US11066529B2 Water-soluble matrix, pre-molded article containing resin particles, and method for producing resin particles 有权
公开(公告)号：US11066529B2
公开(公告)日：2021-07-20
申请号：US16615571
申请日：2018-06-06
申请人： DAICEL-EVONIK LTD.
发明人： Mitsuteru Mutsuda , Yoshiki Nakaie , Hiroaki Arita
IPC分类号： C08J3/16 , C08L29/04
摘要： Provided are: a water-soluble matrix whose melt-kneading temperature can be adjusted according to the melting point or glass transition temperature of a resin; a pre-molded article in which resin particles are dispersed in the water-soluble matrix; and a method for producing resin particles. This production method includes melt-kneading a water-soluble matrix containing a modified polyvinyl alcohol-based resin and a water-soluble saccharide at a weight ratio of the former/the latter=from 99/1 to 50/50 and a thermoplastic resin, and bringing the pre-molded article in which the resin particles are dispersed into contact with an aqueous solvent to elute the matrix. The modified polyvinyl alcohol-based resin contains in a side chain thereof an alkyl group including at least one hydroxyl group (for example, a 1,2-dihydroxyalkyl group).

7. 发明授权

US08765047B2 Thermoplastic resin composition and molded product thereof 有权
标题翻译：热塑性树脂组合物及其成型体
公开(公告)号：US08765047B2
公开(公告)日：2014-07-01
申请号：US14019859
申请日：2013-09-06
申请人： Daicel-Evonik Ltd.
发明人： Mitsuteru Mutsuda
IPC分类号： H05B6/00 , C08L61/16 , C08L71/00
CPC分类号： C08L61/16 , C08G2650/40 , C08L71/00 , Y10T428/26
摘要： Thermoplastic resin composition providing improved molding efficiency due to high flowability and a high crystallization temperature, while ensuring desired physical properties (e.g., strength) in a molded product. Also, molded product of the composition. The thermoplastic resin composition comprises a plurality of thermoplastic resins having a melt viscosity different from each other and containing a unit which comprises an arylene group and an ether group and/or a carbonyl group. The thermoplastic resin composition may comprise a first thermoplastic resin having a melt viscosity of 150 to 1500 Pa·s at a temperature of 400° C. and a shear rate of 1216 s−1 and a second thermoplastic resin, wherein the melt viscosity ratio of the first thermoplastic resin relative to the second thermoplastic resin, at a temperature of 400° C. and a shear rate of 1216 s−1, is 1.5:1 to 10:1.
摘要翻译：热塑性树脂组合物由于高流动性和高结晶温度而提高了模塑效率，同时确保了模制产品中所需的物理性能（例如强度）。而且，组合物的成型品。热塑性树脂组合物包含熔融粘度彼此不同并含有包含亚芳基和醚基和/或羰基的单元的多种热塑性树脂。热塑性树脂组合物可以包含在400℃的温度下的熔融粘度为150〜1500Pa·s，剪切速度为1216s -1的第一热塑性树脂和第二热塑性树脂，其中，相对于第二热塑性树脂的第一热塑性树脂在400℃的温度和1216s-1的剪切速率下为1.5:1至10:1。

8. 发明授权

US11142613B2 Polyamide particles, production process therefor, resin composition, and molded article 有权
公开(公告)号：US11142613B2
公开(公告)日：2021-10-12
申请号：US16313286
申请日：2017-04-10
申请人： DAICEL-EVONIK LTD.
发明人： Mitsuteru Mutsuda , Yoshiki Nakaie , Takayuki Uno
IPC分类号： C08J3/12 , C08K7/14 , C08L63/00 , C08L77/00 , C08G69/08 , C08G69/26 , C08K7/04 , C08G69/14 , C08J3/00 , C08K7/06
摘要： Polyamide particles including polyamide and having a water absorption rate of 0.5 to 2.5 wt. % are prepared to improve toughness of a cured product of a curable resin. The polyamide may be a semicrystalline polyamide. The polyamide has a glass transition temperature of approximately 100 to 150° C. The polyamide may have an alicyclic structure. The polyamide particles of this invention have an average particle size of approximately 5 to 40 μm and a specific surface area determined by the BET method of approximately 0.08 to 12 m2/g. The polyamide particles of the present invention may also be spherical and have an average particle size of approximately 15 to 25 μm. Furthermore, the polyamide particles of the present invention may have an exothermic peak in a temperature range between the glass transition temperature and a melting point of the polyamide upon heating the polyamide particles at a rate of 10° C./min by differential scanning calorimetry (DSC).

9. 发明授权

US10370509B2 Fiber-reinforced resin, process for producing same, and molded article 有权
公开(公告)号：US10370509B2
公开(公告)日：2019-08-06
申请号：US15759976
申请日：2016-10-05
申请人： DAICEL-EVONIK LTD.
发明人： Mitsuteru Mutsuda , Yoshiki Nakaie , Takayuki Uno
IPC分类号： C08J5/04 , C08J5/24 , C08J3/12 , C08J5/10 , B29B11/16 , C08G59/16 , C08K7/04 , C08L63/00 , C08L71/02 , C08L77/00 , C08G69/14 , C08G69/26
摘要： (A) A reinforcing fiber, (B) a resin particle, and (C) a matrix resin are combined to prepare a resin composition which improves a reinforcing effect by the reinforcing fiber. The reinforcing fiber (A) contains a carbon fiber. The resin particle (B) contains a semicrystalline thermoplastic resin, the semicrystalline thermoplastic resin in the resin particle (B) has an exothermic peak in a temperature range between a glass transition temperature of the semicrystalline thermoplastic resin and a melting point of the semicrystalline thermoplastic resin, the peak being determined by heating the resin particle (B) at a rate of 10° C./min. by differential scanning calorimetry (DSC), and the resin particle (B) has an average particle size of 3 to 40 μm. The semicrystalline thermoplastic resin may be a polyamide resin having a melting point of not lower than 150° C. (particularly, a polyamide resin having an alicyclic structure and a glass transition temperature of not lower than 100° C., or a polyamide resin having a γ-type crystal structure or a degree of crystallinity of not more than 50%). The matrix resin (C) may be a thermosetting resin.

10. 发明授权

US10246586B2 Light-resistance improver 有权
公开(公告)号：US10246586B2
公开(公告)日：2019-04-02
申请号：US14779226
申请日：2013-10-17
申请人： DAICEL-EVONIK LTD.
发明人： Tatsuki Akashi , Mitsuteru Mutsuda
IPC分类号： C08L27/18 , C08L71/00
摘要： Provided is an additive that increases or improves a light resistance of anon-fluorinated thermoplastic resin (e.g., a super engineering plastic, such as an aromatic polyamide, a liquid crystal polyester, or an aromatic polyetherketone resin). The additive comprises a fluorine-containing resin. The fluorine-containing resin may be, for example, a fluorine-containing resin comprising a tetrafluoroethylene unit as a monomer unit, in particular, may be a tetrafluoroethylene copolymer (e.g., at least one member selected from the group consisting of a copolymer of tetrafluoroethylene and another fluorinated olefin, a copolymer of tetrafluoroethylene and a fluorinated vinyl ether, and a copolymer of tetrafluoroethylene, another fluorinated olefin and a fluorinated vinyl ether).

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