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1. 发明申请

US20210192312A1 SMART CARDS WITH METAL LAYER(S) AND METHODS OF MANUFACTURE 有权
公开(公告)号：US20210192312A1
公开(公告)日：2021-06-24
申请号：US17006798
申请日：2020-08-29
申请人： Mustafa Lotya , David Finn , Darren Molloy
发明人： Mustafa Lotya , David Finn , Darren Molloy
IPC分类号： G06K19/077 , H01Q1/22 , H01Q21/29 , H01Q7/00 , H05K1/16
摘要： Smartcards with metal layers manufactured according to various techniques disclosed herein. One or more metal layers of a smartcard stackup may be provided with slits overlapping at least a portion of a module antenna in an associated transponder chip module disposed in the smartcard so that the metal layer functions as a coupling frame. One or more metal layers may be pre-laminated with plastic layers to form a metal core or clad subassembly for a smartcard, and outer printed and/or overlay plastic layers may be laminated to the front and/or back of the metal core. Front and back overlays may be provided. Various constructions of and manufacturing techniques (including temperature, time, and pressure regimes for laminating) for smartcards are disclosed herein.

2. 发明授权

US10977542B2 Smart cards with metal layer(s) and methods of manufacture 有权
公开(公告)号：US10977542B2
公开(公告)日：2021-04-13
申请号：US16729530
申请日：2019-12-30
申请人： Mustafa Lotya , Darren Molloy , David Finn
发明人： Mustafa Lotya , Darren Molloy , David Finn
IPC分类号： G06K19/00 , G06K19/077 , G06K19/07
摘要： Metal layers of a smartcard may be provided with slits overlapping at least a portion of a module antenna in an associated transponder chip module disposed in the smartcard so that the metal layer functions as a coupling frame. One or more metal layers may be pre-laminated with plastic layers to form a metal core or clad subassembly for a smartcard, and outer printed and/or overlay plastic layers may be laminated to the front and/or back of the metal core. Front and back overlays may be provided. Pre-laminated metal layers having an array of card sites, with each position having a defined area prepared for the later implanting of a transponder chip module characterized by different sized perforations and gaps around this defined area adjacent to the RFID slit(s), to facilitate the quick removal of the metal in creating a pocket to accept a transponder chip module.

3. 发明申请

US20210056375A1 SMART CARDS WITH METAL LAYER(S) AND METHODS OF MANUFACTURE 有权
公开(公告)号：US20210056375A1
公开(公告)日：2021-02-25
申请号：US17006797
申请日：2020-08-29
申请人： Mustafa Lotya , David Finn , Darren Molloy
发明人： Mustafa Lotya , David Finn , Darren Molloy
IPC分类号： G06K19/077 , H01Q1/22 , H01Q21/29 , H01Q7/00 , H05K1/16
摘要： Smartcards with metal layers manufactured according to various techniques disclosed herein. One or more metal layers of a smartcard stackup may be provided with slits overlapping at least a portion of a module antenna in an associated transponder chip module disposed in the smartcard so that the metal layer functions as a coupling frame. One or more metal layers may be pre-laminated with plastic layers to form a metal core or clad subassembly for a smartcard, and outer printed and/or overlay plastic layers may be laminated to the front and/or back of the metal core. Front and back overlays may be provided. Various constructions of and manufacturing techniques (including temperature, time, and pressure regimes for laminating) for smartcards are disclosed herein.

4. 发明申请

US20200151534A1 SMART CARDS WITH METAL LAYER(S) AND METHODS OF MANUFACTURE 审中-公开
公开(公告)号：US20200151534A1
公开(公告)日：2020-05-14
申请号：US16729530
申请日：2019-12-30
申请人： Mustafa Lotya , Darren Molloy , David Finn
发明人： Mustafa Lotya , Darren Molloy , David Finn
IPC分类号： G06K19/077 , G06K19/07
摘要： Metal layers of a smartcard may be provided with slits overlapping at least a portion of a module antenna in an associated transponder chip module disposed in the smartcard so that the metal layer functions as a coupling frame. One or more metal layers may be pre-laminated with plastic layers to form a metal core or clad subassembly for a smartcard, and outer printed and/or overlay plastic layers may be laminated to the front and/or back of the metal core. Front and back overlays may be provided. Pre-laminated metal layers having an array of card sites, with each position having a defined area prepared for the later implanting of a transponder chip module characterized by different sized perforations and gaps around this defined area adjacent to the RFID slit(s), to facilitate the quick removal of the metal in creating a pocket to accept a transponder chip module.

5. 发明申请

US20180123221A1 SMARTCARDS, RFID DEVICES, WEARABLES AND METHODS 审中-公开
公开(公告)号：US20180123221A1
公开(公告)日：2018-05-03
申请号：US15662305
申请日：2017-07-28
申请人： David Finn , Mustafa Lotya , Darren Molloy
发明人： David Finn , Mustafa Lotya , Darren Molloy
IPC分类号： H01Q1/22 , H01Q7/00 , H01Q1/38 , G06K19/077
CPC分类号： H01Q1/2225 , G06K19/07773 , H01Q1/38 , H01Q7/005
摘要： Coupling frames comprising a conductive (metal) surface with a slit (S) or non-conductive stripe (NCS) extending from an outer edge to an inner position thereof, and overlapping a transponder device. A coupling frame with slit for coupling with an inductive or capacitive device (inductor or capacitor) may be used at any ISM frequency band to concentrate surface current around the slit. The coupling frame can be tuned to operate at a frequency of interested by introducing a resistive, inductive or capacitive element. The resonance frequency of the coupling frame can be matched to that of the transponder chip module to achieve optimum performance. Coupling frames with or without a transponder device may be integrated, overlapping, stacked or placed adjacent to one another to enhance system performance. Multiple coupling frames may be electrically isolated from one another by the application of a dielectric coating such Diamond Like Carbon (DLC).

6. 发明授权

US09836684B2 Smart cards, payment objects and methods 有权
公开(公告)号：US09836684B2
公开(公告)日：2017-12-05
申请号：US15072356
申请日：2016-03-17
申请人： David Finn , Mustafa Lotya , Darren Molloy
发明人： David Finn , Mustafa Lotya , Darren Molloy
IPC分类号： G06K19/06 , G06K19/077 , B23K26/40 , H01Q1/22 , H01Q1/38 , H01Q7/00 , B23K26/21 , B23K26/38 , G06K7/10 , B23K101/40 , B23K103/00
CPC分类号： G06K19/07722 , B23K26/21 , B23K26/38 , B23K26/40 , B23K2101/40 , B23K2103/50 , G06K7/10336 , G06K19/07747 , G06K19/07756 , G06K19/07788 , G06K19/07794 , H01Q1/2225 , H01Q1/38 , H01Q7/00
摘要： Smartcards having (i) a metal card body (MCB) with a slit (S) overlapping a module antenna (MA) of a chip module (TCM) or (ii) multiple metal layers (M1, M2, M3) each having a slit (S1, S2, S3) offset or oriented differently than each other. A front metal layer may be continuous (no slit), and may be shielded from underlying metal layers by a shielding layer (SL). Metal backing inserts (MBI) reinforcing the slit(s) may also have a slit (S2) overlapping the module antenna. Diamond like coating filling the slit. Key fobs similarly fabricated. Plastic-Metal-Plastic smart cards and methods of manufacture are disclosed. Such cards may be contactless only, contact only, or may be dual-interface (contact and contactless) cards.

7. 发明授权

US09634391B2 RFID transponder chip modules 有权
公开(公告)号：US09634391B2
公开(公告)日：2017-04-25
申请号：US14619170
申请日：2015-02-11
申请人： David Finn , Mustafa Lotya , Darren Molloy
发明人： David Finn , Mustafa Lotya , Darren Molloy
IPC分类号： G06K19/077 , H05K1/11 , H01Q7/00 , H01Q1/38 , H01Q1/22 , B23K26/362 , B23K26/40 , B23K101/40 , B23K103/00
CPC分类号： H01Q7/00 , B23K26/361 , B23K26/362 , B23K26/40 , B23K2101/40 , B23K2103/50 , G06K19/07722 , G06K19/07747 , G06K19/07754 , G06K19/07794 , H01L2224/45144 , H01L2224/48091 , H01L2224/48228 , H01L2224/48472 , H01Q1/2225 , H01Q1/38 , H05K1/111 , H01L2924/00014 , H01L2924/00
摘要： The planar antenna (PA) of a transponder chip module (TCM) may have a U-shaped portion so that an outer end (OE) of the antenna may be positioned close to an RFID chip (IC) disposed at a central area of a module tape (MT) for the transponder chip module. A module tape (MT2) may have contact pads (CP) on one side thereof and a connection bridge (CBR) on another side thereof, and may be joined with a module tape (MT1) having a planar antenna (PA). Metal of a conductive layer (CL) within a conductive element such as a coupling frame (CF) or a planar antenna (PA) may be scribed to have many small segments. A metal sheet may be stamped to have contact side metallization, and joined with a module tape (MT) having a planar antenna (PA).

8. 发明申请

US20160110639A1 PASSIVE SMART CARDS, METAL CARDS, PAYMENT OBJECTS AND SMART JEWELRY 有权
标题翻译：被动智能卡，金属卡，付款对象和智能珠宝
公开(公告)号：US20160110639A1
公开(公告)日：2016-04-21
申请号：US14862119
申请日：2015-09-22
申请人： David Finn , Mustafa Lotya , Darren Molloy
发明人： David Finn , Mustafa Lotya , Darren Molloy
IPC分类号： G06K19/077 , G06K7/10
CPC分类号： G06K19/07788 , B23K26/21 , B23K26/361 , B23K26/362 , B23K26/40 , B23K2101/40 , B23K2103/50 , G06K7/10336 , G06K19/07722 , G06K19/07747 , G06K19/07756 , G06K19/07794 , H01Q1/2225 , H01Q1/38 , H01Q7/00
摘要： RFID devices comprising (i) a transponder chip module (TCM, 1410) having an RFIC chip (IC) and a module antenna (MA), and (ii) a coupling frame (CF) having an electrical discontinuity comprising a slit (S) or non-conductive stripe (NCS). The coupling frame may be disposed closely adjacent the transponder chip module so that the slit overlaps the module antenna. The RFID device may be a payment object such as a jewelry item having a metal component modified with a slit (S) to function as a coupling frame. The coupling frame may be moved (such as rotated) to position the slit to selectively overlap the module antennas (MA) of one or more transponder chip modules (TCM-1, TCM-2) disposed in the payment object, thereby selectively enhancing (including enabling) contactless communication between a given transponder chip module in the payment object and another RFID device such as an external contactless reader. The coupling frame may be tubular. A card body construction for a metal smart card is disclosed.
摘要翻译： RFID设备包括（i）具有RFIC芯片（IC）和模块天线（MA）的应答器芯片模块（TCM，1410），以及（ii）具有包括狭缝（S）的电中断的耦合框架（CF）或非导电条纹（NCS）。耦合框架可以紧邻发射机应答器芯片模块设置，使得狭缝与模块天线重叠。 RFID装置可以是支付对象，例如具有用狭缝（S）修改的金属部件的饰品项目，用作耦合框架。联接框架可以被移动（例如旋转）以将狭缝定位成与布置在付款对象中的一个或多个应答器芯片模块（TCM-1，TCM-2）的模块天线（MA）重叠，从而选择性地增强（包括启用）支付对象中的给定应答器芯片模块与另一个RFID设备（例如外部非接触式读取器）之间的非接触式通信。联接框架可以是管状的。公开了一种用于金属智能卡的卡体结构。

9. 发明申请

US20200257953A1 CONTACTLESS SMARTCARDS WITH COUPLING FRAMES 审中-公开
公开(公告)号：US20200257953A1
公开(公告)日：2020-08-13
申请号：US16742903
申请日：2020-01-14
申请人： Mustafa Lotya , Darren Molloy , David Finn
发明人： Mustafa Lotya , Darren Molloy , David Finn
IPC分类号： G06K19/077 , H01Q1/22
摘要： A smartcard (SC) having at least a contactless interface, such as having a dual interface transponder chip module (TCM) with a chip (IC), a module antenna (MA) for the contactless interface, and contact pads (CP) for a contact interface. Metal layers (ML) may have openings (MO) for receiving the module, and slits (S) or nonconductive stripes (NCS) extending to the openings, thereby forming coupling frames (CF). A card body (CB) for the smartcard may comprise two such metal layers (front and rear coupling frames) separated by a layer of non-conductive (dielectric) material. A front face card layer and a rear face card layer may complete a multiple coupling frame stack-up for a smartcard. Various slit designs (configurations, geometries) are described and illustrated. The slit may be filled. The slit may be reinforced.

10. 发明授权

US10733494B2 Contactless metal card constructions 有权
公开(公告)号：US10733494B2
公开(公告)日：2020-08-04
申请号：US15939281
申请日：2018-03-29
申请人： David Finn , Mustafa Lotya , Darren Molloy
发明人： David Finn , Mustafa Lotya , Darren Molloy
IPC分类号： G06K19/06 , G06K19/077 , H04B5/00 , H01Q1/22
摘要： A metal smartcard (SC) having a transponder chip module (TCM) with a module antenna (MA), and a card body (CB) comprising two discontinuous metal layers (ML), each layer having a slit (S) overlapping the module antenna, the slits being oriented differently than one another. One metal layer can be a front card body (FCB, CF1), and the other layer may be a rear card body (RCB, CF2) having a magnetic stripe (MS) and a signature panel (SP).

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