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1. 发明申请

US20210403716A1 THERMALLY CONDUCTIVE COMPOSITION CONTAINING MGO FILLER AND METHODS AND DEVICES IN WHICH SAID COMPOSITION IS USED 有权
公开(公告)号：US20210403716A1
公开(公告)日：2021-12-30
申请号：US17281484
申请日：2018-12-29
申请人： Dow Global Technologies LLC , Dow Silicones Corporation
发明人： Xiaolian Hu , Jiguang Zhang , Yan Zheng , Hongyu Chen , Chen Chen , Dorab Bhagwagar , Darren Hansen
IPC分类号： C08L83/00 , C08K3/22 , C08K5/3417
摘要： A highly thermally conductive composition is provided, such composition comprising: (A) An organopolysiloxane composition; (B) a filler treating agent; (C) a thermal stabilizer; and (D) thermally conductive filler mixture, comprising: (D-1) a small-particulate thermally conductive filler having a mean size of up to 1 μm, (D-2) middle-sized filler having a mean size of from 1 to 10 μm, (D-3) large filler having a mean size of larger than 30 μm and comprising at least magnesium oxide.

2. 发明公开

US20230257582A1 THERMAL INTERFACE MATERIAL WITH LOW DISPENSING VISCOSITY, LOW VERTICAL FLOW AFTER DISPENSING, AND LOW THERMAL IMPEDANCE AFTER CURE 审中-公开
公开(公告)号：US20230257582A1
公开(公告)日：2023-08-17
申请号：US18004077
申请日：2020-09-23
申请人： Dow Global Technologies LLC , Dow Silicones Corporation
发明人： Jiguang Zhang , Yan Zheng , Chao He , Xuedong Gao , Qianqing Ge , Dorab Bhagwagar , Peng Wei , Chen Chen , Hongyu Chen
IPC分类号： C08L83/04 , C08K5/5419 , C08K3/22
CPC分类号： C08L83/04 , C08K5/5419 , C08K3/22 , C08K2201/001 , C08K2003/2296 , C08K2003/0812
摘要： Provided is a thermal interface material containing a divinyl polydimethylsiloxane, a chain extender, a crosslinker, 80 volume-percent or more thermally conductive filler, treating agent composition, platinum hydrosilylation catalyst, and up to 0.2 weight-percent hydrosilylation inhibitor; where the wherein weight-percent values are relative to thermal interface material composition weight, volume-percent values are relative to thermal interface material composition volume, the molar ratio of silyl hydride groups to vinyl groups in the thermal interface material composition is 0.4 or more and at the same time is 1.0 or less, and the molar ratio of silyl hydride functionality from the chain extender to silyl hydride functionality from the crosslinker is 13 or more and at the same time 70 or less.

3. 发明申请

US20210332280A1 THERMALLY CONDUCTIVE COMPOSITION AND METHODS AND DEVICES IN WHICH SAID COMPOSITION IS USED 有权
公开(公告)号：US20210332280A1
公开(公告)日：2021-10-28
申请号：US17268143
申请日：2018-11-07
申请人： Dow Global Technologies LLC , Dow Silicones Corporation
发明人： Xiaolian Hu , Jiguang Zhang , Yan Zheng , Hongyu Chen , Chen Chen , Dorab Bhagwagar , Darren Hansen
IPC分类号： C09K5/14 , C08G77/20 , C08K13/04 , C08K5/3417 , C08K7/18 , C08K3/22 , C08K3/28 , C08K3/38 , F28F23/00
摘要： A highly thermally conductive composition is provided, such composition comprising: (A) An organopolysiloxane composition; (B) a filler treating agent; (C) a thermal stabilizer; and (D) thermally conductive filler mixture, comprising: (D-1) a small-particulate thermally conductive filler having a mean size of up to 3 μm, (D-2) spherical aluminum nitride having a mean size of from 50 to 150 μm, (D-3) boron nitride having a mean size of from 20 to 200 μm.

4. 发明授权

US11851603B2 Thermally conductive composition and methods and devices in which said composition is used 有权
公开(公告)号：US11851603B2
公开(公告)日：2023-12-26
申请号：US17268143
申请日：2018-11-07
申请人： Dow Global Technologies LLC , Dow Silicones Corporation
发明人： Xiaolian Hu , Jiguang Zhang , Yan Zheng , Hongyu Chen , Chen Chen , Dorab Bhagwagar , Darren Hansen
IPC分类号： C09K5/14 , C08G77/20 , C08K3/22 , C08K3/28 , C08K3/38 , C08K5/3417 , C08K7/18 , C08K13/04 , F28F23/00 , C08G77/00 , H01L23/373 , H01L23/42
CPC分类号： C09K5/14 , C08G77/20 , C08K3/22 , C08K3/28 , C08K3/38 , C08K5/3417 , C08K7/18 , C08K13/04 , F28F23/00 , C08G77/80 , C08K2003/2227 , C08K2003/2296 , C08K2003/282 , C08K2003/385 , C08K2201/001 , C08K2201/005 , C08K2201/014 , H01L23/3737 , H01L23/42
摘要： A highly thermally conductive composition is provided, such composition comprising: (A) An organopolysiloxane composition; (B) a filler treating agent; (C) a thermal stabilizer; and (D) thermally conductive filler mixture, comprising: (D-1) a small-particulate thermally conductive filler having a mean size of up to 3 μm, (D-2) spherical aluminum nitride having a mean size of from 50 to 150 μm, (D-3) boron nitride having a mean size of from 20 to 200 μm.

5. 发明授权

US11655369B2 Trialkoxy functional branched siloxane compositions 有权
公开(公告)号：US11655369B2
公开(公告)日：2023-05-23
申请号：US17439855
申请日：2020-10-28
申请人： Dow Silicones Corporation
发明人： Dorab Bhagwagar , Peng Wei , Qianqing Ge , Yan Zheng , Zhanjie Li
IPC分类号： C08L83/04 , C08K3/013
CPC分类号： C08L83/04 , C08K3/013 , C08K2201/001
摘要： A composition contains an organopolysiloxane having the average chemical structure (I):

[R′R2SiO—(R2SiO)m]3—Si—[OSiR2]n—Y—Si(OR)3 (I)

where: R is independently in each occurrence selected from alkyl, aryl, substituted alkyl and substituted alkyl groups having from one to 8 carbon atoms; R′ is independently in each occurrence selected from R and terminally unsaturated alkylene groups having from 2 to 6 carbon atoms; Y is selected from a group consisting of: X, and X—(R2SiO)pSiR2—X; where p has an average value in a range of one to 3; and X is independently in each occurrence selected from alkylene and substituted alkylene groups having from one to 6 carbon atoms; and the average values for subscripts m and n are each greater than zero and independently selected so that the average value for the sum of all of the average m values and the average n value is in a range of 30-200.

6. 发明申请

US20200224031A1 SILICONE COMPOSITION COMPRISING FILLER 审中-公开
公开(公告)号：US20200224031A1
公开(公告)日：2020-07-16
申请号：US16629978
申请日：2017-09-29
申请人： Dow Silicones Corporation
发明人： Yan Zheng , Zhongwei Cao , Don Kleyer , Tassie Andersen
IPC分类号： C08L83/04
摘要： A composition comprising: (A) an organopolysiloxane, (B) a filler and (C) a filler treatment agent, comprising a mixture of two organopolysiloxanes having the general formulas (I) and (II), R1R2R3Si—[ (CH2)m1 (Me2SiO)m1]r—[O-(Me2SiO)m3]p-(Me2Si)0 (CH2)m2 (Me2SiO)m2—(CH2)m3—Si (OR43)3 (I), wherein ‘Me’ is methyl group, R1, R2 and R3 are independently selected from an alkyl group having 1 to 20 carbon atoms, an alkenyl group having 2 to 4 carbon atoms, an alkoxy group having 1 to 3 carbon atoms or (OSiR7R8R9), in which R7, R8 and R9 are independently selected from an alkyl group having 1 to 4 carbon atoms, R4 is an alkyl group having 1 to 4 carbon atoms, n1, n2, m1, m3 and o are integers from 1 to 200, m2, n3, r and p are integers from 0 to 200, r and p are not 0 at the same time, (R5O)3Si—[(CH2)n1(Me2SiO)m1]r—(CH2)n4—[O-(Me2SiO)m3]p-(Me2Si)o-(CH2)m2— (Me2SiO)m2—(CH2)n3—Si(OR6)3 (II), wherein R5 and R6 are an alkyl group having 1 to 4 carbon atoms, n1, m1, m3, o and n2 are integers from 1 to 200, n3, n4, m2, r and p are integers from 0 to 200, r and p are not 0 at the same time.

7. 发明公开

US20230313016A1 ALUMINUM NITRIDE FILLED THERMALLY CONDUCTIVE SILICONE COMPOSITION 审中-公开
公开(公告)号：US20230313016A1
公开(公告)日：2023-10-05
申请号：US18041749
申请日：2020-11-10
申请人： Dow Silicones Corporation
发明人： Yan Zheng , Dorab Bhagwagar , Darren Hansen , Peng Wei , Han Guang Wu
IPC分类号： C09K5/14 , C08L83/04 , C08K13/04 , H05K7/20
CPC分类号： C09K5/14 , C08L83/04 , C08K13/04 , H05K7/2039 , C08L2205/025 , C08L2203/20 , C08L2312/00 , C08K5/5419
摘要： A composition contains: (a) curable silicone composition including: (i) a vinyldimethylsiloxy-terminated polydimethylpolysiloxane with a viscosity of 30 to 400 mPa*s; (ii) a SiH functional crosslinker; and (iii) a hydrosilylation catalyst; where the molar ratio of crosslinker SiH functionality to vinyl functionality is 0.5:1 to 1:1; (b) alkyl trialkoxysilane and/or a mono-trialkoxysiloxy terminated dimethylpolysiloxane treating agent; (c) filler mix containing: (i) 40 wt % or more of spherical and irregular shaped AlN particles, both having an average size of 30 micrometers or more, the spherical AlN fillers are 40-60 wt % of the weight of the AlN fillers; (ii) 25-35 wt % spherical Al2O3 particles with an average size of 1-5 micrometers; (iii) 10-15 wt % of additional thermally conductive filler with a 0.1-0.5 micrometer average size; and (iv) optionally, BN fillers having an average size greater than 20 micrometers; where filler mix is 90-97 wt % and wt % is relative to composition weight unless otherwise stated.

8. 发明公开

US20240279525A1 THERMALLY CONDUCTIVE SILICONE COMPOSITION 审中-公开
公开(公告)号：US20240279525A1
公开(公告)日：2024-08-22
申请号：US18566121
申请日：2021-08-19
申请人： Dow Silicones Corporation
发明人： Yan Zheng , Dorab Bhagwagar , Qianqing Ge , Peng Wei , Han Guang Wu
IPC分类号： C09K5/14 , C08G77/12 , C08G77/20 , C08K3/22 , C08K3/28 , C08K7/18 , C08K9/08 , C08K13/06 , H05K7/20
CPC分类号： C09K5/14 , C08G77/12 , C08G77/20 , C08K13/06 , H05K7/2039 , C08K2003/2296 , C08K2003/282 , C08K7/18 , C08K9/08 , C08K2201/001 , C08K2201/005
摘要： A composition contains: (A) a curable silicone composition including: (a1) a vinyldimethylsiloxy-terminated polydimethylpolysiloxane having a viscosity in a range of 30-400 milliPascal*seconds, (a2) a silicon-hydride functional crosslinker, and (a3) a hydrosilylation catalyst, where the molar ratio of silicon-hydride functionality from the crosslinker to vinyl functionality is in a range of 0.5:1 to 1:1; (B) a filler treating agent comprising one or both of an alkyl trialkoxysilane and a mono-trialkoxysiloxy terminated dimethylpolysiloxane; and (C) a thermally conductive filler mixture including (c1) 40-55 wt % of aluminum nitride fillers, containing a blend of: (c1-a) 15-41 wt % of spherical aluminum nitride particles having a D50 particle size of 100 micrometers or more, and (c1-b) spherical or irregular shaped aluminum nitride particles having a D50 particle size of 20-80 micrometers; (c2) spherical aluminum oxide particles having a D50 particle size of 1-5 micrometers; and (c3) 10-20 wt % of irregular zinc oxide particles having a D50 particle size of 0.1-0.5 micrometer; where the total amount of the thermally conductive filler mixture is 94-97 wt %; and where wt % values are relative to the weight of the thermally conductive composition unless otherwise stated.

9. 发明公开

US20230212447A1 NON-CURABLE THERMALLY CONDUCTIVE PITUITOUS SILICONE MATERIAL 审中-公开
公开(公告)号：US20230212447A1
公开(公告)日：2023-07-06
申请号：US18005678
申请日：2020-10-28
申请人： Dow Silicones Corporation
发明人： Dorab Bhagwagar , Cassie Hale , Peng Wei , Qianqing Ge , Yan Zheng , Zhanjie Li
IPC分类号： C09K5/14 , C08K7/18 , C08K3/22 , C08G77/12 , C08G77/22 , C08G77/08
CPC分类号： C09K5/14 , C08K7/18 , C08K3/22 , C08G77/12 , C08G77/22 , C08G77/08 , C08K2003/0812
摘要： A non-curable thermally conductive material contains: (a) a matrix material containing: (i) 90 to 98 wt % of a non-functional non-crosslinked organosiloxane fluid having a dynamic viscosity of 50 to 350 centiStokes; and (ii) 2 to less than 10 wt % of a crosslinked hydrosilylation reaction product of an alkenyl terminated polydiorganosiloxane having a degree of polymerization greater than 300 and an organohydrogensiloxane crosslinker with 2 or more SiH groups per molecule where the molar ratio of SiH groups to alkenyl groups is 0.5 to 2.0; (b) greater than 80 wt % to less than 95 wt % thermally conductive filler dispersed throughout the matrix material; and (c) treating agents selected from alkyltrialkoxy silanes where the alkyl contains one to 14 carbon atoms and monotrialkoxy terminated diorganopolysiloxanes having a degree of polymerization of 20 to 110 and the alkoxy groups each contain one to 12 carbon atoms dispersed in the matrix material.

10. 发明授权

US11098196B2 Silicone composition comprising filler 有权
公开(公告)号：US11098196B2
公开(公告)日：2021-08-24
申请号：US16629978
申请日：2017-09-29
申请人： Dow Silicones Corporation
发明人： Yan Zheng , Zhongwei Cao , Don Kleyer , Tassie Andersen
IPC分类号： C08L83/04 , C08K3/013
摘要： A composition comprising: (A) an organopolysiloxane, (B) a filler and (C) a filler treatment agent, comprising a mixture of two organopolysiloxanes having the general formulas (I) and (II), R1R2R3Si—[(CH2)n1(Me2SiO)m1]r—[O-(Me2SiO)m3]p-(Me2Si)o(CH2)n2(Me2SiO)m2—(CH2)n3—Si(OR43)3 (I), wherein ‘Me’ is methyl group, R1, R2 and R3 are independently selected from an alkyl group having 1 to 20 carbon atoms, an alkenyl group having 2 to 4 carbon atoms, an alkoxy group having 1 to 3 carbon atoms or —(OSiR7R8R9), in which R7, R8 and R9 are independently selected from an alkyl group having 1 to 4 carbon atoms, R4 is an alkyl group having 1 to 4 carbon atoms, n1, n2, m1, m3 and o are integers from 1 to 200, m2, n3, r and p are integers from 0 to 200, r and p are not 0 at the same time, (R5O)3Si—[(CH2)n1(Me2SiO)m1]r—(CH2)n4—[O-(Me2SiO)m3]p-(Me2Si)o-(CH2)n2-(Me02SiO)m2—(CH2)n3—Si(OR6)3 (II), wherein R5 and R6 are an alkyl group having 1 to 4 carbon atoms, n1, m1, m3, o and n2 are integers from 1 to 200, n3, n4, m2, r and p are integers from 0 to 200, r and p are not 0 at the same time.

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