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1. 发明授权

US10268004B2 Multi-channel receiver optical sub-assembly and manufacturing method thereof 有权
公开(公告)号：US10268004B2
公开(公告)日：2019-04-23
申请号：US15869226
申请日：2018-01-12
申请人： ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
发明人： Young Tak Han , Sang Ho Park , Yong Soon Baek , Jang Uk Shin , Yong Hwan Kwon , Jong Hoi Kim
IPC分类号： G02B6/42 , G02B6/12 , G01J1/44 , H04B10/60 , G01J1/02 , G01J3/02
摘要： Provided herein are a multi-channel receiver optical sub-assembly and a manufacturing method thereof. The multi-channel receiver optical sub-assembly includes a PLC chip having a first side into which an optical signal is received and a second side from which the received signal is outputted, with an inclined surface formed on the second side of the PLC chip at a preset angle, a PD carrier bonded onto the PLC chip and made of a glass material, and an SI-PD bonded onto the PD carrier, a lens being integrated therein. The PLC chip, the PD carrier, and the SI-PD are passively aligned by at least one alignment mark and then are bonded.

2. 发明授权

US09411097B2 Optical module 有权
标题翻译：光模块
公开(公告)号：US09411097B2
公开(公告)日：2016-08-09
申请号：US14727751
申请日：2015-06-01
申请人： ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
发明人： Young Tak Han , Sang Ho Park , Yong Soon Baek , Jang Uk Shin
IPC分类号： G02B6/12 , G02B6/36
CPC分类号： G02B6/12019 , G02B6/4251 , G02B6/4279
摘要： Provided herein is an optical module including an optical bench having a first step with a first depth and a second step with a second depth that is smaller than the first depth; a silicon carrier disposed above the first step, and where at least one semiconductor chip is installed; an AWG chip (Arrayed Waveguide Grating chip) secured to the second step, extends up to the first step, and is chip-to-chip bonded with the silicon carrier above the first step; a lens disposed on an upper surface of the optical bench where the first step and the second step are not formed; and a metal package surrounding the optical bench, silicon carrier, AWG chip and lens, wherein at one side of the metal package, a double slit that includes an upper slit and a lower slit are formed, a DC FPCB (Direct Current FPCB) extends from outside towards inside the metal package through the upper slit and is secured to a support formed on an inner surface of the upper slit, and an RF FPCB (Radio Frequency FPCB) extends from outside towards inside the metal package through the lower slit and is secured to an upper portion of the silicon carrier, and the upper slit and the lower slit of the double slit being sealed by an elastic epoxy.
摘要翻译：本文提供了一种光学模块，其包括具有第一深度的第一步骤和具有小于第一深度的第二深度的第二步骤的光学台架; 设置在所述第一台阶上方的硅载体，并且其中安装有至少一个半导体芯片; 固定到第二步的AWG芯片（阵列波导光栅芯片）延伸到第一步，并且在第一步骤之上与硅载体进行芯片到芯片的接合; 透镜，设置在光学台的上表面，其中没有形成第一步骤和第二步骤; 以及围绕光学台，硅载体，AWG芯片和透镜的金属封装，其中在金属封装的一侧形成包括上缝和下缝的双缝，DC FPCB（直流FPCB）延伸从金属包装的外部通过上部狭缝固定到形成在上部狭缝的内表面上的支撑件上，并且RF FPCB（射频FPCB）通过下部狭缝从外部向金属包装内部延伸，并且是固定到硅载体的上部，双缝的上缝和下狭缝由弹性环氧树脂密封。

3. 发明授权

US09927484B2 Radio frequency probe apparatus 有权
公开(公告)号：US09927484B2
公开(公告)日：2018-03-27
申请号：US15193667
申请日：2016-06-27
申请人： ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
发明人： Oh Kee Kwon , Young Tak Han , Ki Soo Kim , Su Hwan Oh , Chul Wook Lee , Young Ahn Leem
IPC分类号： G01R31/302 , G01R31/265 , H01L21/66 , H01L23/66 , H01L23/00 , H01L23/535 , G01R1/07
CPC分类号： G01R31/2656 , G01R1/06772 , G01R1/07 , G01R31/2635 , H01L22/32 , H01L23/535 , H01L23/66 , H01L24/05 , H01L24/45 , H01L2223/6611 , H01L2223/6627 , H01L2223/6655 , H01L2224/04042 , H01L2924/00014 , H01P3/00 , H01P5/085 , H01S5/0014 , H01S5/0427 , H01L2224/45099
摘要： Provided herein is a radio frequency probe apparatus including a RF waveguide including a ground electrode and a signal electrode, a register connected to the signal electrode, a RF connector including an outer conductor connected to the ground electrode, an inner conductor connected to the signal electrode, and a dielectric body filling a portion between the outer conductor and the inner conductor, and a single tip probe connected to the signal electrode of the RF waveguide, or the register.

4. 发明授权

US09904023B2 Multi-channel receiver optical sub-assembly and manufacturing method thereof 有权
公开(公告)号：US09904023B2
公开(公告)日：2018-02-27
申请号：US15203737
申请日：2016-07-06
申请人： ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
发明人： Young Tak Han , Sang Ho Park , Yong Soon Baek , Jang Uk Shin , Yong Hwan Kwon , Jong Hoi Kim
IPC分类号： G02B6/42 , G01J1/44 , G02B6/12 , H04B10/60 , G01J1/02 , G01J3/02
CPC分类号： G02B6/4224 , G01J1/0209 , G01J1/44 , G01J3/0259 , G01J2001/444 , G02B6/12019 , G02B6/4239 , G02B6/4257 , G02B6/4279 , G02B6/4281 , H04B10/60
摘要： Provided herein are a multi-channel receiver optical sub-assembly and a manufacturing method thereof. The multi-channel receiver optical sub-assembly includes a PLC chip having a first side into which an optical signal is received and a second side from which the received signal is outputted, with an inclined surface formed on the second side of the PLC chip at a preset angle, a PD carrier bonded onto the PLC chip and made of a glass material, and an SI-PD bonded onto the PD carrier, a lens being integrated therein. The PLC chip, the PD carrier, and the SI-PD are passively aligned by at least one alignment mark and then are bonded.

5. 发明授权

US09893810B2 Receiver optical module 有权
公开(公告)号：US09893810B2
公开(公告)日：2018-02-13
申请号：US15133945
申请日：2016-04-20
申请人： ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
发明人： Seo Young Lee , Young Tak Han , Jong Hoi Kim , Joong Seon Choe , Chun Ju Youn , Hyun Do Jung
IPC分类号： H01L31/0232 , H04B10/25 , G02B6/00
CPC分类号： H04B10/2504 , G02B6/00 , G02B6/4249 , G02B6/4279
摘要： There is provided a receiver optical module including a photodetector having a plurality of channels, a capacitor disposing block formed on an upper portion of the photodetector, a plurality of capacitors formed on the capacitor disposing block, and an electrical wiring configured to connect the plurality of capacitors to electrodes of a plurality of channels of the photodetector, wherein the plurality of capacitors are formed on the capacitor disposing block such that distance between the capacitors and the electrodes of the corresponding channels are the same. Distortion and loss of signal characteristics of high frequency can be reduced and quality of a signal can be enhanced.

6. 发明授权

US09711939B2 Semiconductor optical device 有权
公开(公告)号：US09711939B2
公开(公告)日：2017-07-18
申请号：US15241362
申请日：2016-08-19
申请人： ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
发明人： Dong Hun Lee , Sang Ho Park , Yong Soon Baek , Jang Uk Shin , Young Tak Han
IPC分类号： G02B6/12 , H01S5/22 , H01S5/026 , H01S5/00 , H01S5/343 , G02F1/017 , G02B6/14 , G02B6/122 , G02F1/015
CPC分类号： H01S5/026 , G02B6/12004 , G02B6/1228 , G02B6/14 , G02B2006/12097 , G02F1/01708 , G02F2001/0157 , H01S5/0064 , H01S5/0085 , H01S5/0265 , H01S5/1014 , H01S5/12 , H01S5/2223 , H01S5/227 , H01S5/3235 , H01S5/343
摘要： Provided herein is a semiconductor optical device, including a waveguide including lattices buried therein and having a buried hetero (BH) structure formed in an optical oscillation region in which single mode light is oscillated, a waveguide having a deep ridge structure formed in an optical modulation region, and a passive waveguide formed in a mode transition region interposed between the optical oscillation region and the optical modulation region, formed as a connecting structure of the waveguide having the BH structure extending from the optical oscillation region and the waveguide having the deep ridge structure extending from the optical modulation region, and inducing evanescent optical coupling, wherein a width of the waveguide having the BH structure in the mode transition region is smaller than a width of the waveguide having the deep ridge structure in the optical modulation region.

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